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3C EMS DMS R&D Service Introduction

3C EMS DMS R&D Service Introduction. DMS RD Dept. Updated Date: May, 2012. We specialize in fanless and wide temperature solutions. Our heat dissipation structure has U.S. patent. (Patent No. US7,468,555 B2) It makes our products 100% Fanless. Overview.

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3C EMS DMS R&D Service Introduction

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  1. 3CEMSDMS R&D Service Introduction DMS RD Dept.Updated Date: May, 2012

  2. We specialize in fanless and wide temperature solutions. Our heat dissipation structure has U.S. patent. (Patent No. US7,468,555 B2) It makes our products 100% Fanless. Overview • DMS Team has over 10 years of experience in Industrial PC Field. • We provide industrial grade products and solutions to meet the different extreme and tough environmental conditions. 2

  3. EMS+DMS From Kickoff to NPI Service 3

  4. Supportable DMS Project Type 4

  5. DMS R&D Design Introduction

  6. Embedded Products Top-grade Products Design Material Requirements Others Wide Temperature Design System Test Layout Requirements System Design P.C.B Requirements Signal Measure 6

  7. Design Overview • Components selection • Layout • PCBA Conformal Coating • Silicone for Anti-vibration, Wide Temp in Vehicle Computer • Wide Temperature Design • WideVoltage Design (9-32V) • Water /Dust/ Salt Fog Resistance(Environmental) • Passed MIL-STD-810G Tests • Sunlight Readable Solution • Fanless / Cableless Embedded System Design • Anti-shock & Vibration Embedded System Design

  8. Wide temperature components selection(-30~+70) Material Requirements Quality Improvment Easy Easy Selection Easy Easy Easy Selection Selection Easy POSCAP/TAN Selection Selection Selection Selection Ensures all of the components can work in a wide-temp environment Design phase 8

  9. Wide Temperature Design Quality Improvment Wide Temperature Design High efficientPWMdesign  SensitivePLLcircuit design Hi-speed circuit design Balanceperformance and power consumption Talented Engineer Design phase 9

  10. P.C.B Requirement Quality Improvment • Checks all of the impedance to fit requirements Make PCB phase Slice PCB 10

  11. Thermal Design Truly FANLESS, Patent for Thermal Design

  12. Material Technology Nano Paint: Water proof & Anti-heat Ceramics Paint

  13. Anti-vibration & DropDesign Anti-Vibration, Removable HDD Design Anti-Vibration, Anti-Shock System Design • Fanless(Wide Temp.) • Anti-Vibration(Rugged/IP) MIL-SDT-810F C3 Pass (Operational Vibration)

  14. Crash & Shock

  15. Vibration – Vehicles MPC 900Embedded computer

  16. Vibration – WheeledTrailer / Truck

  17. Vibration – WheeledTrailer / Truck

  18. Industrial Grade Product Design for Mission Critical

  19. Dust & Water Resistance

  20. Sunlight Readable

  21. Signal Measure Quality Improvment • Critical signal’s eye pattern check During system design 21

  22. Verification Requirement Burning & Memory Test Memory Test Burning Test 22

  23. Verification Requirement Power Cycle Test Power Cycle 23

  24. R&D Design Verification Testing Facility

  25. Compelete RD Testing Equipments 25

  26. IR ThermalImage Scan • IR camera: FLIR Thermal CAM SC2000 • Hot spots identified as the monitor points in system thermal test • Hot spots are all under the components thermal specs 26

  27. Climatic Stressing • To simulate the worst environmentalconditions with regard to temperature, humidity, etc. 27

  28. Safety pre-test Dielectric Withstand/Insulation Resistance Test (Hi-Pot test) Ground Bond Tester limited power sources test Touch current test Steady force test Reflection test Enclosure opening test Accessibility test Impact test Stability test 3CEMS Confidential 28

  29. Transprotation Simulation • To simulate transportation impact to provide system /device within good condition during shipping • Vibration • Shock impact • Handling impact 29

  30. Manufacturing Capabilities • Advanced Process Technology • Surface Mounting Technology Process Large Scale SMT CapacityDouble Side Component Capability VAD & RAD Capabilities High Speed & Efficient Machine Multiple & Flexible M/C Combination • Circuit Board Fabrication • Material Bar-Coding System • Automated & Manual Insertion • Automated Conformal Coating • Clean & Lead-Free (RoHS) Process • Specific Testing Service tailored for customers • Full System Assembly

  31. Manufacturing Capabilities World-Class Production Facilities + = State-of-the-Art Test Equipment Latest Manufacturing Techniques Top-Grade Products

  32. DMS Design Capability – ID & ME Embedded Computer / Controller Mobile DVR Digital Signage Rugged Fanless I/O Controller Design Capability for Rugged, Fanless, Cable less, Industrial Embedded I/O Controller & Computers. Rugged Fanless Embedded Computer

  33. DMS Design Capability – ID & MEPanel PC / POS / IPC Monitor Design capability for Rugged, Industrial Panel PC, POS System & IPC Monitor

  34. Panel PC Product 12” - 15” 8” - 10” Robust Panel PC/POS, Monitor, ARM HCI Mobile handheld for Mission Critical in Military, Medical, Outdoors.

  35. Panel PC Product Panel Size : 17” Maritime Panel PC For Offshore, Cruise, Oil drill platform applications. Use for Sea Map, Navigation Monitors or Bridge Controller display Applications: River Cruise

  36. Sunlight Readable Smart Panel Module

  37. DMS Design – ID Design External HDD Enclosure External HDD Enclosure Multimedia Door Phone Door Phone

  38. DMS Design Capability – ID & MEPanel PC/POS/IPC Monitor Strong R&D experiences to fulfill customize needs

  39. On-going Project – 12” Panel PC (ODM) Delicate experienced R&D center locate in Taiwan System Design Capability: SAVE Manpower resources = SAVE COST • One Stop Service • Design Quality Assurance • Fast and quick response • Testing Labs, Verifications • Tooling Molding benefits • Local supply chain links • One stop manufacturing Changeable Decoration Front Bezel

  40. DMS Design – ID & ME Design Medical Equipment Direct phone in emergency With fingerprint module, control board, batteries, motor and mechanical linkage structure

  41. DMS Design – ID & ME Design Thermostat / LED Bulb LED bulb with heat spreading cooler Thermostat Battery charger Expansion card module

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