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ExoMars PanCam Planetary Protection

ExoMars PanCam Planetary Protection. Alex Rousseau. PanCam isolation of accountable surfaces. Use a combination of seals & HEPA filter on the OB to exclude the complete internal volume of the OB from bioburden accountable surfaces: WACs (including filter wheels) HRC

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ExoMars PanCam Planetary Protection

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  1. ExoMars PanCam Planetary Protection Alex Rousseau

  2. PanCam isolation of accountable surfaces • Use a combination of seals & HEPA filter on the OB to exclude the complete internal volume of the OB from bioburden accountable surfaces: • WACs (including filter wheels) • HRC • PIU electronics (including all associated harnessing). • MSSL will follow “Excluding bioburden accountable surfaces for Instruments” EXM-PL-TNO-ESA-00001, procedures.

  3. PanCam isolation of accountable surfaces (Cont.)

  4. Identification of isolation zones on the PanCam OB • OB HEPA – Metallic fibre • HRC optical port – Metallic or non-metallic. • WACs optical ports (x2) – Metallic or non-metallic seals. • Connector feedthroughs – On OB – hermetic type connector feedthroughs.

  5. PanCam PP Philosophy • Hot ultrasonic at unit level. • Frequent solvent wipe during AIT. (not for BB reduction but bulk BC removal from surfaces) • Hydrogen Peroxide sterilisation at instrument level. • For PanCam AIT phase, WACs, HRC and PIU handled, assembled in ISO Class 5 & 6 environments. • During AIT PanCam will be processed using standard flight hardware handling methods (strict CC practices).

  6. PanCam DHMR & H2O2 • Two subsystems on PanCam are DHMR incompatible: • WACs detectors. • PIU • Lowest DHMR T at 110°C is a concern (PIU thermally stressed to unacceptable levels) • H2O2 sterilisation method will need to be qualified as an alternative to DHMR.

  7. PanCam Hardware Assay philosophy • Assay frequently during AIT phases: • After unit level ultrasonic cleaning. • After unit level vacuum bake out. (internal & external) • After HRC/OB integration. (Internal & external). • After WACs/PIU/OB integration. (internal & external). • Before and after instrument level sterilisation

  8. PanCam Hardware Assay flow diagram

  9. MSSL PanCam facilities • MSSL ISO class 5 cleanroom facility has two zones: • ISO class 5 PanCam hardware processing and assembly area. • ISO Class 5 aseptic area. • Aseptic area includes ISO Class 4 laminar flow bench.

  10. MSSL PanCam facilities

  11. MSSL PanCam AIT test facilities • Cleanroom – MSSL (Assembly, processing) • Vibration – MSSL (ISO Class 7 air shower) • TV/TB – MSSL (ISO Class 6) • Shock – Offsite (Portsmouth, classification TBC) • EMC – Offsite (Location & classification TBC). • PanCam instrument calibration – At MSSL or at NPL (If at MSSL ISO Class 6, if at NPL classification TBC)

  12. MSSL PanCam AIT test flow diagram

  13. MSSL Cleanroom facility bioburden reduction • Start with an empty cleanroom and clean all surfaces. (walls, floor and ceiling). • Process equipment needed for PanCam AIT. Cleaning includes, ultrasonic, vacuum bake out and solvent wet wiping methods. • Once equipment in place in cleanroom, further process equipment/tooling required for aseptic area. • During AIT phase PanCam hardware processing and assembly area will be cleaned at the start of each day before activities begin.

  14. MSSL Cleanroom facility bioburden monitoring • ISO Class 5 aseptic area will be bioburden monitored using: • Slit-agar air sampler • Swab & wipe assay • ISO Class 5 cleanroom will be verified at (or just after CDR) using assay procedure 2. • Frequent assays will be done during PanCam AIT phase of the ISO Class 5 aseptic area.

  15. ISO Class 5 cleanroom upgrade • ISO Class 5 cleanroom to be upgraded and finished at CDR. • Cleanroom commissioning and verification after CDR. • Cleanroom ready for normal operations at PanCam EQM phase

  16. PDR RIDs responseRID #: PANCAM-1 • Note that although the RID references the KT document (EXM-PL-PCHRC-KT-PL-0003 PP and CC_Plan), the issues raised are applicable to the MSSL PP, CCP & PPIP. • Estimate of internal and external surface area: • MSSL response: The PanCam PPIP will be updated with the internal and external surface areas after PDR. • Estimate of volume of non-metallic materials: • MSSL Response: The PanCam PPIP will be updated with the non-metallic materials volume after PDR. • Identification of items that cannot be wiped or assayed with damps swabs: • MSSL response: The PanCam PPIP will be updated with a list identifying areas that cannot be wiped or assayed. • Temperature tolerance for DHMR: • MSSL response: The PanCam PPIP will be updated to include temperature tolerances of the PanCam instrument including detector subsystems. • Preliminary organic materials list: • MSSL response: The PanCam PPIP will be updated to include an organic materials list. • UV bioburden control: • MSSL response: The DML will be updated to exclude UV as a bioburden reduction method.

  17. PDR RIDs responseRID #: PANCAM-2 • Note that although the RID references the KT document (EXM-PL-PCHRC-KT-PL-0003 PP and CC_Plan), the issues raised are applicable to the MSSL PP, CCP & PPIP. • Who will be responsible for the OB HEPA and for the request for approval according to PPL-PP-ALL-0070 and TN EXM-PL-TNO-ESA-00001?: • MSSL response: MSSL will request approval for the OB HEPA according to PPL-PP-ALL-0070. It is envisaged that the HEPA will be subjected to qualification tests at ESA facilities. • Responsibility of the OB HEPA is MSSLs.

  18. PDR RIDs responseRID #: PANCAM-3 • There is no clear need/requirement identified for a final DHMR of the entire assembly integrated on the mast. • MSSL response: MSSL will contact TAS-I and clarify the issues with regard to the PanCam instrument and the DHMR process. As mentioned in the PPIP, there are two PanCam subsystems that are not compatible with DHMR. Ways in which this can be dealt with and responsibilities of PP after delivery of the PanCam instrument will be discussed with TAS-I and the relevant PP & PPIP sections will be updated to reflect this after PDR.

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