'Packaged' presentation slideshows

Current Challenges of Semiconductor Technology in the Nanometric Generations

Current Challenges of Semiconductor Technology in the Nanometric Generations. Exploratrory Workshop, Romanian R&D in Diaspora 17 September 2007, Bucharest, Romania. Dr. Andreas Wild Director, Technology Solutions Organization EMEA. Content. Scaling More Moore Lithography

554 views • 41 slides

Food Labelling 101

329 views • 21 slides

Duplexed FGFS

Duplexed FGFS. Engineered Systems Engineered Products Filtration Services. National Filtration Systems, Inc. HYCOA Anderson Separators Divisions of The Clark-Reliance Corporation. New Brochure. Engineered Systems. Generally considered skidded systems

314 views • 19 slides

LGP Supreme (Full Factory Graded to all aspects BS5534:2003+A1:2010 ) Size: 25mm x 38mm

156 views • 5 slides

LGP Supreme (Full Factory Graded to all aspects BS5534:2003+A1:2010 ) Size: 25mm x 38mm

155 views • 5 slides

T-17 Patch

T-17 Patch. 100% Reactive, Pre-Packaged, Two-Component, Material System For New Construction or Rehabilitation of Older Structures Can be Used for Patches, Headers and Bearing Pads Also Used for Partial or Full-Depth Patching in a Single Pour. Methyl Methacrylate Polymer Concrete.

142 views • 2 slides