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Design Review - PowerPoint PPT Presentation

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Design Review
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  1. Design Review United Electronic Industries DNR-12 -3U 12 DNA Rack With CPU/NIC Enclosure (c) 2007 UEI Inc.

  2. Enclosure Requirements • Enclosure to be 19” rack mountable, wall mountable and table top capable • Aluminum sheet metal construction, painted black • Max size: 5.25”H x 17.5”W x 5.5”D • Custom backplane for plug-in modules • Accept 15 Custom Designed Plug-in Modules: • 12 I/O Modules (Plus 1 Extension Bay) • CPU/NIC Module • DC Input Module • Buffer Module • Forced air cooling via 3 or 4 axial fans • System to be pressurized to minimize dust infiltration • Removable air filter (s) (c) 2007 UEI Inc.

  3. Layout Drawing (c) 2007 UEI Inc.

  4. Enclosure Isometric View (c) 2007 UEI Inc.

  5. Enclosure Front View (c) 2007 UEI Inc.

  6. Air Flow Cross Section (c) 2007 UEI Inc.

  7. Enclosure W-Modules Chassis I/O Expansion DC Input Buffer CPU/NIC I/O Module (c) 2007 UEI Inc.

  8. Enclosure Empty (c) 2007 UEI Inc.

  9. Enclosure Exploded ISO Front Removable Rear Fan Panel 60x10mm Fans Mounting Brackets (c) 2007 UEI Inc.

  10. Enclosure Exploded ISO Rear Removable Rear Fan Panel Air Filter Backplane (c) 2007 UEI Inc.

  11. Chassis EMI Gasket (c) 2007 UEI Inc.

  12. Chassis Exploded View Left Side Panel Card Cage Right Side Panel Rivets Base Plate (c) 2007 UEI Inc.

  13. Backplane (c) 2007 UEI Inc.

  14. Module Requirements • I/O and CPU/NIC modules to utilize existing PCB • Front Panel captive fastener • Inserter/extractor • Plug into custom backplane • Ability to get DC power from backplane • EMI shielding gaskets between modules • New DC Input and Buffer modules • Blank filler module required to cover unused bays (c) 2007 UEI Inc.

  15. CPU/NIC Module (c) 2007 UEI Inc.

  16. I/O Module (c) 2007 UEI Inc.

  17. Buffer Module (c) 2007 UEI Inc.

  18. DC Input Module (c) 2007 UEI Inc.