Update on bump bonding. Detector preFPIX2I – UCD, 1 st detector delivered but inner row of wire bond pad not exposed; they need a few more chips and we will send them the re-diced sensors preFPIX2tb – AIT; expect to get up to 6 detectors. ATLAS Prototype 2 wafer. 1, 5 = STlad 2,6 = Stnod
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Need to understand what’s causing this
Will receive another batch irradiated to more than 10 Mrad