1 / 7

SVT – ITTF Integration

SVT – ITTF Integration. Congress panel says silicon impants O.K . Tues June 22 1999 ABC news (Analysts say this finding will discourage future lawsuits on such grounds and encourage existing plaintiffs to accept the money already offered. ). SVT details.

xenos
Download Presentation

SVT – ITTF Integration

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. SVT – ITTF Integration Congress panel says silicon impants O.K. Tues June 22 1999 ABC news (Analysts say this finding will discourage future lawsuits on such grounds and encourage existing plaintiffs to accept the money already offered. )

  2. SVT details Radiation Length 1.5%/layer (including Electronics+Cooling) 216 wafers on 36 Ladders 0.7m2Silicon Radii – 5,10 15 cm Length ±12.4 cm ± 18.6 cm ± 21.7cm (-1 < h < 1)

  3. Cluster Finding “Raw” Data: Colour coding is ADC value Clusters: Colour coding is cluster number

  4. Deconvoluting 0 0 0 0 0 0 0 0 0 0 0 0 1 1 2 0 0 0 0 0 4 2 2 0 0 0 0 0 6 21 14 0 0 0 2 1 23 39 17 0 0 2 2 2 3 14 7 0 0 2 21 18 2 0 -4 0 0 12 36 39 6 0 0 0 0 2 9 11 -1 0 0 0 0 -3 -4 -4 0 0 0 0 0 0 0 0 0 0 0 0 If peak to valley ratio is > 50% considers it has found a new cluster. The fitting is via moments analysis Errors on hits scaled to reflect the separation of the hits. Larger the peak-to-valley ratio the smaller the errors De-convolutor forms two hits with peaks put where green dots are.

  5. The SVT Coordinate Systems 3 coordinate frames: Wafer : layer, ladder, wafer, hybrid,timebucket, anode Local : layer, ladder, wafer, cm from center of WAFER in OUR x (drift) and y (anode) frames Global : x, y, z in STAR magnet system anode timebucket x y timebucket anode

  6. Conversion to StHit class StSvtAnalysedHybridClusters : public StSvtHybridObject{ public: StSvtAnalysedHybridClusters(int barrel, int ladder, int wafer, int hybrid); virtual ~StSvtAnalysedHybridClusters(); void setMembers(int numOfClu, int index); int setSvtHit(StSvtAnalysis* mSvtAnalysis, float T0Jitter); int setSvtHit(scs_spt_st* mSrsHit); StSvtHitData* svtHitData(); StSvtHit* svtHit(); void ReSize(); int numOfHits(); StThreeVector<double>* WaferPosition(); ……… }; Pretty much done

  7. Principle of Operation Ionizing particle Y-position from readout anode number SDD X-position from drift time X Electron cloud SDD gives unique position in X-Y * 6.3 cm x 6.3 cm area * 280 mm thick n-type Si wafer * 20 mmposition resolution

More Related