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Rodel suba iv - PowerPoint PPT Presentation

Thermodynamics in Chip Processing II

Thermodynamics in Chip Processing II. Terry A. Ring. CVD. Materials Deposited. Dielectrics SiO2, BSG Metals W, Cu, Al Semiconductors Poly silicon (doped) Barrier Layers Nitrides (TaN, TiN), Silicides (WSi 2 , TaSi 2 , CoSi, MoSi 2 ). Deposition Methods. Growth of an oxidation layer

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Rodel suba iv - PowerPoint PPT Presentation

Thermodynamics in Chip Processing II