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Stanford Linear Accelerator Center. FECC-III INTEGRATION ISSUES. Eric J. Siskind June 12, 2003. Project Goals. Replace Multibus-I micro hardware with commercial-off-the-shelf personal computers.

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Fecc iii integration issues l.jpg

Stanford Linear Accelerator Center


Eric J. Siskind

June 12, 2003

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Project Goals

  • Replace Multibus-I micro hardware with commercial-off-the-shelf personal computers.

  • Replace special purpose accelerator networks (SLCnet, KISnet, PNET) with a single commercial-off-the-shelf TCP/IP network such as switched gigabit Ethernet.

  • Develop personal computer CAMAC interface to replace MBCD/MBCD-II.

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New CAMAC Features

  • CAMAC interface differs from MBCD/MBCD-II in four major ways:

    • Two board design to support remote I/O;

    • Real-time preemptive hardware with recovery;

    • Maximizes CAMAC utilization when user software environment in PC is multi-threaded;

    • Large (i. e. comparable to existing micro) user programming environment within interface.

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Hardware Architecture

  • Hardware consists of two circuit boards connected by up to 10 km of single mode fiber optics:

    • PCIL (“PCI Link”) board plugs into PCI option slot in PC;

    • FECC (“Front-End CAMAC Controller”) is now a stand-alone chassis with a single-width CAMAC module to access PDU triggers.

  • PC moves from micro’s current location to MCC computer room, leaving behind only FECC.

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PCIL Features

  • Basically an intelligent special-purpose Network Interface Card.

  • Processor with DMA PCI block transfer master and DMA fiber optic link transmitter/receiver.

  • Makes no assumptions about nature of PC’s real-time operating system.

  • Semi-static assembly language PROM code with downloaded updates.

  • First generation hardware doubles as Alpha SLCnet interface.

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PCIL Code Functions

  • Supports PC FECC message passing.

  • Supports FECC remote read/write access to PC memory with optional PC interrupt.

  • Performs function-specific scatter/gather DMA to/from PC memory for all classes of operations, avoiding unnecessary buffer copying by PC CPU.

  • Forwards trigger pattern from PCI registers to FECC (only in 1st generation; pattern forwarding in hardware in 2nd generation).

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FECC Features

  • Logical successor to MBCD/MBCD-II.

  • Accesses host memory via point-to-point fiber optic link instead of parallel I/O bus.

  • 1st generation supports MBCD-II’s four strings of SLAC serial CAMAC crate controllers (5 MHz, bit serial, half duplex).

  • 2nd generation adds support for four strings of IEEE standard crate controllers (5 MHz, byte serial, full duplex) and dual Bitbus strings.

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CAMAC Interrupt Recovery & Control

  • If a CAMAC block transfer is interrupted, hardware can repeat the previous write operation (address pointer load?) with updated write data before resuming the transfer.

  • Hardware can prevent an interrupt between CAMAC cycles transferring two 16-bit halves of a single 32-bit word.

  • Hardware can prevent an interrupt of a particular block transfer entirely (needed because of a current PIOP feature).

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System Performance

  • Many PC jobs now can have simultaneously outstanding long CAMAC packages.

  • All packages are sent to FECC firmware ASAP, and parsed into their individual (block transfer) operations in a single crate (“packets”).

  • Packets are immediately queued to hardware for the cable accessing the target crate.

  • Cable operation begins as soon as any outstanding package has a packet requiring access to a crate on that cable.

  • Parallelism now achieved over multiple packages.

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PCIL2 Intelligence

  • Analog Devices ADSP-21060 “SHARC” 40 MHz 32-bit DSP on 2nd generation PCIL.

  • 40k x 48 bit on-chip program memory; 64k x 32 bit on-chip data memory.

  • 256k x 48 bit external program/data memory.

  • 256k x 64 bit external DMA I/O data memory.

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FECC3 Intelligence

  • IBM PPC405 250 MHz 32-bit PowerPC embedded in Xilinx FPGA on 3rd generation FECC.

  • 16k x 64 bit on-chip program memory; 16k x 32 bit on-chip data memory.

  • 2048k x 64 bit external program/data memory with DMA link/CAMAC hardware.

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User FECC Programming

  • Real-time executive plus MBCD/Bitbus emulation uses ~15% of on-chip program memory, ~25% of on-chip data memory, and ~5% of off-chip RAM.

  • Remaining minimum of 15+ megabytes of memory on 250 MHz 32-bit processor exceeds capacities of existing 386/486 CPU boards.

  • Move existing 360 Hz interrupt driven code from micro to CAMAC interface to minimize CAMAC access delay.

  • C run-time environment with dynamic heap allocation; full environment and stack preserved over context switch.

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2nd Generation Hardware

  • PCIL2 uses 64 bit/66 MHz PCI slot.

  • Single specialized fiber optic link for PCIL2 FECC3 communication.

  • 125 megabyte/second full duplex link, but 9/19 used for hardware overhead.

  • All peripherals FPGA-based DMA except for Bitbus (programmed I/O).

  • Hardware based on one large FPGA per board, plus SHARC on PCIL2.

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2nd Generation Status

  • PCIL2 now debugged and tested.

  • Two PCIL2 boards built in 2001; three more in 2002.

  • FECC3 design in completed in 2002; FPGA delivery currently 29 August (5 month delay).

  • Initial build of two FECC3 boards in 2003; three more after debugging.

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Bitbus Master

  • Existing master based on MCS-51 2 MHz 8 bit microcontroller with SDLC/HDLC serial link.

  • 8044BEM is an MCS-51 with mask-programmed firmware (iDCX-51 RTE plus Bitbus application).

  • FECC3 has dual-channel programmed I/O hardware (one PowerPC FIFO read or write per 32 bits) to send a packet to one slave and receive that slave’s response.

  • Poll list, counters, etc. maintained by new PowerPC code in FECC3.

  • Enhanced real-time support via reserved high priority buffers and multiple prioritized queues.

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  • Migration of 360 Hz processing in progress (TEG).

  • All optimizations not necessary at early stage.

  • Trying to deploy MPG plus one ordinary PC-micro in development system in January, 2004.

  • Hoping to replace MPG plus one ordinary micro in summer of 2004.

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Simplified Hardware Configuration

  • No PCPC fast feedback (KISnet equivalent) network traffic.

  • Use 2nd generation PCIL-FECC hardware:

    • Include IEEE CAMAC and Bitbus;

    • Need PC with 64 bit/66 MHz PCI slot.

  • MPG  PC (PNET equivalent) pattern broadcast on dedicated point-to-point Ethernet link .

  • PC-based MPG (MP10/MP11) broadcasts pattern to existing micros via FECC3 BITbus interface reconfigured as a PNET transmitter; talks to SP00/SP01 and BIC via PC  VME reflective memory links.

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Integration Projects

  • Build, boot, and debug iRMX-III in off-the-shelf personal computers. Provide minimal FECC debugging support.

  • Make real-time micro  micro data communications streams coexist with slower back-end  front-end traffic on switched TCP/IP network (deferred).

  • Move 360 Hz interrupt processing from micro to FECC (MPG + pattern consumer).

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Integration Projects II

  • Change control of 360 Hz interrupt processing from shared memory to network link model.

  • Integrate PCIL-FECC CAMAC/Bitbus emulation.

  • Add support for real-time CAMAC/Bitbus; Modify fast feedback actuator to specify real-time priority for CAMAC/Bitbus operations.

  • Modify slower micro jobs to send larger packages to CAMAC interface to maximize parallelism.

  • Modify klystron job to protect PIOP CAMAC operations from interrupts.

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Integration Projects III

  • Support logical to physical micro mapping.

  • Support PC access to file server delivering current versions of PCIL and FECC executable images appropriate to different types of micros.