'Type die level packaging' presentation slideshows

Revenue Analysis for Global semiconductor packaging and assembly equipment market upto 2020

Browse more information @ http://tinyurl.com/zo2mzcl For an integrated chip (IC) to function, it needs to be connected to the package or connected directly to the printed circuit. This involves dicing, wire bonding, and die bonding. This entire process is known as semiconductor packaging and assembly, which is the back-end process of chip formation. The increasing application of semiconductor ICs across many segments has increased the demand for semiconductor packaging and assembly equipment.

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