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Internal H0/H- dump

Internal H0/H- dump. M. Delonca, C. Maglioni On behalf of EN/STI Thanks to: A. Christov, S. Mathot , C. Pasquino, A. Patapenka. Outline. Issues to be addressed (from last follow-up) Loading cases ( remember) FOMS and choice of material(s) Methods of fixation Space & layout

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Internal H0/H- dump

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  1. Internal H0/H- dump M. Delonca, C. Maglioni On behalf of EN/STI Thanks to: A. Christov, S. Mathot, C. Pasquino, A. Patapenka

  2. Outline • Issues to be addressed (from last follow-up) • Loading cases (remember) • FOMS and choice of material(s) • Methods of fixation • Space & layout • Preliminary analyses : • Instantaneous DT • Transient to steady operation • Steady operation • Does the dump need active cooling ? • Conclusions and next steps C.Maglioni, M.Delonca - Review on PSB 160 MeV H- Injection

  3. From last follow-up C.Maglioni, M.Delonca - Review on PSB 160 MeV H- Injection

  4. Loading cases EDMS 963395 Operation: • Three loading case (following stripping efficiency): • (1) e = 98% (foil operational) • (2) e = 90% (foil degraded) • (3) e = 0% (foil accident) • 4/4 Linac4 Beam loading case (foil accident + distributor failure) -- -- -- -- • Steady-state, 2% all H0, 0.8mA • Steady-state, 10% all H0 , 4mA, 8h max • Transient 1/4 Linac4 pulse, 40mA, 100% H- (interlock after 1 pulse) • not considered C.Maglioni, M.Delonca - Review on PSB 160 MeV H- Injection

  5. Methods of fixation • Shrinking Copper part inserted into Steel flange For both solution: - Copper part inserted into Steel flange Metallization + Brazing C.Maglioni, M.Delonca - Review on PSB 160 MeV H- Injection

  6. FOMS and choice of material(s) To be minimized Ceramic material • Thermal: • Structural: • RP (simplified) • Vacuum: porosity • Electrical Conductivity: < but not too small • Weld-ability: depend on method of fixation C.Maglioni, M.Delonca - Review on PSB 160 MeV H- Injection

  7. FOMS and choice of material(s) Which is an acceptable value ? First test with Al300: possible to be welded to copper (already used at CERN) Alternative solutions ? Note: Boron Nitride and Aluminum Nitride as from first study (EDMS 1073028) C.Maglioni, M.Delonca - Review on PSB 160 MeV H- Injection

  8. Space & layout Area to be modified for the cooling/bake-out of the dump, possibly no feed-through 185-202 mm EDMS 1163508 • The flange has to be adapted to the assembly / fixation / cooling needs of the dump • The instrumentation has to be fixed on the dump (front face) • The dump is one-piece with the flange (ALARA, quick exchange / disassembly) C.Maglioni, M.Delonca - Review on PSB 160 MeV H- Injection

  9. Instantaneous DT – Al300 Case 3 Half dump BOTTOM view, T due to 1/4 Linac4 pulse (3) H- beam 33mrad C.Maglioni, M.Delonca - Review on PSB 160 MeV H- Injection

  10. Instantaneous eq. Stassi – Al300 Case 3 Fixed support from the back Half dump BOTTOM view, T due to 1/4 Linac4 pulse (3) H- beam 33mrad Limit in tension: 184 MpaSafety factor tension: 6.3 Limit in compression: 1840 MpaSafety factor compression: 2.3 C.Maglioni, M.Delonca - Review on PSB 160 MeV H- Injection

  11. Steady operation – Al300 Case 1 Half dump BOTTOM view, DT due to steady-state operation Case 2 Temperature on back-flange ~ 40 mm expansion (case 2) Cooling due to radiation ONLY with Ambient – not conservative Circulating H+ beam H0 beam C.Maglioni, M.Delonca - Review on PSB 160 MeV H- Injection

  12. Transient to steady operation Steady State considering radiation only with ambient – not conservative C.Maglioni, M.Delonca - Review on PSB 160 MeV H- Injection

  13. Does it need active cooling? Detailed analyses are required. • First analysis with no active cooling show good results BUT • Radiation exchange with the ceramic chamber ↗ Steady state temperature in dump • Conduction between Cu insert and Steel flangeDoes the temperature in the back-flangestaywithin acceptable values? C.Maglioni, M.Delonca - Review on PSB 160 MeV H- Injection

  14. Conclusions andnext steps New material configurations are under study: Ceramic dump: reduction of the dump length (avoid the risk of scraping of the H+ beam) Lower degasing / no (or less) baking required wrt Graphite possibility of brazing on Copper/Steel insert (for dump support) – better in case of active cooling  possible only with some ceramics, analysis ongoing low electrical conductivity : theH+ beam continuously charge the dump (H0 H+ from instrumentation on entrance face)  electrical discharge through vacuum? To be studied Need of active cooling system to be detailed Beam instrumentation integration to be taken into account C.Maglioni, M.Delonca - Review on PSB 160 MeV H- Injection

  15. Thank You C.Maglioni, M.Delonca - Review on PSB 160 MeV H- Injection

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