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2. Outline. IntroductionMotivation Why design with flexible electronicsLimitation What difference from Si MOFET circuit designA-Si:H TFTOrganic TFTRobust Circuit Design for Flexible ElectronicsA-Si:H TFT Robust building blocks Organic TFT Cell library designPrintable circuit layout.

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design for printability from device to circuit for flexible electronics

Design for PrintabilityFrom Device to CircuitforFlexible Electronics

Tsung-Ching (Jim) Huang

Tim Cheng

February 10th 2007

outline
Outline
  • Introduction
    • Motivation – Why design with flexible electronics
    • Limitation – What difference from Si MOFET circuit design
      • A-Si:H TFT
      • Organic TFT
  • Robust Circuit Design for Flexible Electronics
    • A-Si:H TFT
      • Robust building blocks
    • Organic TFT
      • Cell library design
      • Printable circuit layout
why design with flexible electronics
U. Tokyo

Poly IC

ASU

Plastic Logic

Polymer Vision

Why Design with Flexible Electronics
outline5
Outline
  • Introduction
    • Motivation – Why design with flexible electronics
    • Limitation – What difference from Si MOFET circuit design
      • A-Si:H TFT
      • Organic TFT
  • Robust Circuit Design for Flexible Electronics
    • A-Si:H TFT
      • Robust building blocks
    • Organic TFT
      • Cell library design
      • Printable circuit layout
output reponses of n tft inverter chain
Output Reponses ofN-TFT Inverter Chain
  • Signal strength after propagation will diminish due to insufficient noise margin
  • Insufficient for circuit design with a certain degree of complexity
output reponses of c tft inverter chain
Output Reponses ofC-TFT Inverter Chain
  • Signal strength after propagation remains at the same level as input signal
  • Sufficient for circuit design of higher complexity
outline12
Outline
  • Introduction
    • Motivation – Why design with flexible electronics
    • Limitation – What difference from Si MOFET circuit design
      • A-Si:H TFT
      • Organic TFT
  • Robust Circuit Design for Flexible Electronics
    • A-Si:H TFT
      • Robust building blocks
    • Organic TFT
      • Cell library design
      • Printable circuit layout
published otft model
Published OTFT Model

~ pF

~ pF

~ kΩ

~ kΩ

Top Gate

Bottom Contact

Ref: M. Fadlallah et al, Plastic Logic, J. Applied Physics 2006

printed passive component
Printed Passive Component

Physical dimension for high-impedance resistance:

1KΩ 2mm x 1mm

(190ºC, 1-layer)

  • Ink-jetted resistance normally can have much higher value than standard clean-room process
  • High impedance resistance can be beneficial in implementing pseudo-complementary design

Resistance

50 μm drop size

Capacitance

Ref: D. Radinger et al, J. Electron Device ‘04

pseudo complementary otft inverter
Pseudo-ComplementaryOTFT Inverter

Ratio-less Logic

  • PMOS together with necessary series resistance is used for OTFT equivalent model
inverter layout
Inverter Layout

32 Units

46 Units

1 Unit = 50 μm

output response to threshold voltage variation
Output Response toThreshold Voltage Variation
  • PC-OTFT exhibits robustness again VTH variation due to electrical or chemical degradation
output response of inverter chain
Output Response of Inverter Chain
  • Signal propagation will not diminish in PC-OTFT inverter design because of ratio-less design
  • After 10-stage signal propagation, ordinary OTFT inverter can not generate the same signal strength
2 input nand layout
2-Input NAND Layout

79 Units

85 Units

3 input nand layout
3-Input NAND Layout

90 Units

115 Units

2 input nor layout
2-Input NOR Layout

79 Units

61 Units

pc otft d flip flop output response
PC-OTFTD Flip-Flop Output Response
  • D-FF composed of PC-OTFT NAND gates exhibits good noise-margin in output response
2 bit rom layout
2-Bit ROM Layout
  • Ex1.
  • Input [ 0 1 0 0 ]
  • Output [ 0 1 0 1]
  • Ex2.
  • Input [0 0 1 0]
  • Output [0 0 1 0]

79 Units

89 Units

summary
Summary
  • Flexible electronics technology is now emerging and more commercial applications will become available
  • Low-cost, bendable, thin-film, and light-weight properties are highly desirable in consumer electronics
  • Circuit reliability and lifetime remain to be the biggest challenges to make wide use and market penetration
  • Novel circuit building blocks and printable layout are demonstrated to extend circuit lifetime
  • Significant innovations in material/device/design/testing area are still required
slide25
Q & A

Thank you for your attention !!

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