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Start of the tracker construction in Italy: flight sensors and ladder testing. Luca Latronico. Tracker construction roadmap. Tower Structure (walls, fasteners) Engineering: SLAC, Hytec Procurement: SLAC. SSD Procurement, Testing Japan, Italy, SLAC. SSD Ladder Assembly Italy.

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Presentation Transcript
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Start of the tracker construction in Italy:

flight sensors and ladder testing

Luca Latronico


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Tracker construction roadmap

Tower Structure (walls, fasteners)

Engineering: SLAC, Hytec

Procurement: SLAC

SSD Procurement, Testing

Japan, Italy, SLAC

SSD Ladder Assembly

Italy

Tower Assembly and Test

SLAC (2)

Italy (16)

10,368

2592

Tray Assembly and Test

Italy

342

18

Electronics Design, Fabrication & Test

UCSC, SLAC

648

Composite Panel & Converters

Engineering:

SLAC, Hytec, and Italy

Procurement: Italy

Cable Plant

UCSC




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SSD storage and handling

1484 SSDs (~14% of total) received so far

  • SSD come in vacuum sealed boxes

  • Boxes are stored in a clean room

  • Clean room class during operation was between 1000 and 10000

  • (thanks to observation of strict regulations, e.g. mandatory disposable

  • coat, hat, overshoes, gloves, face mask)

  • SSD are flushed in N2 when boxes are open

  • Vacuum pens are used for SSD handling

  • SSD exit clean room after a new vacuum seal

  • Every process step in registered in a DB


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SSD and Tracker Construction DB

see www.pi.infn.it/glast for full documentation on construction DB

  • discussion with tracker institutions (SLAC, UCSC, Hiroshima)

    started around one year ago

  • guidelines documents produced (e.g. LAT-TD-00376, LAT-TD-

    00384)

  • working protoype developed and used in Pisa

  • continuous vital interplay between DB development –

    measurements requirements in the clean room – statistical

    analysis of data – data transfer between manufacturers and

    institutions

  • all results shown were produced using our DB

  • finally publish DB and analysis tool on the web for LAT managers

    to use


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Analysis of data from HPK

  • HPK provides:

  • at batch level - from an SSD taken at sample in the batch, min, max, avg

  • values of the following:

    • strip bias resistor

    • strip coupling capacitance

    • strip resistance

  • at single SSD level:

    • IV scan 0-200V (Ileak is I measured at 150V)

    • CV scan 0-200V (Cbulk is C at 150V)

    • Vdep – defined as V where F(V) - F(V-5) < 0.0039, with F=1/C2[nF]

    • bad strips ID and defect type

Currently working on a common DB, in collaboration with HPK engineers to maximize data transfer efficiency


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Analysis of data from HPK

see www.pi.infn.it/glast/database/dbmain.html for full report

Ileak specs:

I < 600nA single SSD

I < 200nA averaged on 100 SSD

Stdev(Cbulk) ~ 2 mm

all within specification


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Analysis of data from HPK

see www.pi.infn.it/glast/database/dbmain.html for full report

Vdep specs:

V <150V

Chans specs:

Bad chans rate < 0.2%

< 3/single SSD

still two clusters of bulk resistivity but most SSD stand at the preferred higher values

all within specification



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SSD Pisa clean room measurements

see www.pi.infn.it/glast/lattd/ssd_insp_proc.doc (LAT-TD-00454)

  • Electrical

  • strips (p+) grounded / back plane (n) at variable V(+)

  • use calibrated instrumentations (Vsource,p-ammeter,LCR)

  • read through GPIB/LabView

  • data can upload DB automatically

CV scan 0-200V

Cbulk at 150V

Vdep with:

2 fit intersection

HPK definition

IV scan 0-200V

Ileak at 150V





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SSD clean room measurements

see www.pi.infn.it/glast/lattd/ssd_insp_proc.doc (LAT-TD-00454)

Geometrical

  • pixel/mm calibration on

  • reference cross

  • measure distance of

  • reference cross centre

  • to X and Y edge (all

  • corners, DXA,DYA,DXB…)

  • cut alignment evaluated

  • with:

Shift= (DyA+DyD)/2

Rotation=DyA-DyD


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SSD geometrical measurements: data analysis

distribution stdev compatible with experimental error


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Ladders qualification

see www.pi.infn.it/glast/lattd/lad_ass_meas.doc(soon LAT-TD … )

  • Currently qualifying two suppliers

  • G&A Engineering

  • MIPOT

    Ladders assembled with flight sensors and final tools

Alignment

Glueing


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Ladders qualification

SSD alignment check


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Ladders qualification: mechanics

  • bonding pull strength between 6-9 gr. (measured at Mipot)

  • bonding encapsulation (at G&A):

dam (3M Scotchweld 2216 A/B )

+ fill (General Electric 615)

pure epoxy

(3M Scotchweld 2216 A/B)

both good but more experience with dam&fill


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Ladders qualification: leakage current

Long term test started: observed steady current increase of

~40 % in first 12 hrs.



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Conclusions

  • Flight sensors testing proceeds at full speed :

  • primary activity of the whole italian collaboration

  • involves people from all institutions

  • goes on everyday for 8 hrs. (electrical) + 4 hrs. (geometrical)

  • already at maximum speed for electrical (20min/SSD)

  • possible little speed up for geometrical (now 12min/SSD) if images

    are automatically processed

  • still some room for optimization in data transfer to DB from

    electrical and geometrical measurements setups

  • new requirements from data analysis and data transfer every day –

    big impact on DB development

  • Ladder qualification:

  • two manufacturers involved in the process

  • both gave successful results


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