tem tps trr l.
Skip this Video
Loading SlideShow in 5 Seconds..
TEM/TPS TRR PowerPoint Presentation
Download Presentation

Loading in 2 Seconds...

play fullscreen
1 / 39

TEM/TPS TRR - PowerPoint PPT Presentation

  • Uploaded on

Gamma-ray Large Area Space Telescope. TEM/TPS TRR. GLAST Large Area Telescope: Presented by G. Haller SLAC haller@slac.stanford.edu (650) 926-4257. Contents. Introduction Overview Significant Changes since CDR Objectives Status Requirements/Verification EGSE and Test-Procedures

I am the owner, or an agent authorized to act on behalf of the owner, of the copyrighted work described.
Download Presentation

PowerPoint Slideshow about 'TEM/TPS TRR' - sage

An Image/Link below is provided (as is) to download presentation

Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author.While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server.

- - - - - - - - - - - - - - - - - - - - - - - - - - E N D - - - - - - - - - - - - - - - - - - - - - - - - - -
Presentation Transcript
tem tps trr

Gamma-ray Large Area Space Telescope


GLAST Large Area Telescope:

Presented by G. Haller



(650) 926-4257

  • Introduction
    • Overview
    • Significant Changes since CDR
    • Objectives
    • Status
  • Requirements/Verification
  • EGSE and Test-Procedures
  • Verification Test Plan and Flow
    • At Assembly Vendor
      • Test-plan and Flow
      • Facility
      • Man-Power
      • Quality Assurance
      • Vibration
    • At SLAC
      • Test-plan and Flow
      • Thermal Vacuum Test
      • Mass Property
      • EMI/EMC (at sub-contractor)
      • Man-Power
      • Quality Assurance
  • Equipment Calibration/Safety
  • Risk Assessment
  • Schedule
  • Status of Procedures
  • Issues and Concerns
lat electronics
LAT Electronics

TKR Front-End Electronics (MCM)

ACD Front-End Electronics (FREE)


CAL Front-End Electronics (AFEE)

16 Tower Electronics Modules & Tower Power Supplies


Global-Trigger/ACD-EM/Signal-Distribution Unit*

3 Event-Processor Units (EPU) (2 + 1 spare)

  • Event processing CPU
  • LAT Communication Board
  • SIB

Spacecraft Interface Units (SIU)*

  • Storage Interface Board (SIB): Spacecraft interface, control & telemetry
  • LAT control CPU
  • LAT Communication Board (LCB): LAT command and data interface

Power-Distribution Unit (PDU)*

  • Spacecraft interface, power
  • LAT power distribution
  • LAT health monitoring

* Primary & Secondary Units shown in one chassis

tem tps mounted to cal
TEM/TPS Mounted to CAL

TKR not shown

LAT GRID with 16 CAL/TEM/TPS Modules




tower electronics module
Tower Electronics Module

EM Tower Electronics Module (TEM) before coating/staking

  • Main DAQ module, one on each tower
    • Controls and reads out data from TKR MCM and CAL AFEE front-end electronics
    • Zero-suppresses CAL event data
    • Buffers events in cable ASIC FIFO’s
    • Assembles CAL and TKR event fragments to tower event
    • Transmits data to GASU
    • Contains monitoring and low-rate science circuits
    • LVDS interface to front-end electronics and GASU

TEM Assembly

tower power supply
Tower Power Supply

EM Tower Power Supply (TPS) before coating/staking

  • Tower Power Supply module, one on each tower
    • Input 28V
    • Generates low-noise voltages for
      • TKR (2.65V analog, 2.65V Digital)
      • CAL (3.3V analog, 3.3V digital)
      • TEM (3.3V and 2.5V digital)
      • TKR Bias (20V-140V programmable)
      • CAL (20V to 90V programmable)
    • Temperature sensors

TPS Assembly

tem tps assembly
TEM/TPS Assembly

After TEM and TPS are tested individually, the two modules are mated and the TEM/TPS package is tested



Shown upside-down



changes since tem cdr and power supply delta cdr
Changes since TEM CDR and Power-Supply Delta CDR
  • Power Supply Review from 9-22-03
    • SLAC GLAST web-site -> Electronics & DAQ -> Reviews
  • TEM
    • Modification of FPGA code
      • To fix a couple of bugs
      • To change flow-control slightly to optimize dataflow throughout system
      • Code was reviewed by GSFC reviewer (Dr Rod)
    • Some resistor/capacitor values have changed to optimize monitoring ranges
    • Details of monitoring circuit have changed and a sub-set of current monitoring functions were eliminated
  • TPS
    • Resistor/capacitor changes to optimize circuit performance over temperature
    • Changes in poly-switch values to protect better over temperature (instead of RXE185, split the load into two paths with a RXE110 each), increased the current sensing resistor from a 1W to a 3W resistor.
    • Changed resistor values to
      • Modify TKR 2.5V to 2.65V
      • Decrease maximum CAL Bias from 120V to 90V
    • Changed Zener diodes at Bias output voltage for new max values
    • Changed resistor values to optimize in-rush current level
  • Worst Case Analysis updated to incorporate changes
  • Thermal Analysis from CDR/Delta-CDR remained since changes don’t impact thermal performance
  • Demonstrate that hardware, software, procedures, and support equipment are prepared to support system environmental test
  • Demonstrate that planned and completed testing meets performance and interface requirements
  • Identify and understand all the risks and limitations
  • TRR is not intended to
    • Review TEM/TPS design
    • Review flight readiness
    • Buy-off hardware or software
  • RFA’s should only be of sufficient concern to stop test
    • Prior to start of an given test, any applicable TRR RFAs must be closed
test entrance exit criteria
Test Entrance / Exit Criteria
  • Entrance
    • All required paperwork released and in place
      • Procedures, drawings, etc
    • Test configuration verified and approved
    • Essential personnel in place
    • Pre-test TEM/TPS functional successfully passed
  • Exit
    • As-run procedures completed
    • Correct and accurate application of test environment
    • Test data acquired and archived
    • No damage to TPS/TEM
    • TEM/TPS performance within specification limits
    • Post-test TEM/TPS functional successful
  • 3 TEM/TPS
    • Qualification unit, Tower A, and Tower B units
      • Assembled,
      • Functional tested
      • Ready for environmental test
  • Assembly of balance of 19 TEM and TPS authorized to proceed, but not started yet
    • All parts at assembler
tests to date
Tests To-Date
  • TEM and TPS engineering modules were extensively tested
    • As EGSE in DAQ/CAL/TKR/I&T
      • >50 test-stands were tested with SLAC TPS and TEM Test Procedure
      • TEM and TPS were used to test functionality and performance of TKR and CAL sub-system electronics
        • Met requirements by sub-system
      • CAL performed vibration tests on coated/staked TEM/TPS to CAL levels, passed (exceptions were first modules in-house staked)
    • Additional TEM/TPS tests
      • Informal thermal-vacuum test -40C to 55C, passed CPT
      • Vibration tests of staked TEM/TPS passed DAQ qual levels
    • On test-bed
      • 16 TEM/TPS connected to EM PDU and GASU and to Front-End Simulator modules generating trigger and event-data
      • Run up to 10 KHz data-rates
tests to date con t
Tests To-date (con’t)
    • On fully-instrumented tower
      • 36 TKR MCM’s
      • 4 CAL AFEE’s
      • Ran tests and passed
    • Test results for TEM/TPS performance tests posted for the EGSE TEM/TPS
    • E.g. TEM/TPS delivered to CAL:
      • http://www-glast.slac.stanford.edu/Elec_DAQ/EGSE/CAl-AFEE/cal.htm
    • IO tested to sub-system ICD‘s
    • Configuration and data-taking tested
    • Monitoring functions/performance tested
    • Tested over
      • Frequency (16Mhz to 22 MHz, 20 MHz nominal)
      • Temperature (-40C to 55C)
      • TEM supply range (3.3V +/- 10%, 2.5V +/-10%)
  • One flight PCB TEM/TPS was loaded at SLAC with mostly parts from flight lots, including flight-lot ACTEL FPGA‘s
    • Passed tests from -40C to 55C over voltage and frequency
  • Three TEM and TPS flight modules assembled at flight-assembly vendor individually tested with CPT procedures, over temperature, passed tests
  • LAT-SS-00019 Specifications, Level 3 T&DF Subsystem Specification
  • LAT-SS-00284 Specifications, Level 4 Trigger
  • LAT-SS-00285 Specifications, Level 4 Dataflow
  • LAT-SS-00136 Specifications, Level 3 Power Supply System 
  • LAT-SS-00183 Specifications, Level 4 Power Supply System
  • LAT-SS-05522 Specifications, Level 5 TEM Specification
  • LAT-SS-01281 Specifications, Level 5 TPS ICD & Specification
  • LAT-SS-05533 Specifications, Level 5 TEM/TPS Specification
derived requirements
Derived Requirements
  • LAT-SS-05533 TEM/TPS lists 132 requirements for TEM/TPS package (most are from TEM LAT-SS-05522 (108) with extensions (24) to include TPS requirements for the TEM/TPS package)
  • Verification Matrix gives approach to verify each requirement
    • LAT-TD-05536
    • Lists verification method used
  • Assembly level at which requirement is verified
    • All TEM requirements at TEM assembly level (LAT-SS-05522)
    • ALL TPS requirements at TPS assembly level (LAT-SS-01281)
    • TEM/TPS package requirements at TEM/TPS assembly level (LAT-SS-05533)
system performance
System Performance
  • Level 3 and level 4 DAQ and TRG and power-system requirements are met with a combination of DAQ modules (TEM/TPS, GASU, SIU, PDU, etc), since the DAQ and trigger and power system is comprised of several sub-system module types
    • Level 5 TEM/TPS requirements which are verified are derived from Level 3 and Level 4 DAQ and Trigger and Power system specifications (as noted in the L5 requirements doc)
    • Level 5 requirement doc includes derived requirement addressing
      • Functionality/performance
      • Power
      • Mass/C.G.
      • EMI/EMC
      • Environmental incl temperature and vibration
verification status
Verification Status
  • Engineering Module TEM/TPS
    • EM completed full environmental/functional test program with exception of EMI/EMC, mass, and C.G.
    • Demonstrated compliance with specifications
egse and test procedures
EGSE and Test-Procedures
  • EGSE for Functional/Performance Tests
    • Test-Stand documented in LAT-DS-04085
  • TEM (at TEM module level)
    • TEM Stray-Voltage-Test Procedure LAT-TD-04097
    • TEM Electrical Interface Continuity and Isolation Test procedure LAT-TD-03831
    • TEM Test-Procedure LPT LAT-TD-03415
  • TPS (at TPS module level)
    • TPS Stray-Voltage-Test Procedure LAT-TD-04098
    • TPS Electrical Interface Continuity and Isolation Test procedure LAT-TD-04099
    • TPS Test-Procedure LPT LAT-TD-01652
  • TEM/TPS (at combined unit level)
    • TEM/TPS Performance Test Procedure LAT-TD-01485
verification level module detail
Verification Level – Module Detail
  • Breakout of verification at TEM/TPS Module Level
    • Tests to be conducted after successful TRR
      • At assembly vendor
        • Functional test
        • Vibration
        • Functional test
        • Thermal cycle
        • Functional test
        • Pre-ship review
      • At SLAC
        • Incoming functional test
        • Mass properties
        • Thermal vacuum (in-situ testing)
        • EMI/EMC
        • Functional test
        • Review
        • Deliver to I&T
          • DAQ (out-going) / I&T (incoming) test combined
  • In the following slides first the work/tests at the assembly vendor is defined, then the work/tests at SLAC
at assembly vendor
At Assembly Vendor
  • Test-Stand
    • Supplied by SLAC
    • Operated by SLAC engineers
  • Vibration facility at General Technology
    • Vibration test-procedure
      • http://www-glast.slac.stanford.edu/Elec_DAQ/Reviews/TEM-TRR/SK-282-SLAC-ESS-Procedure-11-03-04.pdf
        • Also includes
          • Thermal test procedures
          • Environmental chamber (thermal/vibration) description
      • SLAC engineers present for vibration tests
  • Work at assembly vendor specified in SOW
    • LAT-PS-02615
process test flow gtc assembly vendor
Process & Test Flow-GTC (Assembly Vendor)
  • See also in more detail in
  • http://www-glast.slac.stanford.edu/Elec_DAQ/Reviews/TEM-TRR/SK-282-SLAC-ESS-Procedure-11-03-04.pdf



Stake HW



Vibration Test

Source inspection

&EIDP review

Functional test



Final functional test

Pack & ship to


gtc environmental test requirements
GTC Environmental Test Requirements

Figure 1. Vibration Levels, Duration, and Spectra

manpower quality assurance at assembly vendor
Manpower & Quality Assurance at Assembly Vendor
  • Man-Power
    • Thermal and vibration test man-power provided by assembler
    • Test man-power supplied by SLAC
      • TEM: L. Sapozhnikov
      • TPS: D. Nelson
      • Test Support: J. Ludvik
    • Quality assurance: see below
  • Quality Assurance
    • Assembly QA by vendor as required by SOW
    • On-site, full-time LAT QA presence (P. Lujan)
    • Required changes to documentation at GTC is immediately documented on an NCMR and forwarded to SLAC for disposition
    • All outstanding changes to documents are incorporated and a new revision released into LAT DOCs prior to final inspection at each manufacturing/test level (CCA, Module, Top Assembly)
at slac
  • After TEM/TPS module has been shipped from assembly vendor to SLAC:
  • Test-Stand
    • Supplied by SLAC, operated by SLAC engineers
  • Work flow
    • Functional Test
    • Mass Property
      • Plus C.G. measurement
    • Thermal Vacuum (in-situ testing)
    • Functional Test
    • Ship to EMI/EMC vendor
    • EMI/EMC test
    • Ship back to SLAC
    • Final functional test
    • Review
mass property
Mass Property
  • Mass properties checked at SLAC
    • Procedure in progress (done at SLAC Metrology)
    • Measured on EM (ref LAT-TD-00564)
      • TEM 2.710 kg
      • TPS 4.340 kg
      • TEM/TPS Total 7,050 kg
      • Allocation 12% above = 7,896 kg
    • C.G. to be measured for the qualification unit
thermal vacuum test
Thermal Vacuum Test
  • Thermal Vacuum facility in Building 33 at SLAC
    • Thermal Vacuum Chamber Operating Procedure LAT-TD-02541 (draft in review)
    • TEM/TPS Thermal Vacuum Test-Procedure LAT-TD-03631 ( draft in review)
    • Chamber was relocated to Building 33 from Central Lab
    • Needs earth-quake securing, in progress (by 1/10)
    • Needs recalibration (by 1/15)
qual and flight acceptance thermal vacuum test
Qual and Flight Acceptance Thermal Vacuum Test
  • See TEM/TPS Thermal Vacuum Test-Procedure LAT-TD-03631

At < 10-5 Torr

manpower quality assurance at slac
Manpower & Quality Assurance at SLAC
  • Man-Power
    • Thermal Vacuum test (R. Williams, J. Ludvik)
    • Test man-power supplied by SLAC
      • TEM/TPS: L. Sapozhnikov, D. Nelson, J. Ludvik
    • Quality Assurance
      • LAT QA already present at SLAC
      • Required changes to documentation is immediately documented on an NCMR
emi emc test
  • Qualification Test (Conductive & Radiative)
    • Sub-contracted to CK Labs
    • Statement of Work: LAT-PS- 04568
      • CE102, CECN, CS102, CSCM, CS06, RE101, RE102, RS101, RS103
    • Detailed EMI/EMC procedure deliverable by vendor (in work)
      • Required to be reviewed/released prior to tests
    • SLAC engineers present at vendor for tests
    • Vendor supplies test-report
    • LAT QA at SLAC present for tests
  • Flight Acceptance Test (Conductive)
    • Performed at SLAC
    • Procedure in work
      • Required to be reviewed/released prior to tests
      • CE102, CS102
    • SLAC supplies test-report
    • LAT QA at SLAC present for tests
problem failure report configuration management
Problem Failure Report/ Configuration Management
  • Problem Failure Reporting
    • Via standard SLAC LAT Non-Conformance Reporting (NCR) System
      • NCR is entered
      • Reviewed/accepted/resolved
        • LAT engineering
        • LAT QC
      • Already exercised during past TEM/TPS assembly
  • Configuration Management
    • Via standard LATDOC system
planned tests
Planned Tests
  • Function/Performance Tests (LAT-TD-01485)
    • Verifies all requirements in LAT-SS-05533 except below
  • Thermal Vacuum Tests
    • Verifies performance/function over temperature
  • Mass/C.G.
    • Verifies/measures mass and C.G.
  • Vibrations test
    • Verifies vibration performance requirements
    • Verifies EMI/EMC performance
equipment calibration
Equipment Calibration
  • Electrical Functional Test Equipment
    • EGSE Test-Stand was certified by SLAC (will be posted on LAT EGSE web-site shortly)
  • EMI/EMC Test Equipment
    • Quantitative measurement equipment (sensors, antennas, etc) calibrated to NIST standards
    • Calibration performed annually
      • All item are (will be) within calibration at time of testing
  • Vibration Test Equipment
    • Accelerometers calibrated against a standard accelerometer traceable to NIST
    • Signal conditioners calibrated annually
  • TVAC Equipment
    • Thermocouples calibrated against standard temperature; calibrated prior to test
    • Thermocouple reader calibrated very 2 years
sub system safety
Sub-System Safety
  • EGSE
    • Safe-to-mate
    • Configuration control
    • Calibration verification
    • Functionality verification with “golden” TEM/TPS prior to test with flight hardware
  • MGSE
    • No custom MGSE
  • Environment
    • Temperature controlled in all test-facilities
    • Cleanliness actively controlled in clean-room; hardware bagged and purged when required
  • Training
    • ESD training completed
    • Clean room training completed
risk assessment
Risk Assessment
  • GTCC/GCCC TEM ASICs qualification program not completed at GSFC
    • No issue to-date
    • Test completion end of February
    • TEM’s use relatively new UMC fabrication-line space-qualified FPGA’s, no flight heritage
  • ESD sensitivity of ASIC’s higher than expected (200V, class 0)
    • Mate-demate and safe-to-mate are of concern when connecting/disconnecting TEM to front-end test (simulator) board. Keep cables as short as possible, apply handling taught in ESD-training, use de-ionizers
  • Schedule
    • Pressure to deliver flight hardware could force less than complete characterization and analysis of modules, could result in replicating a problem in follow-on modules
  • Performance
    • None known
test schedule
  • Depending on assembly vendor, estimate as follows
    • 1/10/05: functional test of qual/TwrA/TwrB
    • 1/11-12/05: vibration test of qual/TwrA/TwrB
    • 1/13/05: functional test of qual/TwrA/TwrB
    • 1/14-15/05: TC of qual/TwrA/TwrB
    • 1/16/05: functional test of qual/TwrA/TwrB
    • 1/17-21: review/shipping
    • 1/24/05: functional test of qual/TwrA/TwrB
    • 1/25/05: mass, c.g. property test of qual/TwrA/TwrB
    • 1/26/05: TV start of TwrA, end Feb 2
    • 2/3/05: EMI/EMC of TwrA, end 2/5/05
    • 2/7/05: TV start of TwrB, end Feb 14
    • 2/15/05: EMI/EMC of TwrA, end 2/16/05
    • 2/15/05: TV start of Qual, end Feb 22
    • 2/22/05: EMI/EMC of Qual, end 3/8/05
status of main test procedures
Status of Main Test Procedures
  • TEM/TPS Performance Test Procedure LAT-TD-01485: released
  • Vibration & thermal cycle procedure
    • GT procedure SK-282-SLAC: approved
    • Qual
      • CKC Lab procedure: will be started 2nd week of January
    • Flight
      • Working together with TKR to get procedure finished by 3rd week of January (procedures are similar)
  • Thermal Vaccum
    • LAT-TD-03631, in draft form
  • All procedures must be released before respective test
issue concerns
Issue & Concerns
  • EMI tests
    • Concern passing qualification tests
  • Schedule
    • Tight
  • Qualification and Flight acceptance tests of flight TEM/TPS are performed with front-end simulators, not with actual CAL or TKR electronics
    • In the planning phase:
      • Taking qualification module after baseline environmental testing is completed
      • Connect it to CAL AFEE / TKR MCM electronics
      • Test over temperature (no vacuum required)
      • Need documentation
    • Possible for every flight modules: schedule issues