Template HTA General Assembly November 12 – 13, 2013

1. Template HTA General Assembly November 12 – 13, 2013

2. Contact: christophe.billard@cea.fr Project Idea: RF MEMS SWITCH TECHNOLOGY FOR SPACE APPLICATIONEU call: ESA Project Idea short description HTA common proposal for ESA call aiming at selecting best RF MEMS switch process in Europe Short Description: → benchmark RF MEMS suppliers with a common standardized procedure → select the optimum RF MEMS switch process for further reliability testing → prepare it for further space qualification Potential Applications: Space, defense, telecom Potential Consortium/Competences needed: RF MEMS switch process Hermetic packaging Reliability testing, Space qualification

3. Contact: christophe.billard@cea.fr Project Idea: RFID Acoustic SensorsEU call: H2020 Project Idea short description Wireless battery free sensor system for harsh environment Short Description: → Lamb wave sensors enabling measurements of pressure, temperature, viscosity, or humidity → Operation in harsh environment (T°>600°C) and eventually in liquids → Develop packaged RFID sensor modules and their interrogation system Potential Applications: automotive, medical, industry, space, aeronautic … Potential Consortium/Competences needed: Process bricks for harsh environment (electrodes, packaging…) RFID (reader, antenna) System deployment (monitoring software, tag identification) Acoustic technology (Lamb wave, SAW, BAW)

4. Contact: christophe.billard@cea.fr Project Idea: Flexible self-powered RFID sensor tagEU call: H2020 Project Idea short description Flexible sensor tag with integrated energy harvester Short Description: → shape memory alloys (SMA) can detect and harvest from temperature variation → Magnetostrictive materials detect and harvest from a movement (moving magnet) → Idea is to build flexible sensor tag which can detect an event and harvest energy to send the information or write in an embedded memory Potential Applications: traceability in medical, food, industry… Potential Consortium/Competences needed: Flexible technology (encapsulation, memory) RFID (reader, antenna) System deployment (monitoring software, tag identification) Materials for harvester/sensor (SMA, magnetostricitve)

5. Contact: yann.lamy@cea.fr Project Idea: OPEN3D EU call: Other initiatives Idea short description: Provide an European complete 3D & packaging integration platform Short Description:Open 3D™ is a CEA LETI 3D technology offer, targeting industrial (SMEs) & academic customers: 3D mature technologies, no NRE, short cycle time, 200 mm & 300 mm, Global offer from 3D design to component final packaging. Possibility to make proof-of-concept, prototyping & small volume production Potential Applications: niche market for 3D: Space, defense, telecom, fundamental physics (CERN…) Competences needed: Testing Reliability Balling, stacking & packaging Wafer-level TSV-last and RDL process

6. Contact: Patrick.leduc@cea.fr Project Idea: 3DIC thermal managementEU call: H2020 Project Idea short descriptionThermal Management with microfluidic / High performance computing (HPC) Short Description: Ambitious µ-fluidic project for HPC. Investigation innovative new fluidic compound thermal evacuation in micro-cooling channels in silicon interposers. New nanofluids synthesis and modelling, interposer fabrications, Test & validation Potential Applications: HPC, servers, micro-servers, particle physics detection Potential Consortium/Competences needed: - New fluid synthesis and fabrications / simulation modeling - µ-channels fabrication, Si interposer, Si-si bonding at CEA LETI - strong expertise on fluidic connectors (e.g: CSEM) 10-100µm channels in silicon – LETI examples

7. Contact: Yann.lamy@cea.fr Project Idea: 4-side buttable 3D detectorsEU call: H2020 Project Idea short description3D integration for particles physics & medical imaging • Short Description: realize a generic 3d technology for 4-side buttable ultra fine pitch detectors for particle physics and/or X-rays • Start with 130-nm existing ROIC • Prepare the 65nm shift with ultra fine pitch TSV • Large surface bow/warp management of thin modules • Compliant and high yield 2nd level interco for flip chio • Strategy for high yield assembly and pre-industrialization • Potential Applications: • Large area particle detection, / X-rays detection •  HEP, medical, X-rays cristallography, synchrotron • Improvement of sensitivity / reduction Idark • Potential Consortium/Competences needed: • TSV fabrication (last/middle), thin module hanlding, fine pitch interco, bumping and report capabilities Dead zone free detection Courtesy from Advacam

8. Contact: Yann.lamy@cea.fr Project Idea: 3D Silicon and smart system on foil for medicalEU call: H2020 Project Idea short descriptionHeterogeneous smart system on flexible foils Short Description: Merge 3D silicon electronics for high speed/freq. with electronics on foils, development of integrated interconnects and packaging/encapsulation solutions in order to ensure enhanced durability of these heterogeneous smart systems. First levels of intelligence with passives components and organic thin film transistors, and biocompatible coating. Potential Applications: Medical applications, health patch, telemonitoring, wireless communications, biosensors (glucose, spO2, T°C…) Potential Consortium/Competences needed: Foil manufacturers, compliant and stretchable intercos, ultra thi si interposers, passives en foils, thermomechanical modeling, reliability and test LETI, LITEN, VTT. Medium to high 3D interco + multiple sensors User frinedly durable and flexible packaging Foil-on-foil to multifoils interco On foil and si to foil intercos

9. Contact: Yann.lamy@cea.fr Project Idea: Glass hermetic biocompatible packaging for medical implantsEU call: H2020 Project Idea short descriptionHighly integrated medical implantable sensors Add-on: Integratedhumiditysensor - Antenna • Short Description: realize a full transparent biocompatible and hermetic glass packaging for System-in-Package for medical implants • Glass process investigation (etching, thining) • Heterogeneous assembly • Hermetic sealing • In vitro testing • Potential Applications: • Medical implants: cardiac probes, neural probes, • Potential Consortium/Competences needed: • Sensors development, glass interposer development, hybridation rdie report, Through-glass-Vias, glass thinning and handling • Biocompatibility evaluation Cavity in glass Glass cap Ex: hermeticsealing SiO2/SiO2, Au/Au, Au/Si, Au/Sn… IC Chip MEMS Ultra-thin package < 750µm 3D vertical electricalconnection. Through Glas Via (TGV). Glass interposer Biocompatible electrical pads: 3D printing or ECD <2mm

10. Contact: lea.dicioccio@cea.fr Project Idea: ultra large interposer for HPC/data serversEU call: H2020 - LEIT Project Idea short description: « ultra large and fine pitch Si interposer : from simulations to fabrication  » Short Description: Stress monitored ultra large ( >5cm) Si interposer realization with possibility of fine pitch interconnect (<10 µm). Simulation: -stress and layer compensation. - DRM for direct copper bonding on TSV fine pitch. -Thermal dissipation simulation. Demonstrator realization. Smart interposer? ( open to consortium proposals) Potential Applications: 3D interposer fine pitch for HPC , Leds, power devices, 3D devices. Potential Consortium/Competences needed: LETI (CNRS SIMAP , IMP Bordeaux) : interposer process, top die post process, simulation Partners for : demonstrator design and characterization, design/fabrication or supply of top dies thermo-mechanical material behavior expertise, characterization,., other proposals?

11. Contact: didier.bloch@cea.fr Project Idea short description: Development of a « TOBIC » 3D failure analysis tool Project Idea: advanced non destructive failure analysis EU call: H2020 (“STREP”-preferred) • Short Description: • Problem to be solved: submicronic failure detection in buried layers (TOBIC offers additional informations compared to existing techniques, and allows a better resolution) • → Principle: Two-Photon Optical Beam Induced Current (TOBIC) • → Electrical analysis of signal produced by carriers optically injected in the layers • → Objective of the project: design and fabrication of a “demonstrator” equipment adapted to various market segments • Potential Applications: • Detection of crystalline defects, doping modifications, interco failures, 3D-imaging of defects… • 3D reliability, package in package, WLP, MEMS… • Potential Consortium/Competences needed: • Industrial partners: TEEM Photonics (Equipment Manufacturer, coordinator, F), SERMA (Characterization Service provider, F), equipment end-user (Foundry? tbd), image reconstruction (tbd), low current detection instrumentation (tbd) • Academic partners: Grenoble Univ. IMEP-LAHC (F), understanding of materials-laser interaction (tbd) • HTA partners :CEA-LETI, image reconstruction (FhG?), Cross X-Ray analysis (CSEM?)…(?)

12. Contact: Yann.lamy@cea.fr Project Idea short description: Development smart interposer with metamaterials for millimeter wave mmW applications Project Idea: Metamaterials for mmW SiP packagesEU call: H2020 LEIT • Short Description: • Integration and packaging of heterogeneous SiP for mmW applications. • Integration of the mmw antenna directly on an interposer (Si or organic) • Replacement of the reflector by 3D metamaterials • Subwavelength cavity reduction, (~l/50 ), •  Ultra directive antenna • Goals: improve diminution of package footprint • Costs, and antenna performances • Potential Applications: • Wireless 60 GHz high data rate applications • Automotive radar 77GHz • Imaging 100-120 GHz • Potential Consortium/Competences needed: • Mmw heterogeneous electromagnetic simulations • Si/organic interposer fabrications, 3D integration: TSV, intercos • Reliably assembly and wafer level packaging • RF/mmw anechoic testing, 100 GHz High Impedance Surface Metamaterials Antenna PCB