Ferroelectric-RTA Standard Operation Procedures

1. Ferroelectric-RTA Standard Operation Procedures By David Wu

2. Check to see if the system is OK • Check the gas valves. • Check to see if the leak valve in the mechanical pump is closed. If no, close it. Check to see if the system is on operation condition (green label). • Check the foregoing records in the working sheet.

3. Turn on the system • User utility permit & personal password to turn on the power of monitor. • Turn on the power of computer. • Turn on the power of the RTA system. • Turn on the power of mechanical pump. • After that, the screen shows the window of main menu. • Main menu: • The main menu offers 6 options: • 1.Edit recipes: to create, modify, display or delete a recipe. • 2.Run Process: to run a process. • 3.Maintenance: for manual control of the system. • 4.Historicals: to display saved processed and alarm events. • 5.Parameters: to enter calibration tables, configuration parameters, etc. • 6.Exit: to return to “Windows” and to terminal control.

4. Edit recipes • When the EDIT mode is selected, the screen displays the recipe programming screen. • •Each recipe is made of : • –A name (up to 10 characteristics), • –An associated calibration table to be chosen according to the sample to process, • –A comment, • –Thirty steps. • •

5. For each step the operator can select: • –Temperature, • –Duration of step, • –Temperature control mode, • –To open or not the gas valve, • –To open or not the vacuum valve. • Caution • When using power mode there is no temperature control and you may damage your samples, or melt them in a few seconds if power is too high. • The temperature range is 400 to 900 ℃. The time range is 1 to 5 min. However, when the temperature is higher than 700 ℃, the duration must be kept to lower than 3 min. The duration time at 900 ℃ is limited to lower then 1 min

6. Loading wafer • Select maintenance in the main menu. • Open purge valve. • When the chamber pressure reach 1 atm, open the chamber door and load process wafer. • Open vacuum valve to pump down chamber pressure until the pressure below 30 mbar. • Caution: • –Only ferroelectric materials, such as BST, PZT, SBT etc., are allowed.

7. Run process • Select Run process in the main menu. • Download recipe. • Start process. • During process, the screen displays all the parameters: • Recipe name, current step, calibration table name, setpoint, temperature from pyrometer and thermalcouple, power to the lamps, and valve status. • Whenever emergency occurs during operation, select End of process to shut down the process.

8. End of process and unloading wafer • After the process is completed, a window about cooling information appear automatically. • After the window disappear, open the chamber door and unload the wafer. • Clean the chamber by alcohol. • Close the chamber door and pump down the chamber until the pressure below 30 mbar.

9. Turn off the system • Close all the valves including gas valve and vacuum valve. • Select exit in the main menu. • Turn off the computer. • Turn off the system. • Turn off the mechanical pump. • User utility permit & personal password to turn off the monitor power.