1 / 33

Course Tutor Dr R E Hurley

Semiconductor Device and Processing Technology. Course Tutor Dr R E Hurley. Northern Ireland Semiconductor Research Centre School of Electrical & Electronic Engineering The Queen’s University of Belfast. Semiconductor Device and Processing Technology. 5 . Processing in the real world.

zenia
Download Presentation

Course Tutor Dr R E Hurley

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Semiconductor Device and Processing Technology Course Tutor Dr R E Hurley Northern Ireland Semiconductor Research Centre School of Electrical & Electronic Engineering The Queen’s University of Belfast

  2. Semiconductor Device and Processing Technology 5. Processing in the real world. ‘Front-end’ and ‘Back-end’ Wafer Fab. Industrial Wafer Fab. Research Lab. A look at the equipment

  3. The Chip-making Process

  4. The ‘Wafer Fab’ (The Front-end processes) • Fabrication - a series of 16-24 (?) loops, each puts a layer on the device. A loop comprises some or all of the major steps of photolithography, etch, strip, diffusion, ion implantation, deposition, and chemical mechanical planarization. • Inspections and measurements performed to monitor the process and equipment at every stage.

  5. The ‘Wafer Fab’ (The Front-end processes) • Supporting the entire process is a complex infrastructure of materials supply, waste treatment, support, logistics,and automation. • Cleanest environment in the world - many times cleaner than the best hospital operating theatre. • A state-of-the-art Fab, costing over $1 billion (+?), has a denser capital per square foot than any industry.

  6. The ‘Wafer Fab’ (The Back-end processes) • The “Back-end" is Test, Assembly and Packaging. • Finished wafer is split up into individual die (chips) • Assembled into packages which can be handled in the final applications. • Full functional electrical test is performed at both wafer and package level to ensure outgoing quality.

  7. A typical University Research ‘Fab Lab’.

  8. Main Fab Lab at QUB, Belfast UHV Cluster tool ‘Clean’ measurements Cleaning & wet chemistry Furnaces Photolith

  9. Entering and leaving the cleanroom

  10. More about processes- Furnaces Tube 1: Diffusion. Tube 2: Annealing. Tube 3: oxidation. Tube 4: Special! Quartz tubes surrounded by heaters carefully designed to maintain even heating along length (regular calibration needed!) Bruce Furnace Bruce Industrial Inc.

  11. More Furnaces Tempress (QUB) Tube 1: Diffusion. Tube 2: Annealing. Tube 3: Oxidation. Tube 4: Smart-cut ASM (QUB)

  12. Rapid thermal anneal (RTA) • Halogen lamps surround the wafer and deliver a heat-pulse to reform silicon lattice. • The method controls the ‘thermal budget’. • Dopant-diffusion controlled in depth. Nitrogen or vacuum environment. QUB systems made in University.

  13. QUB system for high purity Si/SiGeepitaxy (B doping)

  14. Deposition- CVD Plasma Enhanced Chemical Vapor Deposition (PECVD) PlasmaLab Model DP800 SiO2, SiOxNy, and Si3N4films.

  15. Deposition- CVD UHV for high purity (SiGe, copper) Cluster tool 3 chambers fed by ‘dealer arm’ with load-lock to load 150mm wafers Main central chamber

  16. Deposition- CVD UHV for high purity (SiGe, copper) Overhead gas-box Satellite chambers

  17. Gas-box fittings for UHV CVD system

  18. Processes – Plasma Etching • Planar Etch II (PE2) is a parallel-plate plasma etcher. O2 used to ash organic contaminants.(e.g. remove hardened photoresist • For SU-8 5: • 200 W, 10 sccm O2 flow : 300 nm/min)

  19. Processes – Dry Reactive Etching Reactive Ion Etcher Anelva RIE DEM-451 Anelva Corporation STS

  20. Processes - Etching Trion RIE/ICP - (Trion Technology Minilock Phantom III RIE/ICP) Inductively coupled plasma (ICP) RF → lower pressure, higher etch-rate, higher anisotropy (straighter sided trenches)

  21. Baking and curing processes need ovens Clean Oven Model: Ultra-Clean 100 (3497M-3) Manufacturer: Lab-Line Instruments Photoresist, dehydration, spin-on-glass. 250-3000C max, with 1.50C uniformity Fisher Isotemp Vacuum Oven Model 281 Max temperature 300 C Minimum Pressure -92 kPa

  22. Cleaning station with spin-dry and bonder QUB Spin-dryer Wafer bonder Ultrasonics

  23. Spin-dryer (close-up)

  24. Wet chemical bench Fume extraction Perspex cover Acids! HF, nitric etc.

  25. Film thickness measurement EllipsometerGaertner Scientific Corporation Model No. 1169-AK Thickness and index of refraction for thin dielectric films

  26. Metrology (measurements) Four probes that can serve as voltage sources, current sources, voltage monitors, and current monitors. I-V curve of a simple two terminal device, Id-Vds-Vg graphs for MOSFETs, switching characteristics of logical gates, etc.

  27. Film thickness measurement • Film thickness from 100 to 500,000 Å • A diffraction-grating based spectrometer measuring reflectance of films from 370 to 800nm wavelengths. • Extrapolates thickness using known refractive index for film material and silicon substrate. Nanospec AFT Model 210

  28. Alpha-Step Vertical ranges of: 1000Å, 2500Å, 5000Å, 10kÅ, 25kÅ, 50kÅ, 100kÅ, 250k, 500kÅ and 1000kÅ Leveling (Auto, Manual) Scan Length: 3mm (Manual mode), 2.5mm (Automatic) Resolution: 50 Å ProfilometerModel: Alpha-step 200 Manufacturer: Tencor Instruments Step-height on thin films

  29. A good selection of microscopes is important! Leica DM LB 100T

  30. OPEN-DAY at NISRC, QUB, Belfast Students from schools visit the microelectronics group

  31. Training in ‘robing’

  32. A competition to find the fastest dresser! ??

  33. With a prize for the winner!!

More Related