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AN OVERVIEW OF COMPUTER AIDED ENGINEERING/DESIGN (CAE/D) SYSTEMS AND DATA. ROBERT E. FULTON PROFESSOR OF MECHANICAL ENGINEERING DIRECTOR ATLANTA ELECTRONIC COMMERCE RESOURCE CENTER GEORGIA INSTITUTE OF TECHNOLOGY ATLANTA, GEORGIA Robert.fulton@me.gatech.edu 404-894-9514. PRESENTED AT

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slide1

AN OVERVIEW OF COMPUTER AIDED

ENGINEERING/DESIGN (CAE/D) SYSTEMS AND DATA

ROBERT E. FULTON

PROFESSOR OF MECHANICAL ENGINEERING

DIRECTOR ATLANTA ELECTRONIC COMMERCE RESOURCE CENTER

GEORGIA INSTITUTE OF TECHNOLOGY

ATLANTA, GEORGIA

Robert.fulton@me.gatech.edu

404-894-9514

PRESENTED AT

OPEN SOURCE SOFTWARE FRAMEWORK

FOR ORGAN MODELING

AND SIMULATION

LISTER HILL CENTER, NATIONAL LIBRARY OF MEDICINE

BETHESDA, MD

JULY 23, 2001

slide2

OUTLINE

ENGINEERING INFORMATION MANAGEMENT

INTRODUCTION TO STEP STANDARD

EXAMPLE OF RESEARCH ON LINKING ANALYSIS AND GEOMETRY MODELS

GEORGIA TECH CENTER FOR:

INFORMATION TECHNOLOGY FOR INTEGRATING MANUFACTURING

ENTERPRISE SYSTEMS (i TIMES)

CONTACTS:

DIRECTOR: DR. FARROKH MISTREE

PHONE: 404-894-8412

farrokh.mistree@me.gatech.edu

TECHNICAL DIRECTOR: DR. RUSSELL PEAK

PHONE: 404-894-7572

russell.peak@angostura.marc.gatech.edu

slide3

PHYSICAL PRODUCT

INFORMATION PRODUCT

RESULTS

CHARACTERISTICS OF ENGINEERING DESIGN

LARGE TEAMS

MULTIDISCIPLINARY

DIVERSE TEAMS

TODAY’S REQUIREMENTS INCLUDE FASTER, BETTER,

CHEAPER PRODUCTS BUILT BY DISTRIBUTED TEAMS

REQUIRES NUMEROUS COMPUTER BASED TOOLS AND

PRODUCES ENORMOUS DATA SETS

INFORMATION MANAGEMENT STRATEGIES ARE ESSENTIAL

slide12

COMPUTER BASED ENGINEERING SYSTEMS

REQUIREMENTS

ELECTRONICS

STRUCTURES

INTEGRATED DATA BASE

GEOMETRY

MATERIALS

LOADS, STANDARDS

SPECS, RESULTS

ETC., ETC., ETC.

STABILITY

&

CONTROL

FLUID

MECHANICS

NC

MACHINING

THERMAL

MECHANICS

ETC

slide13

TYPICAL CAD SYSTEMS

PRO-E, CATIA, UNIGRAPHICS, IDEAS, ETC.

VARIATIONS IN THEORY, MODELING APPROACHES

USER FEATURES, INTERFACE CAPABILITIES

GEOMETRY:

NASTRAN, ANSYS, IDEAS, ABAQUS, ETC

VARIATIONS IN THEORY, FINITE ELEMENT MODELS,

USER FEATURES, ETC.

STRUCTURAL ANALYSIS:

INCLUDED IN MOST STRUCTURAL ANALYSIS

SYSTEMS AND HAS SIMILAR CHARACTERISTICS

THERMAL ANALYSIS:

WIDE VARIETY OF SYSTEMS WITH DIFFERENT

STRATEGIES FOR SUBSONIC, TRANSONIC AND

SUPERSONIC FLOW

FLUID MECHANICS:

slide14

PRO-E

IDEAS

CATIA

CRITICAL PRODUCT DATA MANAGEMENT NEED

STANDARD INFORMATION MODELING APPROACH

TO INTEGRATE PRODUCT LIFECYCLE DATA

MODERATELY HETEROGENEOUS GEOMETRY SYSTEMS

HIGHLY HETEROGENEOUS ANALYSIS SYSTEMS

DIFFERENT DATA STRUCTURES, THEORIES, AND IDEALIZATIONS

STRUCTURAL MODEL THERMAL MODEL

MOST CAD SYSTEMS OWNED BY DIFFERENT VENDORS

MULTIPLE TEAMS, LONG DEVELOPMENT TIMES

PRODUCT DEMANDS FOR BETTER, FASTER, CHEAPER DESIGNS

slide15

ENGINEERING INFORMATION MANAGEMENT APPROACH

DEVELOP A STANDARD FOR EXCHANGE OF PRODUCT MODEL DATA (STEP)

10 + YEARS OF WORK, THOUSANDS OF PARTICIPANTS

INTERNATIONAL STANDARDS, SOME APPROVED, OTHERS IN WORKS

BUILT ON OBJECT AND SOFTWARE AGENT TECHNOLOGY

USES AN INFORMATION MODELING STANDARD FOR DEFINING

STEP MODELS (EXPRESS)

CONTAINS BOTH GRAPHICS AND PROGRAMMABLE SYNTAX FORMS

slide16

DATA MODELING STANDARD

(EXPRESS)

SPECIFIC DISCIPLINE ORIENTED

APPLICATION PROTOCOLS

API

AP 203

GEOM/CONFIG

MANAGEMENT

ETC., ETC.

AP 210

ELECTRONICS

A SIMPLE VIEW OF STEP

LAYERS OF BUILDING

BLOCKS SUCH

AS GEOMETRY,

CONCEPTS,

LINKAGES, S/W AGENTS, ETC.

slide24

STEP STATUS

CORE CAPABILITIES IN PLACE

MANY VENDORS STEP CERTIFIED

INTERNATIONAL TEAM CONTINUING DEVELOPMENT

SOLID BUILDING BLOCKS AVAILABLE FOR EXTENSIONS

EXTENSIVE TECHNICAL/COMPUTER FOUNDATION IN PLACE

KEY ASSOCIATIONS IN PLACE

ISO/TAG STANDARDS GROUP

US PRODUCT DATA ASSOCIATION (US PRO)

SUPPORTING DEVELOPMENT AND DISTRIBUTION OF STEP

PDES, INC. INDUSTRY GROUP EVALUATING AND APPLYING STEP

KEY US GOVERNMENT AGENCIES SUPPORTING STEP

NIST/ NASA/DOD

missing today explicit design analysis associativity

little

automation

inconsistency

No explicit

fine-grained

CAD-CAE

associativity

little

knowledge capture

G

idealizations

=

K

f

(

r

,

b

,

h

)

3

1

P

P

=

f

C

=

f

be

1

2

ht

se

p

2

r

t

e

0

e

Missing Today:Explicit Design-Analysis Associativity

Detailed Design Model

Analysis Model

(with Idealized Features)

Channel Fitting Analysis

“It is no secret that CAD models are driving more of today’s product development processes ... With the growing number of design tools on the market, however, the interoperability gap with downstream applications, such as finite element analysis, is a very real problem. As a result, CAD models are being re-created at unprecedented levels.” Ansys/ITI press Release, July 6 1999

http://www.ansys.com/webdocs/VisitAnsys/CorpInfo/PR/pr-060799.html

step ap 210 pwa b design information

Part

Product Structure/

Connectivity

  • Functionality
  • Termination
  • Shape 2D, 3D
  • Single Level Decomposition
  • Material Product
  • Characteristics
  • Functional
  • Packaged

Physical

Configuration Mgmt

  • Identification
  • Authority
  • Effectivity
  • Control
  • Requirement Traceability
  • Analytical Model
  • Document References

Geometry

  • Geometrically Bounded
  • 2-D Shape
  • Wireframe with Topology
  • Advanced BREP Solids
  • Constructive Solid Geometry

Requirements

  • Design
  • Allocation
  • Constraints
  • Interface

Technology

  • Fabrication Design Rules
  • Product Design Rules
STEP AP 210PWA/B Design Information
  • Component Placement
  • Bare Board Geometry
  • Layout items
  • Layers non-planar,
  • conductive & non-conductive
  • Material product
analysis integration challenges information diversity
Analysis Integration Challenges: Information Diversity

“Analyzable”

Description

Environmental

Conditions

“Manufacturable”

Description

Specification

Semantics

STEP

AP220

STEP

AP210

  • “PWB should
  • withstand lamination”
  • “Warpage < 0.005 when
  • board is heated from 25
  • to 150oC”

lamination

temperature =

150oC

Idealizations

multi fidelity multi usage idealizations

Solder

Joint

Deformation

PWA

Cooling

Solder

Joint

Deformation

3-D bounding box

Multi-Fidelity, Multi-Usage Idealizations

Analysis Models

Idealized

Views

Multiple Uses

2-D bounding box

Design Model

Multi-Fidelity

Idealizations

Multiple Uses

PWA

Cooling

x analysis integration techniques
X-Analysis Integration Techniques

a. Multi-Representation Architecture (MRA)

b. Explicit Design-Analysis Associativity

c. Analysis Module Methodology

X = design, manufacture, ...

flexible high diversity design analysis integration electronic packaging examples pwa b

Pro AM

Flexible High Diversity Design-Analysis IntegrationElectronic Packaging Examples: PWA/B

Design Tools

Modular, Reusable

Template Libraries

Analysis Modules (CBAMs)

of Diverse Mode & Fidelity

ECAD Tools

Mentor Graphics,

Accel*

Analysis Tools

XaiTools

PWA-B

General Math

Mathematica

STEP AP210‡

GenCAM**,

PDIF*

1D,

2D,

3D

Solder Joint

Deformation*

FEAAnsys

PWB Layup Tool

XaiTools PWA-B

Analyzable Product Model

PWB

Warpage

XaiToolsPWA-B

1D,

2D

Laminates DB

PTH

Deformation

& Fatigue**

Materials DB

1D,

2D

‡ AP210 DIS WD1.7 * = Item not yet available in toolkit (all others have working examples) ** = Item available via U-Engineer.com

slide32

SUMMARY

PRODUCT DATA AND HUMAN DATA HAVE MANY SIMILAR CHARACTERISTICS

LARGE, COMPLEX, EVOLVING, MULTIDISCIPLINARY, GEOMETRY/

ANALYSIS/EXPERIMENTALLY BASED, MULTIMEDIA, ETC.

PRODUCT INFORMATION MANAGEMENT HAS MADE SIGNIFICANT PROGRESS

SINCE 1970’S

DIGITAL HUMAN STRATEGY NEEDS TO USE STEP PRODUCT DATA MODELING

AS A STARTING POINT FOR FUTURE NEEDS