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微機電期末報告 - 高靈敏度超薄電容式壓力感測器

微機電期末報告 - 高靈敏度超薄電容式壓力感測器. 班級 : 奈米三乙 指導老師 : 莊承鑫 組員 : 49914069 李孟修 49914092 翁安德 49914094 楊政翰 49914110 張龍右. 目錄. 一、摘要 二、文獻回顧 三、設計原理分析 四、製造原理分析 五、結論 六、預期結果 七、團隊分工 八、參考文獻. 一 . 摘要.

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微機電期末報告 - 高靈敏度超薄電容式壓力感測器

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  1. 微機電期末報告-高靈敏度超薄電容式壓力感測器微機電期末報告-高靈敏度超薄電容式壓力感測器 班級:奈米三乙 指導老師:莊承鑫 組員:49914069 李孟修 49914092 翁安德 49914094 楊政翰 49914110 張龍右

  2. 目錄 一、摘要二、文獻回顧三、設計原理分析四、製造原理分析五、結論 六、預期結果七、團隊分工八、參考文獻

  3. 一.摘要 • 本文報導超薄型MEMS電容式壓力感測器高於每Pa 150x10-18法拉有更好的壓力感測靈敏度,而尺寸僅1.0毫米x1.0毫米x60奈米。能夠檢測到環境壓力的變化在+/-3.5千Pa壓力範圍內0.025%的判斷率。這個電容式壓力感測器使用一個機械方式結合壓力感測薄膜使密封且絕緣的電容分離壓力感測,這樣就能輕易的實現大範圍且高壓力感測的靈敏度,電容器是密封在一個腔體內,電容式感測器不會受測量介質和EMI(電磁干擾)影響。

  4. 二.文獻回顧 • 電容式壓力感測器因為其高壓力感測靈敏度、低溫靈敏度和優良的直流響應以及低功耗而被廣泛的設計應用於各種同時有不同的壓差的測量。通常電容式壓力感測器包含一個薄膜與相同的膜用於當做壓力感測元件和電容式感測元件。一般而言,電容式壓力感測器的高靈敏度是通過增加薄膜的尺寸,減少薄膜的厚度和降低感測的間隙來實現,然而會導致感測器尺寸過大、非線性感測還有動態範圍受限制。此外因為感測薄膜是直接暴露在測量的環境,典型的壓力感測器受測量介質包括流體、化學和電磁效應影響。因此壓力感測器要達成介質保護和抵抗電磁干擾是非常複雜且昂貴。

  5. 三.設計原理分析

  6. 四.製造原理分析

  7. 五.結論 • 一個創新的電容式壓力傳感器,具有靈敏度高,動態範圍大,經過超薄設計,製造,測試。這種壓力傳感器是免疫測量介質和抗電磁干擾的影響。

  8. 六.預期成果 • 了解高靈敏度超薄微機電電容式壓力感測器其設計與製作方法,並觀察測試的兩種感測器不同的壓力靈敏度和動態範圍。

  9. 七.團隊分工 • 李孟修:文獻翻譯 • 翁安德:WORD檔製作 • 楊政翰:PPT檔製作 • 張龍右:文獻翻譯

  10. 八.參考文獻 • [1] Y. Zhang, S. Massoud-Ansari, G. Meng, W. Kim, andN. Najafi, “A Ultra-Sensitive, High-VacuumAbsolute Capacitive Pressure Sensor," TechnicalDigest of the 14th IEEE International Conf. on MicroElectro Mechanical Systems (MEMS 2001), pp.166-169, Interlaken, Switzerland, Jan. 21-25, 2001. • [2] Y. Zhang and K. D. Wise, “A Barometric PressureSensor with Multiple Elements,” Digest IEEETransducers ’95 Stockholm, Sweden, June 1995. • [3] Y. Zhang and K. D. Wise, “ An Ultra-SensitiveCapacitive Pressure Sensor with a Bossed DielectricDiaphragms,” Technical Digest of the IEEESolid-state Sensors and Actuators workshop, HiltonHead Island, SC, June of 1994. • [4] C. Hierold, B. Clasbrummel. “Low power integratedpressure sensor system for medical applications,”Sensors and Actuators (Part A) Physical, no. 73,1999, pp. 68-67 • [5] Bishnu P. Gogoi and David J. Monk, “Methodofmanufacturingsemiconductor component having afixed electrode between two flexibldiaphragms,”U.S. Patent #6,426,239 B1, issued July 30, 2002.

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