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This course provides a detailed exploration of energy-efficient VLSI design techniques, focusing on power and energy efficiency, variability, and performance through parallelism. It includes a lab-intensive curriculum that employs tools like HSPICE and UNIX. Students can choose between an easier project course on sub-threshold multipliers or a challenging real design block project on 65 nm CMOS technology. Key topics are rooted in the evolution of Moore's Law and the "dark silicon" problem, with insights into new methodologies and industry standards.
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ECE 471 / 571 – Energy-Efficient VLSI Design Dr. Patrick Chiang TAs: Neil Glover; Li Hao Winter 2014 Tues/Thurs 12PM-2PM Slides: Courtesy Prof. Nikolic (Berkeley),EECS 151, Spring 2006
Class Logistics • NOTE: Turn in Exam-2 and Final-Project together • OH: TBD • Lab Hours: Fri., Li Hao, Neil Glover • Class is VERY lab intensive • HSPICE, unix, CAD • EXTRA GRADUATE STUDENT PROJECT • Come see me
Two ‘Project’ paths • (1) Easy ‘Project’ course (recommended): • Advantages: • Easy project: sub-threshold 4b multiplier • Tool flow is easier (fictitious 0.25um process) • Cons: • Won’t be able to build a real chip at the end • May not understand the complexity of chip design • (2) Hard ‘Project’ course: • Only the MOST aggressive undergraduates should attempt; • Graduate students are REQUIRED for this. • 65nm-CMOS; • Advantages: • Real design block
Three main issues in technology: POWER and ENERGY-EFFICIENCY VARIABILITY PERFORMANCE through PARALLELISM Big Picture
Original Moore’s Law paper • ftp://download.intel.com/research/silicon/moorespaper.pdf • “Cramming more components onto integrated circuits” • “Heat problem: Will it be possible to remove the heat generated by tens of thousands of components in a single silicon chip?”
Moore’s Law 670x complexity increase in ~ 10 years 2012 Intel-16nm 5M Gates/mm2
More transistors than you have power Gap widening > 100x ‘DARK SILICON’ [2]
Not enough power available Source: Bill Dally, 2011
Need more off-chip bandwidth • nVidia Fermi (2010) Aggregate Microprocessor I/O Bandwidth* GDDR5: 200GB/s • IBM Power-7 (2009) DDR3: 100GB/s Local Links: ~20GB/s *F. O’Mahoney et al, “The Future of Electrical I/O for Microprocessors," VLSI-DAT, 2009.
Cellphones bought in 2013 (growth in 2013) • Desktops/laptops bought 2013 (growth in 2013)