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Warm Electronics: Components/Subsystems Test Results. PACS SVR. B. Voss. BOLC FM. errors occurred during thermal vacuum acceptance tests three housekeeping channels found unstable during cold start up test (-30°C) failure seems to be temperature dependent (possibly a week soldering)

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bolc fm
BOLC FM
  • errors occurred during thermal vacuum acceptance tests
  • three housekeeping channels found unstable during cold start up test (-30°C)
  • failure seems to be temperature dependent (possibly a week soldering)
  • tests are stopped and BOLC is sent back for repair
  • tests will be resumed and partly repeated (vibration in at least one axis)

Warm Electronics

dec mec qm
DEC/MEC QM
  • equipped with complete nominal section
  • currently running at MPE
  • long duration tests
    • digital interfaces without errors or malfunctions
    • analogue interfaces OK except:
      • SPU current housekeeping, known problem with wrong gain setting in DEC/MEC. Corrected for FM
      • CRE interfaces tested OK during acceptance test, but no long term tests available.

Warm Electronics

dec mec fm
DEC/MEC FM
  • in production
  • schedule delayed by two main problems:
    • FPGA swap on both DEC Base boards
      • repair envisaged due week 29
      • rearranging test order because of availability of test facilities
    • erroneous SPU boards
      • FM will be temporary equipped with erroneous SPU boards thus EMC and environmental test can be performed in time
      • only small likelihood of malfunction during tests
      • later exchange of the SPU boards and delta acceptance

Warm Electronics

dec mec fm1
DEC/MEC FM
  • new schedule by CSL:
    • repair due week 29
    • functional test and vibration due week 32
    • thermal vacuum due week 33
    • functional retest due week 34
    • EMC test at ESTEC due week 35
    • delivery to MPE begin of September

Warm Electronics

dpu pfm
DPU PFM
  • functional Tests at CGS OK
  • thermal Tests OK
  • EMC Test OK (minor NCRs, solved/accepted)
  • possible problems:
    • CFM2 showed corrupted memory after some hours of operation at MPE
    • AVM2 in same configuration is running stable
    • possible reasons currently under investigation (HW or SW problem?)
    • errors not reproducible at CGS
    • PFM now at MPE for comparative tests

Warm Electronics

spu pfm
SPU PFM
  • thermal tests OK
  • EMC test OK (minor deviations already accepted)
  • functional test failed under special conditions
    • during acceptance test campaign 15.05.06 malfunction occurred (CRISA FPL-NC-1214-077-CRS)
    • start-up SW reports error during application upload command
    • error affects read from DSP program memory (PRAM) with special bit patterns (all 1’s to all but one bit 0’s)
    • error is systematic and affects all DSP boards (PACS SPU, PACS DECMEC and LFI REBA)

Warm Electronics

spu pfm1
SPU PFM
  • reason of error
    • not clearly understood yet, but most likely a ground bouncing problem when switching output stages in the PRAMs
  • repair
    • repair of EBB with additional ground wires on the board improved the situation
    • modification of flight spare currently under progress

Warm Electronics

harnesses
Harnesses
  • Warm Interconnect Harness
    • QM at MPE
    • QM showed different weaknesses (bad bonding, wrong back shells, swapped wires in cable bundles)
    • FM production will take care of these
  • Cryo Harness
    • complete and tested
    • differences in resistance measurements compared to MPE test harness
    • reason under investigation but most likely due to different measurement systems

Warm Electronics