1 / 13

Sensor QA at BNL

Sensor QA at BNL. 2004/09/07 Junkichi Asai (RBRC) (Kieran Boyle (SBU)). Contents. Previous Evaluation of Stripixel Sensor Result IV (leakage current –Voltage) CV (Capacitance-Voltage) (at BNL) Preparation Semi-automatic probe station IV measurement with comb type

sturgis
Download Presentation

Sensor QA at BNL

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Sensor QA at BNL 2004/09/07 Junkichi Asai (RBRC) (Kieran Boyle (SBU))

  2. Contents • Previous Evaluation of Stripixel Sensor • Result IV (leakage current –Voltage) CV (Capacitance-Voltage) (at BNL) • Preparation • Semi-automatic probe station • IV measurement with comb type • Effect of grounding other strips on IV measurement • Schedule of sensor QA • Development/production

  3. Setup for IV/CV measurement Dark Box Micro Scope picture Measured Needle to sensor pad Grounded Needle to guard ring Micro Scope Measured Needle Vacuum hole wafer Grounded Needle chuck chuck Bias Voltage Because the pad size so small, the probe needle is contacted the pad of the wafer by watching through the microscope. There are in the Instrumentation Division.

  4. Result : IV/CV measurements We found leakage current in the range of 100’s nA and capacitance in the 10s of pF range. 400um strip sensor

  5. Effect of grounding other strip Micro Scope 100 Grounded Needle to guard ring Measured Needle to sensor pad Leakage current (uA) 10-1 With Grounded Needle to neighbor pad decrease current 10-2 wafer 10-1 100 101 102 103 10-1 Grounded Needle to neighbor pad Bias Voltage (V) chuck • For these measurements, an adjacent channel was grounded. The leakage current decreases by around 1/3. Bias Voltage

  6. Why Semi-Automatic Probe station • With the present manual probe station, measuring one entire wafer (200 measurements) takes ~ 2 weeks. • To speed up, We use the Semi-Automatic Probe Station

  7. GPIB Cable Setup Semi-Automatic Probe station Dark Box Microscope Windows LabView controlled All device through GPIB cable. Ribbon Cable Probe positioner for Guard Ring Probe card Probe stage HV/Ammeter Keithley 6487 Windows LabView sensor chuck Movable stage LCR Meter Agilent 4263B Switch system Keithley 7002 Probe station Early Oct., they will be moved to the RIKEN Lab room in physics building at BNL. In the room, the clean tent will be set up. Then we can start measurement.

  8. 64 x strip needles Probe Card By RUCKER & KOLLS, INC. 80um 330um 64 u strip needles 80um • One needle is used to measure, the other127 are grounded • Measurement all 384 pad of strip with overlap step by step 150um

  9. Semi-Automatic Probe station with Imaging card COMB type sensor u pads The needles contacted with the u pads 64 u needles of probe card Maximum zoom It was pictured by the Imaging card. We can check without looking through the microscope. Check the contacting

  10. IV/CV measurement schematic n Chuck GND Ring n-1 measured Keithley 7002,7011,7153 switch system Keithley 6487 HV/Ammeter Agilent 4263B LCR Meter CV Measurement IV Measurement CV Measurement (Between strip-strip) IV Measurement (Between strip-strip)

  11. Result of IV measurement with Semi-Automatic Probe station Using COMB design for practice

  12. Effect of grounding other strips GND needle: 10 GND needle: 6 GND needle: 14 GND needle: 4 GND needle: 1 GND needle: 2 GND needle: 0 Measured Needles of Probe Card 400um Electric Field

  13. Schedule of silicon sensor • Preproduction Sensor • Soon SINTEF 17 wafers are supposed to arrive at RIKEN, yesterday (9/6) • (500um, STD design, 2 type : sintering process deference) • They will be shipped to BNL and UNM, when clean room ready(?) • End of Sep. 20 sensors from Hamamatsu • (4 type : thickness=(500um, 625um) , design=(STD, New)) • Clean Room • Early Oct. build at RIKEN Lab room in BNL • QA test • Now Programing Semi-Automatic station with LabView • Wiring (probe card, Scanner, HV/Am, LCR…) • should decide how to measurement • Sep. IV/CV measurement at UNM (with probe positoner) • Continue studying sensor response with probe card at BNL • Oct. IV/CV measurement at BNL • All wafers are expected to complete QA in Dec. 2004 or earlier

More Related