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Title. No. : Company : Contestant :. Content. Contestant Introduction Company & Product Introduction Product and Mold Development Process Product Development Trend and Challenge CAE Application Process Moldex3D Successful Application Case Study

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    Presentation Transcript
    1. Title No. : Company: Contestant:

    2. Content • Contestant Introduction • Company & Product Introduction • Product and Mold Development Process • Product Development Trend and Challenge • CAE Application Process • Moldex3D Successful Application Case Study • Moldex3D Application Value and Benefit Analysis • Moldex3D Future Application

    3. Contestant Introduction • Name: • Company: • Department: • Products in-charge: • Specialties:

    4. Company Introduction

    5. Product Introduction

    6. Product and Mold Development Process

    7. Product Development Trend and Challenge • Development Trend • Challenge • Common Problems

    8. Why CAE? • Why utilize CAE Simulation Analysis • Expected results and objects • Problems encountered • Short-term solution implemented

    9. CAE Application Process

    10. Moldex3D Successful Application Case Study

    11. Background • Product Size • Length: mm • Width: mm • Height: mm • Thickness: mm • Material • Process Condition • Filling Time: Sec • Melt Temperature:℃ • Mold Temperature:℃

    12. Mesh Model • Mesh Type • Mesh Count • Part Mesh: • Runner Mesh: • CPU CPU Time • Flow: • Pack: • Cool: • Warp: • Computer Information • CPU: • RAM:

    13. Runner Layout

    14. Cooling Channel Design

    15. Analysis Items and Contents

    16. Original Design Analysis and Results Interpretation

    17. Process Parameter

    18. Melt Front Time

    19. Filling Analysis _ Internal Temperature Distribution

    20. Cooling Analysis _ Temperature Distribution

    21. Cooling Analysis _ Cooling Time

    22. Warpage Analysis _ Total Displacement

    23. Warpage Analysis _ Sink Mark Index

    24. Design Alternatives and Simulation Analysis

    25. Attempts of Revised Design • Issues with original design • Revised Design

    26. Filling Analysis Result _ Injection Pressure

    27. Cooling Analysis Result _ Cooling Temperature

    28. Warpage Analysis Result _ Z-Displacement

    29. Warpage Analysis Result _ Sink Mark Index

    30. Comparison of Z-Displacement

    31. Comparison of Warpage Displacement

    32. Comparison of Simulation Result and Real Product

    33. Comparison Result

    34. Benefit Analysis and Future Application

    35. Moldex3D Application Value Analysis

    36. Moldex3D Future Application • Future Application • Future Study Direction