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Interleaver Performance Comparison of Winbond and TGn Sync

Interleaver Performance Comparison of Winbond and TGn Sync. (Other documents: 11-04-934/r2, 1026/r0, 1105/r0 ). Jeng-Hong Chen (jhchen2@winbond.com) Pansop Kim (pkim@winbond.com) Winbond Wireless Design Center Torrance, CA, USA September 2004. Simulation Parameters (based on 11a).

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Interleaver Performance Comparison of Winbond and TGn Sync

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  1. Interleaver Performance Comparison of Winbond and TGn Sync (Other documents: 11-04-934/r2, 1026/r0, 1105/r0 ) Jeng-Hong Chen (jhchen2@winbond.com) Pansop Kim (pkim@winbond.com) Winbond Wireless Design Center Torrance, CA, USA September 2004 Jeng-Hong Chen, Pansop Kim, Winbond Electronics

  2. Simulation Parameters (based on 11a) • 2X2, 3X3, 4X4 antennas • IEEE 11n Channel Models B and E • (20MHz) 64-pt FFT (48 data tones) and (40MHz) 128-pt FFT (108 data tones) • 10% PER over 1000 simulated packets • 1000 un-coded bytes per packet • Perfect CSI, Perfect AFC, AGC, ACQ • No pulse shaping filter, no ADC/DAC • CC rates=1/3,1/2, 2/3,3/4,7/8 from ½ CC code (K=7) • 16QAM, 64QAM • 24, 36, 48, 54,63 Mbps per transmit antenna • MMSE Receiver • TX and RX antenna spacing: 0.5 wavelength Jeng-Hong Chen, Pansop Kim, Winbond Electronics

  3. 3D-A vs. TGn Sync in 20MHz BW • 20 MHz (48 data subcarriers) • 3D-A: Ncolumn=16, Nrow=3 subcarriers • TGn Sync Jeng-Hong Chen, Pansop Kim, Winbond Electronics

  4. TGn Sync Interleaver (IEEE 802.11-04/889r0) • Ex. 20 MHz, NBPSC=1, NI=4, NCBPS=48, Ncolumn=16 • Note: NSS=4in the definition of above document. • Adjacent bits (ex. A(0), A(1), …, A(11)) are not evenly distributed over all subcarriers • Adjacent bits (ex. A(3),A(6),A(9),A(12)) are assigned to the same subcarrier. • Winbond proposed 3D Joint Interleaver, NBPSC=1, NI=4, NCBPS=48, Ncolumn=16 Jeng-Hong Chen, Pansop Kim, Winbond Electronics

  5. 3D-A Interleaver v.s. TGn Sync, Channel B, 2x2 • Larger improvement over TGn Sync interleaver especially for more than two Tx. Jeng-Hong Chen, Pansop Kim, Winbond Electronics

  6. 3D-A Interleaver v.s. TGn Sync, Channel B, 3x3 Jeng-Hong Chen, Pansop Kim, Winbond Electronics

  7. 3D-A Interleaver v.s. TGn Sync, Channel B, 4x4 Jeng-Hong Chen, Pansop Kim, Winbond Electronics

  8. 3D-A Interleaver v.s. TGn Sync, Channel E, 2x2 Jeng-Hong Chen, Pansop Kim, Winbond Electronics

  9. 3D-A Interleaver v.s. TGn Sync, Channel E, 3x3 Jeng-Hong Chen, Pansop Kim, Winbond Electronics

  10. 3D-A Interleaver v.s. TGn Sync, Channel E, 4x4 Jeng-Hong Chen, Pansop Kim, Winbond Electronics

  11. 3D-A vs. TGn Sync in 40MHz BW • More performance improvements than those of 20MHz comparisons. • 40 MHz (108 data subcarriers) • 3D-A: Ncolumn=12, Nrow=9 subcarriers • TGn Sync Jeng-Hong Chen, Pansop Kim, Winbond Electronics

  12. 2X2, Channel B Jeng-Hong Chen, Pansop Kim, Winbond Electronics

  13. 3X3, Channel B Jeng-Hong Chen, Pansop Kim, Winbond Electronics

  14. 4X4, Channel B Jeng-Hong Chen, Pansop Kim, Winbond Electronics

  15. 2X2, Channel E Jeng-Hong Chen, Pansop Kim, Winbond Electronics

  16. 3X3, Channel E Jeng-Hong Chen, Pansop Kim, Winbond Electronics

  17. 4X4, Channel E Jeng-Hong Chen, Pansop Kim, Winbond Electronics

  18. The explosive 11n world requires an innovative, systematic structure to explore all available diversities in space, frequency and time—A 3D interleaver fits this purpose in all dimensions!! Jeng-Hong Chen, Pansop Kim, Winbond Electronics

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