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Hyper-threading technology enhances processor performance by allowing a single physical processor to act as two logical processors, optimizing the use of execution units that might otherwise remain idle. It improves performance under specific workloads, resulting in performance boosts of up to 30%. In contrast, dual-core architectures combine two independent processors in one package, enabling parallel processing with high clock speeds. While both technologies offer advantages like reduced power consumption, they require OS support and threaded applications for effective use, and can complicate thermal management and production yields.
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HyperThreading • Improves processor performance under certain workloads by providing useful work for execution units that would otherwise be idle • Duplicates sections of the processor • those that store the architectural state • does not duplicate main execution resources • allows a physical processor to be two ”logical” processors • can schedule two threads or processes simultaneously
When processor stalls • as a result of • cache miss • branch misprediction • data dependency • processor may use those execution resources to execute other processes or threads
Architectural State • Control Registers • instruction flag registers • interrupt mask registers • memory management registers • status registers • General purpose registers (AX, BX, CX, DX, ...)
Improved Performance • Uses 5% of the die area over the “normal” processor • Performance improvements of up to 30%
Dual Core • One which combines two or more independent processors into a single package • Contains two independent microprocessors • Allows thread-level parallelism w/o including multiple microprocessors in separate physical packages • CMP – chip level multiprocessing
Advantages vs SMP • Cache coherency • Can operate at a much higher clock rate than is possible if the signals have to travel off-chip • Less space required • Less power usage
Disadvantages • Requires OS support • Requires threaded applications • Integration of multi-core chip drives production yields down, they are more difficult to manage thermally than lower-density single-chiop