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Physics of Compressed Baryonic Matter 12 th CBM Collaboration Meeting

Physics of Compressed Baryonic Matter 12 th CBM Collaboration Meeting. R&D ON MICRO-CABLES FOR BABY SENSOR RADIATION TEST MODULE. JINR, Dubna, Russia. October 13 - 18, 2008. Scientific Research Technological Institute of Instrument Engineering Kharkov, Ukraine.

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Physics of Compressed Baryonic Matter 12 th CBM Collaboration Meeting

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  1. Physics of Compressed Baryonic Matter12th CBM Collaboration Meeting R&D ON MICRO-CABLES FOR BABY SENSOR RADIATION TEST MODULE JINR, Dubna, Russia October 13 - 18, 2008 Scientific Research Technological Institute of Instrument Engineering Kharkov, Ukraine e-mail: borshchov@kharkov.ukrtel.net

  2. DEMONSTRATOR 0-bBABY SENSOR RADIATION TEST MODULE Test module consist of: 1. Baby sensor CBM01B2 – 1 pcs 2. Flexible-rigid board – 1 pcs 3. ERNI connectors on flex mounts – 8 pcs 4. LEMO connectors – 4 pcs 5. Flexible sensor cables – 4 pcs 6. SMD resistors 1MΩ on flex mounts – 4 pcs 7. Jumpers for bias line – 4 pcs Dubna, October, 2008 e-mail: borshchov@kharkov.ukrtel.net

  3. CONNECTING CIRCUITOF MODULE Schematic view of strip to connectors connection Front side Back side Dubna, October, 2008 e-mail: borshchov@kharkov.ukrtel.net

  4. FLEXIBLE BOARD ERNI-flex-mount bonding area : Pitch= 635 um; Width of pads = 500 um. Sensor cablebonding area : Pitch= 300 um; Width of pads = 200 um. Material: foiled dielectric FDI-A-50 Polyimide layer Thickness 20 um Aluminum layer Thickness  30um Dubna, October, 2008 e-mail: borshchov@kharkov.ukrtel.net

  5. SENSOR CABLES Board bonding area: Pitch= 300 um; Width= 80 um. Technologically zone Work zone Sensor bonding area: Pitch= 101,4 um; Width= 34 um. Testing zone Polyimide layer Thickness 10 um Aluminum layer Thickness  14um Material: foiled dielectric FDI-A-24 Dubna, October, 2008 e-mail: borshchov@kharkov.ukrtel.net

  6. TESTING OF CABLES The Sensor cable design provided 100% automatically test (shorts, traces breaks) before assembly with applying of a standard contact device for testing Contact device on the basis of Socket IC51-4364 Sensor cables in the frame ТАВ-70 Dubna, October, 2008 e-mail: borshchov@kharkov.ukrtel.net

  7. FLEX-MOUNTSFOR SMD & ERNI CONNECTORS Board bonding area: Pitch= 300/635 um; Width= 100 um. Resistors (1MΩ) Material: foiled dielectric FDI-A-50 Dual row male connector: type BERNI 114805 model (68 pins) Ni + Sn-Bi layer Thickness  3+8um Aluminum layer Thickness  30um Polyimide layer Thickness 20 um Dubna, October, 2008 e-mail: borshchov@kharkov.ukrtel.net

  8. ASSEMBLING SCHEMEOF MODULE Dubna, October, 2008 e-mail: borshchov@kharkov.ukrtel.net

  9. MODULE ASSEMBLING – PART 1ASSEMBLING OF SENSOR WITH CABLES P - side N - side 3. Rotation of sensor 4. Ultrasonic bonding of Flexible cables to Sensor (P-side): (128 traces + 2 bias) x 2 = 260 bonds 5. Bonds protection (Glue EpoTec T7110) • Ultrasonic bonding of Flexible cables to Sensor (N-side): • (128 traces + 2 bias) x 2 • = 260 bonds • 2. Bonds protection • (Glue EpoTec T7110) Dubna, October, 2008 e-mail: borshchov@kharkov.ukrtel.net

  10. MODULE ASSEMBLING – PART 2ASSEMBLING OF FLEXIBLE-RIGID BOARD • Gluing of “Balconies” • to Rigid board • (Glue Araldite2011) • 2. Gluing of Flexible board • to Rigid board (Glue UP10-14-2) • 3. Mounting of SMD on flex-mounts to Flexible-rigid board. • US-bonding: 6 x 4 = 24 bonds • and bonds protection • (Glue EpoTec T7110) • 4. Mounting of ERNI on flex-mounts • to Flexible-rigid board. • Gluing, US-bonding: • 64 x 8 = 512 bonds, • soldering and bonds protection • (Glue EpoTec T7110) Trough window for sensor mounting “Balconies” Dubna, October, 2008 e-mail: borshchov@kharkov.ukrtel.net

  11. MODULE ASSEMBLING – PART 3MOUNTING OF SENSOR ASSEMBLY TO BOARD • 1. Soldering of LEMO connectors • to Flexible-rigid board. • 2. Mounting of Sensor assembly • to Flexible-rigid board. • Gluing (GlueAraldite2011), • US-bonding: 130 x 4 = 520 bonds • and bonds protection • (Glue EpoTec T7110) As a result of activity were manufactured: 1 technological and 2 working modules. (Total of bonded connections at one module 1600) Dubna, October, 2008 e-mail: borshchov@kharkov.ukrtel.net

  12. TECHNOLOGICAL FEATURES OF ASSEMBLY Bonding of Cable to Sensor (N-side) Bonding of Cable to Flexible-rigid board Bonding of Cable to Sensor (P-side) • Pool strength: • - Cables to sensor (N-side): 6-7 gram ; • Cables to sensor (P-side): 7-8 gram ; • Cables to board: 10-11 gram. • Three types of wedges (Gaiser Tool ) • for single-point TAB bonding: • - Cables to sensor – GT1183-01710B; • Cables to board – GT1183-02205B; • Flex-mounts to board – GT1183-04010B. Dubna, October, 2008 e-mail: borshchov@kharkov.ukrtel.net

  13. TEST MODULE FOR CBM01B2 BABY-SENSOR RADIATION TEST Front side Back side We hope, that the experience, acquired by us, at development of a design, improvement of assembling technique and manufacture of test module on the basis of flexible-rigid boards will be useful for collaboration in the future for next investigations of baby sensors for CBM and NICA. Dubna, October, 2008 e-mail: borshchov@kharkov.ukrtel.net

  14. ACTIVITY ON THE DEMONSTRATOR Nr.1SELECTION OF VARIANT Conceptional design of the mechanics of the CBM STSladder (for Demonstrator Nr.1) offered by S.Igolkin Option 1: “Old” Option 2: “Angle tiling” Option 3: “Flat tiling” Dubna, October, 2008 e-mail: borshchov@kharkov.ukrtel.net

  15. OPTION 3:ADVANTAGES AND LIMITATION • In our opinion, from the point of view of usage the flexible aluminium – polyimide cables and manufacturability of Modules & Ladders assemblies, most reasonable looks Option 3 “Flat Tiling”- with flat arrangement of sensors with overlapping, but without a bend of a cable. • Limitations for Option 3: • - The gap between sensors for the safe passing of a cables: • The gap offered on the drawing 0,5 mm is reasonable. • - The gap between sensors and frame: • The gap offered on the drawing also is reasonable (minimum gap 2mm at placing one cable; maximum gaps of 5,2 mm and 4,4 mm at placing seven cables). • The gap between sensors for in Module : • The gap offered on the drawing 0,5 mm. • For determination of gap between sensors in Module (the connection of sensors by daisy-chain cables) it is necessary to select variant of strip arrangement in a sensor (for both sides). Dubna, October, 2008 e-mail: borshchov@kharkov.ukrtel.net

  16. SENSOR TOPOLOGYPROPOSAL From the point of view of further assembly of sensors in modules, the optimal variant would be changing of strip rotation: from 15 on Р-side and 0 on N-side to 7,5 on both sides . Thus width of bonding contact pads is necessary to reduce from 80um up to 60um, that will allow to arrange bonding contact pads in parallel to sides of a sensor. It considerably will simplify further assembly, and also will allow to utilize identical cables for N- and P-sides with straight lines. In case of arrangement of contact pads with angles 0 and 15 will be necessary to use one cable with straight lines and second - with rotatedlines 15 (that not manufacturability at pitch of lines 50-60um . Besides the adjustment of cables with a sensor on rotated pads is more difficult than on pads which are placed parallel to sensor side. Dubna, October, 2008 e-mail: borshchov@kharkov.ukrtel.net

  17. Kind of connectionsof Daisy-chain cables to sensor (Demonstrator Nr.1) Variant of commutation for sensors with 7.5 and 7.5 degrees strip rotation. Sensor bonding area TAB-bonding (Pitch 60um) Dubna, October, 2008 e-mail: borshchov@kharkov.ukrtel.net

  18. Kind of connectionsof Analog cables to FEB (Demonstrator Nr.1) Kind of connection with using of pitch-adapter will ensure fan-in of Analog cable traces pitch from 120 microns to chip pads pitch 50 microns. In this case the Analog cable can be TAB-bonded to pitch-adapter pads; and the chips can be wire-bonded to pitch-adapter pads. Analog cable bottom layer Analog cable top layer Pitch-adapter Input: Pitch 60 um (two rows at 120um) Output: Pitch 50.7 um (two rows at 101.4um) TAB-bonding (Pitch 120um) Wire-bonding (Pitch 50.7um) Sensor Double-deck analog cable Front-End Board Dubna, October, 2008 e-mail: borshchov@kharkov.ukrtel.net

  19. TYPES OF FLEXIBLE CABLESFOR DEMONSTRATOR NR.1 Demonstrator Nr.1 will need development of following flexible cables: 1. Daisy-chain cable: 2 types; 2. Analog cable: min 16 types (or 32 types). Daisy-chain cable Material: foiled dielectric FDI-A-20 thickness: of Al layer  10 um of polyimide layer 10 um • Pitch of trace 60 um • Width of trace 20 -30 um Sensor bonding area • Quantity of traces1024 (+bias?) Analog cable Hybrid bonding area (adapter?) Material: foiled dielectric FDI-A-24 thickness: of Al layer  12 - 14 um of polyimide layer 10 um • Pitch of trace 120 um • Width of trace 40 um • Quantity of traces512 (+bias?) Dubna, October, 2008 e-mail: borshchov@kharkov.ukrtel.net

  20. PROBLEMS AND TASKS 1. Select and agree of sensor topology. 2. Select and agreeof ladder arrangement. 3. Select and agreeof connection to FEB. 4. Development and investigation of technological processes for Module & Ladder assembling. 5. Development of flexible cables design. 6. Status of assembling sites for Demonstrator Nr.1? 7. Status of test equipment for testing of module components? Dubna, October, 2008 e-mail: borshchov@kharkov.ukrtel.net

  21. Thank you for your attention Dubna, October, 2008 e-mail: borshchov@kharkov.ukrtel.net

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