Systems Miniaturization Tutorial by Luiz Otávio S. Ferreira

1. Tutorials on Systems MiniaturizationLuiz Otávio S. Ferreira - LNLSNovember 28, 2001

2. Outline • Introduction to Systems Miniaturization • Microfabrication Technologies • Microsystems Development and Packaging • Microfabrication in Brazil Luiz Otávio S. Ferreira

3. Introduction to Systems Miniaturization • Microsystems: • Sets of microdevices capable of integrated sensing, analysis and actuation. • Microdevices: • Microstructures capable of actuation, or signal transduction, or chemical reaction, etc. Ivo M. Raimundo Jr. IQ/UNICAMPMUSA2000 Nobuo OkiUNESP Ilha SolteiraMUSA2000 Luiz O.S. Ferreira LNLS Luiz Otávio S. Ferreira

4. Why Miniaturization? • Reduction on mass and size. • Integration with electronics. • Exploitation of new effects due to small size. • Cost/performance advantages. • Improved reproducibility, accuracy and reliability. • Redundancy and arrays. • Low power consumption. • Less material used for manufacturing. • Avoiding of rare or aggressive to environment material. • Easy disposal. Luiz Otávio S. Ferreira

5. Vocabulary • USA • MEMS • Microelectromechanical Systems • Europe • Micro SystemsMicro Systems Technology • Asia • Mechatronics • Micromanufacturing • Other names • Micromechanics • Nanotechnology • Microtechnology • Meso Systems Luiz Otávio S. Ferreira

6. Market Demands on Miniature Systems • Environment • Medicin Technology • Information Technology • Biotechnology • Automotive • Consumer electronics • Projected sales for 2003:32 B$ (US$) Source: Solid State Technology, July 1999, pp. 63-65. Luiz Otávio S. Ferreira

7. Technological Possibilites - 1 • Microtechnology for electronics • Technologies developed or improved on last 20 years: • Silicon crystal production. • Thin film technology. • Lithography and etching. • Modeling. • Characterization. • Non electronic interations: • Springs, membranes, piezoresistive effect, heaters, etc. • Well developed material and technology: low cost if large scale production. • Systems integration. Luiz Otávio S. Ferreira

8. Technological Possibilities - 2 • Full system approach • Technologies for • Assembly • Interconnection • Housing • System integration • Bonding and joining • SMD, COB, TAB, DCA, Wire bonding, Flip Chip • Analysis of the interactions • Reliability • Performance and cost • Volume Luiz Otávio S. Ferreira

9. Technology Adaptation • Old technologies, from micro-electronics and from mechanics, are adapted for use on micro-systems integration. • Some new steps must be developed. • Old materials are used on new ways: different properties. • Only a whole system approach leads to effective systems. • Numerical analysis of interdependencies. Luiz Otávio S. Ferreira

10. Why Integration? • Better shielding of weak electric signals from sensors. • Individual sensor calibration on factory. Lower calibration cost. • On board intelligence. • Reduction of connection cables. • Standard communication protocols. • Save cost on extra electronics housing. Luiz Otávio S. Ferreira

11. How to Integrate? • Monolithic Integration: • Very difficult and expensive. • Very large scale of production. • Large number of interconnects. • Number of masks. • Time of development. • Yield. • MCM • Hybrid Integration: • In 1997, 8% of the pressure sensors and 12% of the accelerometers where monolithically integrated. Luiz Otávio S. Ferreira

12. Product Oriented Approach • Problem and product oriented approach: YES! • Technology oriented approach: NO! • Technology: manufacturability. • Important technologies are not silicon based: • Mechanical micromachining. • High aspect ratio microstructuring (LIGA). • Replication methods: • Electroplating, • Injection molding. • Hot embossing. Luiz Otávio S. Ferreira

13. Availability of Production • Many prototypes of sensors. • Small number on the market. • Prototyping labs are not equipped to make 100,000 devices batchs. • Moving the prototype to a foundry implies on starting again from the scratch. • Orders of less than 250,000 devices are not attractive to silicon foundries. • Multi-User prototyping approach (The MUSA Project). Luiz Otávio S. Ferreira

14. COSTS • CMOS foundry for monolithically integrated sensors: US$30 Millions. • Micromechanical parts line (if the ion implantation is made externally): US$4 Million. • Hybrid integration (assembly and thick film line): US$1 Million. • CMOS processed silicon: US$ 2.5 to 8. Cent per mm2 = US$750 to 2100 for a processed 20cm waver. • Sensor process: US$0.35 per mm2 for batch of more than 50,000 chips. • Surface micromachining; US$1.80 per mm2 for 10,000 Chips batch, and 30 cents per mm2 for 500,000 chips batch. • Less than 1 Million chips per year is a risk. • Bellow 10,000 chips a year: a big problem. Luiz Otávio S. Ferreira

15. People Demand • 1996: total= 48,000 • USA Japan Europe • 29,000 13,000 6,000 • 2002: projected total=100,000 Luiz Otávio S. Ferreira