Research Interest Reliability of “ green ” electronic systems Nano-based Pb-Free Technology

1. Dr. Aleksandra Fortier Assistant Professor Email:Aleksandra.Fortier@unt.edu • Research Interest • Reliability of “green” electronic systems • Nano-based Pb-Free Technology • Processing, characterization, and defects ID of Pb-Free electronic materials and components • Metal and alloy based electroplating processes • Sn whisker phenomenon • Numerical analysis and simulation of residual stresses in thin films • Residual stress analysis using X-Ray Diffraction Technologies • Polymer and metal based composite materials • Aerosol Jet Printing Techology

2. Development of Novel Technique for Mitigation of Sn Whiskers Growth in Electronics Sn Ni Sn Ni Brass substrate 10µm Sn Film Brass-substrate 5µm Growth of Sn Whisker over time on the surface of Sn film Microstructure of Electronic Component coated with Pure Sn Film 20µm Microstructure of Electronic Component coated with Composite Ni/Sn Film Whisker free Electronic Component with composite film

3. Residual Stress Measurements in Thin Films Using XRD Technology 3mm Inside Set-up

4. Principles of Residual Stress Analysis with XRD Direction of Stress Measurement Physical Set-up of the XRD Position of Angles Strain Calculation Bragg’s Law

5. Advantages of Novel Technique for Mitigation of Sn Whiskers Growth Non-uniform compressive residual stress distribution in Electronic Component coated with Pure Sn Film (captured with XRD) Distribution of uniform tensile stress in Electronic Component coated with composite film (captured with XRD) • Advantages of Composite Plating • Uniform stress distribution in the film over time • Whisker -free Components • Uniform microstructure • Minimize likelihood of electronic systems failure

6. Simulation Analysis of Residual Stress Development in Thin Films t=0.00012” Model 2 Model 1 Model 3

7. Residual Stress Results in Thin Films using ANSYS Software Tool Stress Distribution in Thin Film Stress Distribution in Composite Thin Film Cross section of Model Cross section of Model

8. Development of Functional Components using Aerosol Jet Printing Technology • Components developed from nano to micro scale in size • Thin Layer Deposits from 100 nm • Variety of materials and substrates can be used • Material viscosities from 1- 1,000 cP • Nanomaterial Deposition Capability • Non-planar Capability • Flexibility for researchers to define specific application • Low Temperature Processing • Wide range of applications • 3D Electronics • Alternative Energy • Biomedical Applications • Displays Sensors • Metal Components • Components Repair • Medical Implants • Hybrid Manufacturing Equipment

9. Improved product performance • Improved manufacturing process • Amount Controlled Deposition • No need for post processing • Reduced Materials and Manufacturing Costs • Reduced Process Time Benefits From Research Results Economical & Environmentally clean process • Data –driven • Printing pattern created in CAD • Flexible shapes