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MAJOR FOL ASSEMBLY EQUIPMENT - PowerPoint PPT Presentation


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WAFER MOUNT TOYO ADTECH FM-508 WAFER SAW ADT 7200 & DFD641 / DFD6361 Alignment precision: ± 1.0µm Alignment Chip size: 0.2mm or more 8 inch max wafer size DELVOTEC 6400 Max 3 mil Al wire DIE ATTACH: AD898 / 830 Placement accuracy ±1mil (±25.4um) Ø rotation ±0.5º @ 3 sigma

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WAFER MOUNT

TOYO ADTECH FM-508

WAFER SAW

ADT 7200 & DFD641 / DFD6361

Alignment precision: ± 1.0µm

Alignment Chip size: 0.2mm or more

8 inch max wafer size

DELVOTEC 6400

Max 3 mil Al wire

DIE ATTACH: AD898 / 830

Placement accuracy ±1mil (±25.4um)

Ø rotation ±0.5º @ 3 sigma

Die size: 0.040x0.040 – 1.0x1.0 inch

Die thickness: 4 mils (100 um) min

Wafer size: 8 inch (200 mm.) max

Bonding accuracy ±0.12mil (±3um)

Transducer Freq 138KHz

BH X-Y Resolution 0.2um

Z Resolution 0.4um

PRS Accuracy +/- 0.37um

Max Wire Length 8mm (315mils)

Min Wire Length 0.5um (0.02mil)

Min Loop Ht 100um (4mils)

WIRE BOND:

EAGLE 60

Max 2 mil Au wire

Epoxy die attach machine with +/-1 mil placement accuracy

MAJOR FOL ASSEMBLY EQUIPMENT

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PACKAGE SAW SINGULATION

Disco DFD641 / 6361

Alignment precision: ± 1.0µm

Alignment Chip size: 0.2mm or more

  • PICK and PLACE
  • ASM CS500 / STI268
  • Programmable X-Y-θ multi-stage ejector table
  • Package dimensional / ball inspection Rotary
  • Alignment and Inspection module
  • Process speed : 5000 UPH
  • Alignment PRS

DTFS: ISIT

MAJOR EOL ASSEMBLY EQUIPMENT

MOLD

ASM IdealMOLD

Clamp Force: 80 tons for 2 strips

Soft-Close: 0.1mm with < 1 ton net force on mold surface

Transfer Force: Max 3 tons

Temp Control: ± 2ºC at mold surface with CPK of 1.67

Speed Control: 0–15 mm/s with 10 steps control

Automatic Substrate Thickness Compensation

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SCREEN PRINT (SEMI-AUTO)

  • Machine: DEK 248
  • Accuracy: 25um @ 3Sigma
  • Capability: 0.3mm pitch QFP; 0402 chips
  • Max Board Size: 500 mm x 450mm

SOLDER PASTE SCREEN PRINTER

  • PICK AND PLACE
  • Machine: JUKI KE-750
  • 14,400 UPH
  • Accuracy:  0.1mm
  • Mounting Angle: 0~359º (1º increment)

CHIP ATTACH IN TNR INPUT

  • REFLOW SOLDERING
  • Machine: HELLER 1500W
  • 5-Zone Top and Bottom Independent
  • Heaters
  • Waterless Cooling System
  • Mesh Belt and Edge Hold Conveyors
  • Heater Temperature Rangeof 350º

SOLDER PASTE REFLOW

MAJOR SMT-COB ASSEMBLY EQUIPMENT

INCOMING QUALITY ASSURANCE

High and Low Power Microscope