System Concept. CHIP Tray loading. 소형 linear head z,t. 50 mm. Flying vision camera . Linear motion X,Y. Stroke 300-400 mm. Glass camera. GLASS LOADING. Glass align data. Flying bonder 사양 ( FOG,COG,PCB BONDER, OLB TAB BONDER. 시스템 lay out 1 head. 시스템 lay out 2 head.
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