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Gigatracker tasks. presented by A. Kluge CERN/PH-ESE February 2, 2010. GTK system block diagram for one station. GTK station inside vacuum. GTK module. wire bond pads. NA62 trigger. NA62 DAQ. common HV/ LV ground. vacuum feed through. GTK station interface.

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gigatracker tasks

Gigatracker tasks

presented by A. Kluge

CERN/PH-ESE

February 2, 2010

slide2

GTK system block diagram for one station

GTK stationinside vacuum

GTKmodule

wire bond pads

NA62 trigger

NA62

DAQ

common HV/ LV ground

vacuum feed through

GTK station

interface

humidity &ext. temp sensor

GTK read-out

electrical/

optical conversion

GTK stationout of vacuum

GTK service area

NA62 trig/DAQ&Read-out

20-40 MultiGigabit optical data fibers

10 optical status fibers

10 x (2.5V+1.2V)+1 HV

10 x (ASIC temp sensor+1 ext. temp+humidity sensor

10 optical configuration fibers

GTK

cooling plant

mechanics

control

LV power

HV power

GTK DCS

interlock system

NA62 DCS

GTK service area

r d plan
R&D plan

Specifications & feasibility studies

ASIC & sensor & assembly

Electro-mechanical integration & mechanics & cooling

Off-detector read-out electronics, interlock, power supply, cabling, DCS software

A. Kluge

r d plan1
R&D plan

Specifications & feasibility studies

ASIC design & prototypes

2 demonstrator ASIC design & production

2 ASIC demonstrator lab evaluation

Off-detector read-out electronics, interlock, power supply, cabling, DCS software

Electro-mechanical integration & mechanics & cooling

2 ASIC demonstrator bump bonding

2 ASIC demonstrator laser test

GTK ASIC architectural choice

2 ASIC demonstrator beam test

GTK ASIC design & production

A. Kluge

r d plan2
R&D plan

Specifications & feasibility studies

GTK ASIC design & production

GTK ASIC lab evaluation

GTK ASIC single chip bump bonding

Off-detector read-out electronics, interlock, power supply, cabling, DCS software

Electro-mechanical integration & mechanics & cooling

GTK single laser (&beam) test

GTK ASIC resubmission ?

GTK assembly bump bonding

GTK assembly laser (&beam) test

GTK assembly production

A. Kluge

r d plan3
R&D plan

Specifications & feasibility studies

Cooling prototypes – micro channel & vessel

Cooling/vacuum test stand design & constr.

Electro-mechanical design & prototype

Off-detector read-out electronics, interlock, power supply, cabling, DCS software

Electrical/cooling test with single assembly

ASIC & sensor & assembly

Electrical/cooling test with full assembly

A. Kluge

slide10

Demonstrator test

    • ASIC EOC electrical test
    • ASIC pTDC electrical test
    • Laser test system construction
    • ASIC EOC laser test
    • ASIC pTDC laser test

A. Kluge

slide11

Test beam preparation

    • read-out preparation
    • mechanics preparation
    • software preparation
    • test beam
    • test beam analysis

A. Kluge

slide12

Demonstrator re-submission

    • EOC design analysis
    • EOC layout changes
    • EOC ASIC submission & production
    • EOC electrical test
    • pTDC design analysis
    • pTDC layout changes
    • pTDC ASIC submission & production
    • pTDC electrical test

A. Kluge

slide14

GTK ASIC

    • GTK ASIC layout design
    • GTK ASIC submission & engineering run
    • GTK ASIC carrier card design
    • GTK ASIC carrier card layout
    • GTK ASIC carrier card construction
    • GTK ASIC test read-out card
    • GTK ASIC electrical test
    • GTK ASIC laser & source (bump bonding) test
    • GTK ASIC layout analysis
    • GTK ASIC layout improvements
    • GTK ASIC engineering run 2
    • GTK ASIC electrical test 2
    • GTK ASIC laser test 2

A. Kluge

slide15

GTK ASIC production test

    • GTK ASIC wafer/chip probing station construction
    • GTK ASIC wafer/chip probing station mechanics design
    • GTK ASIC wafer probe card design & construction
    • GTK ASIC wafer probe automatic test procedure
    • GTK ASIC wafer/chip probing test

A. Kluge

slide16

Bump bonding & assembly

    • Dummy bump bonding
    • Demonstrator bump bonding
    • GTK ASIC single chip bump bonding
    • GTK ASIC prototype assembly bump bonding
    • GTK ASIC assembly bump bonding
    • GTK assembly test (laser & source)

A. Kluge

slide17

GTK interface card

    • GTK interface studies
    • GTK interface specifications
    • GTK interface layout design
    • GTK interface prototype design
    • GTK interface layout improvement
    • GTK interface cards final design

A. Kluge

slide18

GTK mechanics

    • GTK mechanics design
    • GTK mechanics construction
    • GTK mechanics assembly

A. Kluge

slide19

Module (Mechanics&Cooling&Assembly&Interface card)

    • Module design
    • Prototype module construction
    • Module test – where?
    • Module construction
    • Production module test

A. Kluge

slide20

GTK cooling

    • vessel cooling studies
    • vessel cooling prototype
    • microchannel cooling studies
    • microchannel cooling prototype
    • GTK design choice
    • GTK cooling construction
    • Power supplies

A. Kluge

slide21

Interlock

    • Interlock design
    • Interlock ordering & installation
    • Interlock software

A. Kluge

slide22

GTK Read-out board

    • Hardware system simulation
    • Read-out board specification
    • Read-out board schematic
    • Read-out board RTL&FPGA simulation
    • System & board level RTL simulation
    • Read-out board layout
    • Read-out board construction
    • Read-out board test
    • Read-out board schematic/layout changes
    • Read-out board final construction

A. Kluge

slide23

GTK DCS software

    • ASIC Prototype read-out board DCS
    • GTK DCS
    • GTK online data display & consistency check
  • How it the detector specific DCS integrated in the NA62 environment?

A. Kluge

slide24

Sensors

    • Sensor design
    • Sensor construction
    • Sensor test

A. Kluge

conclusion
Conclusion
  • Tasks identified
  • Man power needs to be assigned realistically
  • Tasks need to be run in parallel

A. Kluge