The lhcb outer tracker front end what does it look like and what is the status
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The LHCb Outer Tracker Front End, what does it look like and what is the status. A Collaboration of: Nikhef Heidelberg Krakow Warsaw Beijing. Talk for the LHCb Electronics Working Group 5-2-2003/TS. What part is on the Detector. TDC L0 Buffer. L1 Buffer. DAQ. ASD. ~100m. 50 fC. bias.

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The LHCb Outer Tracker Front End, what does it look like and what is the status

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The lhcb outer tracker front end what does it look like and what is the status

The LHCb Outer Tracker Front End,what does it look like and what is the status

A Collaboration of:

NikhefHeidelbergKrakowWarsawBeijing

Talk for the LHCb Electronics Working Group 5-2-2003/TS


What part is on the detector

What part is on the Detector

TDC

L0 Buffer

L1 Buffer

DAQ

ASD

~100m

50 fC

bias

L0 BX

L1

chamber

counting room

GOL

The Front End on the detector

HV

LV

TFC

ECS

Cooling

Electronics Service Box


Inside of a straw module prototype

Inside of a straw module prototype

Straws without alu outside

Alu shielding

Gas volume Feedtrough Board


Feed trough board grounding and shielding

Feed-trough board grounding and shielding

Chamber Feed-trough board (gas tight by gluing)

Faraday cage Shielding alu foil inside chamber box

wire

Alu straw wall for crosstalk shielding

And transmission of fast signals

Aluminum connection developments

Aluminum soldering after copper plating not reliablecan be pulled of.


Grounding and shielding of the critical detector sensor part

Grounding and shielding of the critical detector sensor part

  • Alu straw wall for crosstalk shielding And transmission of fast signals

  • Soldering of all alu parts to end PCB

Alu coating shield

Kapton foil for gas tightness

Conductive Kapton (for aging protection)

Gas

GLUE (isolating)

Alu coating shield

ALU

Kapton foil for gas tightness

Carbon / epoxy plates

Air filled material


Tight packing of 4 module layers in 1 station demands packed electronics and cooling

Tight packing of 4 module layers in 1 station demands packed electronics and cooling

Module

Module

Module

Gas

HV

TFC

Water

LV

ECS

DATA-out

4 cm

25 cm

Module


Mechanical model of detector electronics without shielding box

Mechanical model of detector electronics without shielding box


Dissipation and cooling

Dissipation and cooling

- Airco hall can cool only 80 kW in total, so no dumping in hall !

-our Detector electronics Heat production = 10-15KW

- if using air cooling should be closed circuit with water coolerBut air gives dust on HV boards

-Water cooling ok for HV board leakage currents, if above dewpoint (13 degr garanteed?)


The detector electronics box

The Detector Electronics box

cooling plates and blocks

Outside box

cooling bar

plates of shielding box

module support bar

Feed-through board


The boards inside the box

The Boards inside the box

X 1

GOL/Aux Board

  • Front-end cards:

  • have to fit inside a closed metal shielding box: 22 x 30 x 4 cm

  • excellent ground connection to straw-tubes and module reference ground

  • power dissipation of cards is about 25 W / box → water cooling

  • easy access should be maintained

TDC boards

X 2

ASD boards

HV boards

X 4

X 8


Hv boards

HV boards

eventual. used as fuse

R=1.1MΩ

C=300pF

Capacitors:

JOHANSON 302R29W331KV4E

Max. Volt.: 4kV

Size: 5x4x2 mm3

32 channels per board

Capacitors embedded in PCB:Company xyz in GB


Results hv board tests

Results HV Board tests

We want much less then 50 on 50000 channels broken, less then 0.1%

With 32 caps in a board we have to throw away too much.

Must be reliable over the years.

Thorough testing and thermal cycling needed

HV caps Johanson come tested to 4KV

Typical need 1500V

RESULTS UPTO NOW:

-14 days tested at 2.5 KV: 1 “shorted capacitor 100k ohm”

then high current burnout, then sawn open, noting to see

After this 14 days cycling from 25 to 65 degr C

1 open connection, broken by stress? Still to be investigated.

Further investigation needed

Second revision will be made


Asdblr boards

ASDBLR boards

Older prototype (98) with asdblr,

HV caps, and regulators on backside,

No tdc yet

ASDBLR chip:

ATLAS DMILL version


Otis card

OTIS card

  • TDC board:

  • radiation hard OTIS TDC chip

  • provides bias voltage for ASD

  • power rooting for ASDBLR card

  • test pulses for ASDBLR


Gol aux card the interface to the outside world

GOL/AUX CARD the interface to the outside world


Conclusion

Conclusion

  • Design: what we want seems clear. (in collaboration)

  • Pre-designs have done well in beam-tests in 1998-2000

  • Detector Electronics still to be finalized

    • Cooling construction, prototype boards, pre-production boards

  • Some parts already in Mass Production Ordering

    • ASDBLR (with ATLAS)

    • RAD hard regulators

    • TTC components TTCrx

    • GOL


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