1 / 8

APV25 hybrid for SVD2.5

APV25 hybrid for SVD2.5. 19 Jan 2005 (Rev. 26 Jan 2005) T. Tsuboyama (KEK). Design principle. Dimension should be same as that for SVD2 hybrid. 27.0 mm x 62.3 mm Similar or less cable size. Unfortunately,. APV25 chip size is much larger than VA1TA

Download Presentation

APV25 hybrid for SVD2.5

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. APV25 hybrid for SVD2.5 19 Jan 2005 (Rev. 26 Jan 2005) T. Tsuboyama (KEK)

  2. Design principle • Dimension should be same as that for SVD2 hybrid. 27.0 mm x 62.3 mm • Similar or less cable size.

  3. Unfortunately, • APV25 chip size is much larger than VA1TA • “The size of the APV25-S1 chip (not including scribe channels) is 8055 x 7100 square microns.” • Pad pitch 44 um • VA1TA  9280x6120 um. • Pad pitch 45.6 um. • Power supply and ground pads are mixed in input pads.

  4. Consequence • Hybrid width should be somewhat larger. • Can this be compatible with SVD2 design? 30.0 27.0 6.4 62.3

  5. Power consumption (catalog) • APV manual: • Nominal 2.3 mW/ch or 0.29W/chip • VA1TA catalog: • 0.144 W/chip (from the table below) • In reality 4mW/ch or 0.5W/chip

  6. 26 Jan 2005 ladder design (I) • Close look at the L1 ladder and support • The hybrid width is wider by 3 mm on both side. • They looks like to fit the structure. However….

  7. 26 Jan 2005 ladder design (II) • L1 hybrid and L2 DSSD can interfere at one edge. • 1.5 mm excess on each edge is still very tight. • Hybrid / ladder has to be asymmetric to avoid the touch.

  8. Summary • APV2.5 chip is wider than VA1TA and hybrid width should be larger by 3 mm. • If hybrid is symmetrically widened, L1 hybrids and L2 DSSD will interfere. • New L1 ladder will be asymmetric. • We do not know the real heat dissipation of the hybrid. Catalog value may be too small.

More Related