Template
This presentation is the property of its rightful owner.
Sponsored Links
1 / 3

Template HTA General Assembly November 12 – 13, 2013 PowerPoint PPT Presentation


  • 70 Views
  • Uploaded on
  • Presentation posted in: General

Template HTA General Assembly November 12 – 13, 2013. Contact : Fraunhofer ENAS [email protected] Phone: +49-371-45001 412 / 220. Project Idea: Reliability Assessment with Qualified Material Data Sets EU Call: e.g. ICT Calls in LEIT ( e.g . ICT1-3), photonics KETs.

Download Presentation

Template HTA General Assembly November 12 – 13, 2013

An Image/Link below is provided (as is) to download presentation

Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author.While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server.


- - - - - - - - - - - - - - - - - - - - - - - - - - E N D - - - - - - - - - - - - - - - - - - - - - - - - - -

Presentation Transcript


Template hta general assembly november 12 13 2013

Template

HTA General Assembly

November 12 – 13, 2013


Template hta general assembly november 12 13 2013

Contact:Fraunhofer ENAS

[email protected]

Phone: +49-371-45001 412 / 220

Project Idea: Reliability Assessmentwith Qualified Material Data SetsEU Call: e.g. ICT Calls in LEIT (e.g. ICT1-3),photonicsKETs

Project Idea short description:

Reliabilityalignedtechnologydevelopmentfor highlyminiaturizedproducts (MEMS, ICs, photonics, )

  • Short Description (ref. to the reliability part):

  • Challenging reliability assessment (manufacturing process & endurance) by physics of failure approaches (main obstacle for micro / nano scale components - used input data sets for FEA)

  • measurement of material properties from components as manufactured (new techniques, e.g. FIB based)

  • advanced validation strategies for complex material behavior and/or data sets of material property

  •  demonstration of improved failure avoidance strategies by accompanying process/product developm.

    IP situation and commercial viability:

  • Finite Element Analysis (FEA) is increasingly substantial part of process and device development

  • most limiting factor for FEA reliability assessment – quality of input data set (material properties, stress)

  • Potential Applications:

  • devices / systems with thin films / film stacks / micro&nano scale structures (e.g. BEoL stacked IC,

  • 3D integration systems, sensors, smart systems, photonics systems)

  • Potential Consortium/Competences needed:

    Firm 1: manufacturers of systems with dedicated need for accompanying failure avoidance analysis

    Firm 2: testing tool manufacturer

    RTO: material characterization (mechanical properties), device and system testing


Template hta general assembly november 12 13 2013

Ni layer

BEoL stack region

PI layer

Underfill

HMT solder

gap

Soldermask

LJT solder

Boardpad

Berkevitchindenter

Local residual stress

measurement

by FIB milling

 Area influencedby

the Si substrate

Failure avoidance

by appropriate

design rules

Local material

properties


  • Login