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Glasgow Update. Update. ABCn130 Dicing and FIB work Wire bond trials Bonding program v3 X-ray imaging of Glue Coverage Spending Cabinets ATLAS12 measurements Analysis software. ABNc 130. First ABCn chips are now with FIB group Remainder of chips to be diced 30 for FIB

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update
Update
  • ABCn130
    • Dicing and FIB work
    • Wire bond trials
    • Bonding program v3
  • X-ray imaging of Glue Coverage
  • Spending
    • Cabinets
  • ATLAS12 measurements
    • Analysis software
abnc 130
ABNc 130
  • First ABCn chips are now with FIB group
    • Remainder of chips to be diced
      • 30 for FIB
      • Remainder for wire bond trials
    • Plan is to hand out to groups at AUW
      • As well as Glass ASICs
130nm bonding parameters
130nm Bonding Parameters
  • 2nd Wire bonding trials began
    • Using back to back abcn130 chips
      • Separated by 1.5mm to allow 30o angle with 500um bond loop height
        • used chips from periphery of wafer
      • Bonds to go down next few days
        • Will look at the lower bond forces suggested at last meeting
qa wire bonding programs
QA - Wire bonding Programs
  • Now have a range of programs for wire bonding QA
    • 250nm Barrel
      • Hybrid work
        • V1 : Records bond number and fault
        • V1.2: Records bond number and tells user info

on bond

      • Module Work
    • 130nm Barrel
      • Hybrid Work
  • V3 finished last week
    • Able to cope with
      • Different hybrids and modules for both endcap and barrel
      • Different bond programs for different institutions
    • User chooses appropriate .h file for usage
qa svn repository
QA – SVN repository
  • As of last have SVN account at CERN
    • Means anyone can download the version they want
    • Can play with/optimise code
    • Will let others know when ready to download from
    • Can use same area for other code (eg vac monitoring)
medipix hybrid pixel detector
Medipix Hybrid Pixel Detector
  • Had this idea for a while
    • Use the Medipix chip to X-ray the ASIC gluing
    • Images taken of Module via Bart over various areas
      • 60Kev (Vp) X-rays with 1s acquisitions

Medipix/Timepix

  • 65k single-photon counting pixel array;
  • Square pixel size of 55 µm;
  • 14x14 mm area;
  • Electron or hole collection;
  • Threshold equalisation;
  • Count rate of ~100 kHz;
  • Readout in 300 µs;
  • High dynamic range;
x ray imaging asic gluing
X-ray Imaging – ASIC Gluing
  • Scanned glued hybrid on Module (from Bart)
  • Very clear Imaging of glue spots
  • Rough analysis shows glue coverage of 39%
  • Good for
    • Sanity check
    • Initial 130nm glues?
bcc on module
BCC on Module
  • Imaging of BCC on the module
  • Tuning “should” allow me to see the module to hybrid glue as well
  • We also have an automated stage that can be used to raster scan a full module
spending
Spending
  • Dry storage cabinets
    • Delivery dates of Tue 25th and Wed 26th March
    • FAO Cambridge & RAL to successfully receive these as a Glasgow order I need a scan of the delivery confirmation from your sites
  • Almit ran out of component for model ordered
    • “The original HSD-1106-51 had a basic control unit and display but it has been replaced with a SIEMENS display and controller (that has been used on more expensive Totech cabinets for about 5 years) that makes the dry unit operate more efficiently …..and operates in a SMARTER way…”
    • “it dries faster (recovers quicker) after door openings and holds the RH set point more accurately…so the performance is better…”
    • “They should be sold at a higher price…but yours prices won’t change.”
atlas12 measurements
ATLAS12 measurements
  • Fixed Analysis code
    • Returns correct (bad) CCE from irradiated sample under test
    • Writing additional code that plots measurements from multiple files for given sample
      • E.g. CCE measurements for varying voltage and automatically plots in ROOT

Example of code in testbeam reconstruction

Plots cluster size from various input files