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Strained soi - PowerPoint PPT Presentation


SiGen Equipment & Applications

SiGen Equipment & Applications

SiGen Equipment & Applications. 1. 2. 3. 3. 2. 4. 4. 1. “Thin” Layer Transfer Process. Donor Reclaim. SiGen’s technology enables the transfer of thin layers onto semiconductor or other material substrates. Surface Finish. Cleave Plane Formation. Wafer Bond. Cleave.

★ ★ ★ ★ ★

222 views • 14 slides



SiGen Equipment & Applications

SiGen Equipment & Applications

SiGen Equipment & Applications. 1. 2. 3. 3. 2. 4. 4. 1. “Thin” Layer Transfer Process. Donor Reclaim. SiGen’s technology enables the transfer of thin layers onto semiconductor or other material substrates. Surface Finish. Cleave Plane Formation. Wafer Bond. Cleave.

★ ★ ★ ★ ★

216 views • 14 slides


SiGen Equipment  &  Applications

SiGen Equipment & Applications

SiGen Equipment & Applications. 1. 2. 3. 3. 2. 4. 4. 1. “Thin” Layer Transfer Process. Donor Reclaim. SiGen’s technology enables the transfer of thin layers onto semiconductor or other material substrates. Surface Finish. Cleave Plane Formation. Wafer Bond. Cleave.

★ ★ ★ ★ ★

164 views • 14 slides


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