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Modeling Interfacial Flux Layer Phenomena in the Shell/Mold Gap Using CON1D

Modeling Interfacial Flux Layer Phenomena in the Shell/Mold Gap Using CON1D

Modeling Interfacial Flux Layer Phenomena in the Shell/Mold Gap Using CON1D. Ya Meng Department of Materials Science &. Engineering University of Illinois at Urbana-Champaign October 15, 2002. Outline. Improvements to CON1D7 Ideal mold taper Funnel mold Specific heat in mushy zone Others

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493 views • 37 slides
Absorption

Absorption

Absorption. Definition Equipment Packing materials Design considerations: Mass balance High gas flow Mass flow Concentrated systems HTU and NTU. Reading: Chap. 13. img.alibaba.com/photo/50678451/Ceramic_Metal_... . Definition.

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987 views • 20 slides
Precautions to Take When Cleaning Liquid Soldering Flux

Precautions to Take When Cleaning Liquid Soldering Flux

Flux application is an integral part of the overall soldering process. It is necessary because it ensures that oxidation and contamination of PCB surfaces and components don’t end up hampering the creation of a good solid solder bond.

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25 views • 1 slides
All You Need to Know About NoClean Solder Paste

All You Need to Know About NoClean Solder Paste

Solder paste is important in the assembly of printed circuit boards for electronic devices. It is not merely an adhesive, but a material that enables electrical connections between the parts of the board. During application, it is typical for the paste to leave a residue, which needs to be removed or cleaned up to reduce defective circuits.

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18 views • 1 slides

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