'Ti ni ti ni' presentation slideshows

Weekly Report

Weekly Report. Renjie Chen Supervisor: Shadi A. Dayeh. Summary. In the past week, I was working on the project of high-density neural probes. There were some problems in the fabrication process, related to the nickel silicide bonding and Si RIE/ICP etching.

298 views • 9 slides

RIE/ICP=30/1500 W

218 views • 4 slides

New Photo-mask before bonding

New Photo-mask before bonding. Overlap region can be seen with even eyes Good for Si piece alignment while bonding . Center was over exposed with 15nA writing. Si was firmly bonded. Metal stacking for PL pattern: Ti/Ni=80nm/400nm

138 views • 4 slides