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V. Berardi, P. Colas, R. De Oliveira

Common project : Thin and high-pitch laser-etched mesh manufacturing and bulking Progress report. V. Berardi, P. Colas, R. De Oliveira. RD51 – Stony Brook October 1, 2012. Micromegas meshes. Woven meshes too thick for some applications

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V. Berardi, P. Colas, R. De Oliveira

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  1. Common project : Thin and high-pitch laser-etched mesh manufacturing and bulkingProgress report V. Berardi, P. Colas, R. De Oliveira RD51 – Stony Brook October 1, 2012

  2. Micromegasmeshes • Wovenmeshestoothick for some applications • Need high pitch (>~1000 lpi, 25 microns) to minimize the ion backflow in the LC TPC application • Suchmeshes do not exist in large surfaces (thoughthereisprogress) -> try laser etching

  3. Ultrafast laser drilling • New high-rate ‘fs’ lasers make it possible to drill more perfect holes (no melting) in quantities. • Might replace wet etching for some materials (ceramics) or down to 10 µ diameter Various processes at various time scales fs ps ns µs Laser trepanned hole RD51 Bari WG1

  4. Progress in laser-etchedmeshes First attempt in Februaryusing double-layer of copper -> no signal. The holeswere not open. Verydifficult to ‘peal’ the mesh Second attempt: transparency OK. Need to betested in gas. With the present laser: 10 holes/s. A factor of 5 couldbegained.

  5. Electroformedmeshes Recentlylarger surface wereavailable. Howeverdifficult to manipulate(4 to 5 micron thick) Webought 2x4 meshes. Will makebulks out of them.

  6. Cost for 8 6’’ x 6’’ coppermeshes : 2529 euro wotax. Payedhalf-half by Saclay and RD51. Bothpossibilities have to bepursued (laser etching and electroforming)

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