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Research activities at ITA for future accelerator

Research activities at ITA for future accelerator

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Research activities at ITA for future accelerator

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  1. Research activities at ITA for future accelerator M. C. Esteban

  2. Outline • Introduction • ILC:FTD detector • Activities • Projects & contributions • SLHC: CMS Tracker upgrade detector • Activities • Projects & contributions • SuperKEKB: DEPFETdetector • Activities • Projects & contributions • ITA HEP group

  3. Introduction ITA has been working in HEP since 2008 • Two main working areas: • Electromagnetic compatibility issues • EM noise characterization of new technologies for HEP • Power supply distribution systems • Several topologies has been studied • Serial powering & DC-DC powering (SLHC) • Power pulsing (ILC) • Both issues (EMC & PS) have been tackle at the same time to ensure the correct integration of electronics at system level • It will help to implement a robust system by design

  4. Introduction • Our work has been focused on three future accelerators: • ILC: Sub-detector FTD (ILD) • SLHC : Sub-detector Tracker upgrade (CMS upgrade) • SuperKEKB: Sub-detector DEPFET (Belle II)

  5. ILC: FTD detector • The mstrip-FTD system is a silicon strip tracker located in the innermost part of the tracker region of the ILD. • It constitutes of 10 disks.

  6. ILC: FTD detector • Main working areas : A. Power supply distribution design: • Power estimation B. Analysis of power pulsing effects in the power supply distribution system: • Transients • EMI The analysis of both powering aspects will define the optimal power supply topology

  7. ILC: FTD detector - Main Power design parameters A. Power consumption : • The total number of strips is higher than a million • Non –uniform distribution • Total current consumption of FTD is around 650 A • Currents consumption of FTD per power group

  8. ILC: FTD detector - Main Power design parameters B. Analysis of power pulsing effects in the power supply distribution system: • The ILC accelerator has a duty cycle of 0.5% • 1 ms bunch train every 200ms • If the power demanded by the FEE is synchronized to the bunch train, it helps to save energy • Energy dissipated will be lower • However several important issues have to be considered during the design of the power system: • Transient phenomena • EMI phenomena • All these phenomena have an impact in the design of the power supply distribution system • Topology • Cooling and material budget

  9. ILC: FTD detector - Main Power design parameters Transients • Power consumption • 1 ms bunch train every 200ms • V= 1,25 V; I= 12 A Voltage • Voltage compensation may be required • Cable resistance • Over-voltages and Voltage dips may be present • Cable inductance

  10. ILC: FTD detector - Main Power design parameters EMI • The synchronization of the FEE power operation with the bunch crossing introduces a current periodic signal with a spectra content in the power supply system. • The spectra content varies between few Hz up to several hundreds of kHz • LF- Problematic due near field : Magnetic field • Every 5 Hz a pulsing magnetic field higher than 0.2 A each • Itotal = 40 x 0.2 A = 8 A • It may cause mechanical problems • Vibrations – wire bounding degradation

  11. ILC: FTD detector - Power supply topology • There are several topologies that may be implemented in the FTD. • DC-DC based power distribution • Local LV RAD-hard regulators • Remote power supply • Each of them has advantages and disadvantages • We consider DC-DC as the first option of analysis: • To absorb transients associate to power pulsing system. • Keep transients locally at FEE level. • Low currents before DC-DC due to converter ratio • Low transients • Synergy with SLHC and new DC-DC hard-rad design. • HF noise & Rad issues

  12. ILC: FTD detector - Power supply topology

  13. ILC: FTD detector – Projects & Contributions • FTD detector studies since 2011 • Projects • I+D en Detectores para Futuros Colisionadores: FPA2010-22163-C02-01 (Ip: I.Vila) 2011- 2013 • Estudios de EMC en nuevos detectores • ITA HEP activities (2008-2011) • Contributions • Linear Collider Power Distribution and Pulsing workshop May 9 -10 in Paris (LAL Orsay). • “Powering requirements and constraints of the Mstrip-FTD detector” • Oral presentation

  14. SLHC: CMS Tracker upgrade Upgrade / Future detectors Today • New FEE requirements forces to install DC-DC converters close to FEE (inside sub-detector modules). • The high current demanded by each power channel • Low voltage : 2.5 V change to 1.1 V (Power is ≈ constant) • It is defined by chip technology (250nm → 130 nm) • However DC-DC converters are a very noise source • It is necessary minimize the noise coupling between FEE – DC-DC units • It is necessary to minimize the total noise inside sub-detector volume • A large R&D effort is planned and taking place to develop a DC-DC switching converter to operate under high magnetic field with low noise emissions inside tracker volume • However a EM noise studies at system level are required

  15. SLHC: CMS Tracker upgrade • Main working areas: • Electromagnetic compatibility issues (EMC) • Grounding & shielding issues (G&S) • Power aspects (PS) • Serial & DC-DC converters evaluation

  16. SLHC: CMS Tracker upgrade • Working line details • Study and analysis of noise generation and distribution at the system level and define critical points of the system integration strategy. • Power network impedance effects on noise emissions of DC-DC converters • Study of noise propagation effects in power network. • Noise immunity test in FEE prototypes. • Definition of FEE immunity levels • New and/or old FEE • Radiation effects on EM noise emissions of DC-DC converters • The main goal of these studies is to establish the EMC rules to be applied during the design and integration of the tracker sub-system up-grade. • Define a robust topology of Tracker upgrade system by design

  17. SLHC: CMS Tracker upgrade – EMC characterization of FEE EMC characterization of FEE Old Tracker MEDIDAS MATLAB COMSOL SIMULACION

  18. SLHC: CMS Tracker upgrade – PN impedance effects Power network impedance effects on noise emissions The aim is to define and characterize the impedances connected to the DC-DC power converter • It defines the noise (conducted and radiated) levels emitted by the DC-DC power converters AT SYSTEM LEVEL • Characterization of the electromagnetic environment • Impedances ( FEE & Power Bus) • Multiple units

  19. Introducción SLHC: CMS Tracker upgrade – PN impedance effects 18 SIMULACION MEDIDAS MODELO REAL

  20. SLHC: CMS Tracker upgrade – Project & Contributions SLCH detector upgrade studies since 2008 • Projects • I+D en Detectores para Futuros Colisionadores: FPA2010-22163-C02-01 (Ip: I.Vila) 2011- 2013 • EMC immunity studies for CMS tracker upgrade - CMS9.04: Ip (F.Arteche e I.Vila) – (2010-2012) • I+D en detectores y estudios fenomenológicos para el colisionador Lineal Internacional : FPA2007 – 66387 (Ip: I Vila) - (2007-2010) • ITA HEP activities (2008-2011)

  21. SLHC: CMS Tracker upgrade – Project & Contributions • Conferences TWEPP 2008, September, Naxos (Greece) • “Detector noise susceptibility issues for the future generation of High Energy Physics Experiments”. TWEPP 2009, September, Paris (France) • “Interference coupling mechanisms in Silicon Strip Detector – FEE - CMS tracker “wings”: A learned lesson for SLHC”. • “DC-DC switching converter based power distribution vs Serial power distribution: EMC strategies for tracker upgrade TWEPP 2010, September, Aachen (Alemania) • EMC studies for CMS tracker upgrade.Status & Plans • JCR paper • Global noise studies for CMS Tracker upgrade , Journal of Instrumentation Dec. 2010 • Workshops • CMS power task force meetings • ATLAS & CMS upgrades meetings • Tracker upgrade meeting – Power group

  22. SuperKEKB : DEPFET detector – Belle II • FEE (Sensor, DCD,DHP,DHH) • It may be sensitive to EM noise • It may radiates ( HF clocks and signals) • Power supplies • It emits EM noise • Cable & connectors • It may propagate EM noise inside/outside FEE area

  23. SuperKEKB : DEPFET detector – Belle II • Main working lines are: • To systematically approach the grounding design • To quantify the immunity /emission of the electronic systems. • The main goal is: • Conduct studies and measurements to establish a map of EM emissions and susceptibilities of sensitive electronics. • Safe DEPFET electronics integration. • This is the first time that this kind of mapping will be implemented in a pixel detector • Studies conducted previously in Trackers and calorimeters

  24. SuperKEKB : DEPFET detector – Belle II • Main activities: • Grounding and shielding strategy for DEPFET: Coordination & Policy • Immunity issues of DEPFET FEE: Susceptibility curves of DEPFET system. • Noise emissions of PS units: FEE noise immunity and PS noise emission coordination • Noise coupling path characterization between FEE and Power units: Noise propagation issues

  25. SuperKEKB : DEPFET detector – Immunity issues of DEPFET System • The main goal of this activity is to define the susceptibility level of DEPFET FEE to • Radio frequency perturbation • Transient perturbation. • A set of test will be performed in an EMC unit • Immunity test to RF disturbances • Transients immunity test

  26. SuperKEKB : DEPFET detector – Immunity issues of DEPFET system • This EMC unit is defined by the minimum structure that may obtain good results to extrapolate results for the whole detector (same topology) CMS HCAL: 1RBX (12 channels) CMS Tracker: 1Petal (6000 channels) …¿¿DEPFET ??... 1 Module /half ? Power supply DAQ system.. Test set –up preparation complex

  27. SuperKEKB : DEPFET detector–Projects & Contributions • DEPFET project since 2010 • Projects • I+D en Detectores para Futuros Colisionadores: FPA2010-22163-C02-01 (Ip: I.Vila) 2011- 2013 • EMC studies for DEPFET pixel detector, Research project – Max-Planck Institute & ITA (2011-2013) • ITA HEP activities (2008-2011) • Contributions • 4th International Workshop on DEPFET Detectors and Applications, Ringberg Castle ,- 2-5  May  2010 • Grounding & Shielding: Main issues (Oral presentation) • 7th International Workshop on DEPFET Detectors and Applications, Ringberg Castle ,- 9-10  May  2011 • EMC DEPFET Project: A general overview (Oral presentation)

  28. ITA - HEP group • The HEP studies at ITA are carrying out by Electrical engineering group. • Electromagnetic compatibility characterization & electronics integration. • Developing new solutions to optimize the energy efficiency and performance of systems mixing new technologies. • Team coordinator: • Dr. Fernando Arteche • Close collaboration with other groups involved in HEP detectors designs • SPAIN • CNM & IFCA • Abroad • Max-Plank Institute, CERN, Aachen , FERMILAB & SLAC

  29. ITA - HEP group • EMC - Facilities • Faraday cage • One semi-anechoic chamber • Spectrum analyzers • Current probes & Antennas • Surge & Burst & ESD generators • Amplifiers (kHz-GHz) • Electronic Lab - Facilities • Boards designs • Power supplies • Programming controllers • Sofware • Pspice • Matlab • COMSOL

  30. ITA - HEP group FUTURE …. New 10m Semi- Anechoic Chamber !!!! (Inves. 1.5 M€- 2012) – APPROVED