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3d integration technology - PowerPoint PPT Presentation

Block-level Designs of Die-to-Wafer Bonded 3D ICs and Their Design Quality Tradeoffs

Block-level Designs of Die-to-Wafer Bonded 3D ICs and Their Design Quality Tradeoffs. Krit Athikulwongse , Dae Hyun Kim, Moongon Jung, and Sung Kyu Lim School of Electrical and Computer Engineering, Georgia Institute of Technology National Electronics and Computer Technology Center

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3d integration technology - PowerPoint PPT Presentation

Block-level Designs of Die-to-Wafer Bonded 3D ICs and Their Design Quality Tradeoffs