'Opensource hardware' presentation slideshows

Block-level Designs of Die-to-Wafer Bonded 3D ICs and Their Design Quality Tradeoffs

Block-level Designs of Die-to-Wafer Bonded 3D ICs and Their Design Quality Tradeoffs. Krit Athikulwongse , Dae Hyun Kim, Moongon Jung, and Sung Kyu Lim School of Electrical and Computer Engineering, Georgia Institute of Technology National Electronics and Computer Technology Center

470 views • 33 slides