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Glasgow Update

Glasgow Update. Update. ABCn130 Dicing and FIB work Wire bond trials Bonding program v3 X-ray imaging of Glue Coverage Spending Cabinets ATLAS12 measurements Analysis software. ABNc 130. First ABCn chips are now with FIB group Remainder of chips to be diced 30 for FIB

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Glasgow Update

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  1. Glasgow Update

  2. Update • ABCn130 • Dicing and FIB work • Wire bond trials • Bonding program v3 • X-ray imaging of Glue Coverage • Spending • Cabinets • ATLAS12 measurements • Analysis software

  3. ABNc 130 • First ABCn chips are now with FIB group • Remainder of chips to be diced • 30 for FIB • Remainder for wire bond trials • Plan is to hand out to groups at AUW • As well as Glass ASICs

  4. 130nm Bonding Parameters • 2nd Wire bonding trials began • Using back to back abcn130 chips • Separated by 1.5mm to allow 30o angle with 500um bond loop height • used chips from periphery of wafer • Bonds to go down next few days • Will look at the lower bond forces suggested at last meeting

  5. QA - Wire bonding Programs • Now have a range of programs for wire bonding QA • 250nm Barrel • Hybrid work • V1 : Records bond number and fault • V1.2: Records bond number and tells user info on bond • Module Work • 130nm Barrel • Hybrid Work • V3 finished last week • Able to cope with • Different hybrids and modules for both endcap and barrel • Different bond programs for different institutions • User chooses appropriate .h file for usage

  6. QA – SVN repository • As of last have SVN account at CERN • Means anyone can download the version they want • Can play with/optimise code • Will let others know when ready to download from • Can use same area for other code (eg vac monitoring)

  7. Medipix Hybrid Pixel Detector • Had this idea for a while • Use the Medipix chip to X-ray the ASIC gluing • Images taken of Module via Bart over various areas • 60Kev (Vp) X-rays with 1s acquisitions Medipix/Timepix • 65k single-photon counting pixel array; • Square pixel size of 55 µm; • 14x14 mm area; • Electron or hole collection; • Threshold equalisation; • Count rate of ~100 kHz; • Readout in 300 µs; • High dynamic range;

  8. X-ray Imaging – ASIC Gluing • Scanned glued hybrid on Module (from Bart) • Very clear Imaging of glue spots • Rough analysis shows glue coverage of 39% • Good for • Sanity check • Initial 130nm glues?

  9. BCC on Module • Imaging of BCC on the module • Tuning “should” allow me to see the module to hybrid glue as well • We also have an automated stage that can be used to raster scan a full module

  10. Spending • Dry storage cabinets • Delivery dates of Tue 25th and Wed 26th March • FAO Cambridge & RAL to successfully receive these as a Glasgow order I need a scan of the delivery confirmation from your sites • Almit ran out of component for model ordered • “The original HSD-1106-51 had a basic control unit and display but it has been replaced with a SIEMENS display and controller (that has been used on more expensive Totech cabinets for about 5 years) that makes the dry unit operate more efficiently …..and operates in a SMARTER way…” • “it dries faster (recovers quicker) after door openings and holds the RH set point more accurately…so the performance is better…” • “They should be sold at a higher price…but yours prices won’t change.”

  11. ATLAS12 measurements • Fixed Analysis code • Returns correct (bad) CCE from irradiated sample under test • Writing additional code that plots measurements from multiple files for given sample • E.g. CCE measurements for varying voltage and automatically plots in ROOT Example of code in testbeam reconstruction Plots cluster size from various input files

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