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Heat Transfer Analysis of PC Chip Heat Sink Designs

Compare two fin arrays for PC chip cooling using COSMOSWorks 2006. Design A: 6x9 array, Design B: 14x17 array, both 6061 Aluminum. Design B provides better cooling. Conduction coefficient crucial, size not always better.

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Heat Transfer Analysis of PC Chip Heat Sink Designs

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  1. Analysis of PC Chip Heat Sink Design Royce Tatton ME 340 Dr. Solovjov Fall 2006

  2. The Problem • Problem 3.137 in Incropera and DeWitt • Comparison of two fin arrays to be used as PC chip heat sink • Which provides more heat transfer (better cooling)?

  3. The Chip • Material – Ceramic Porcelain • Dimensions – 53 X 57 X 10 mm • Temperature – 75° C Maximum

  4. Design A • Dimensions – 3 X 3 X 30 mm • Number – 6 X 9 array (54 total) • Material – 6061 Aluminum • Convection Coefficient – 125 W/m2K

  5. Design B • Dimensions – 1 X 1 X 7 mm • Number – 14 X 17 array (238 total) • Material – 6061 Aluminum • Convection Coefficient – 375 W/m2K

  6. Methods • Use COSMOSWorks 2006 to determine maximum flux and temperature distribution in Design A and Design B • Compare to analytical results

  7. Setup of Problem • Simplify by reducing to ¼ of the total geometry along symmetry planes • Apply temperature constraints to chip surfaces • Apply convection loads to top chip surface and fins

  8. Results – Design A • Maximum chip temperature of 75°C (348.15 K) • Resultant heat flux of 7.807E+5 W/m2 Temperature Plot Heat Flux Plot

  9. Results – Design B • Maximum chip temperature of 75°C (348.15 K) • Resultant heat flux of 1.002E+6 W/m2 • Design B provides greater cooling of chip Temperature Plot Heat Flux Plot

  10. Conclusions • Design B provides better cooling to the chip • Results agree with the results of the problem in the textbook • Conduction coefficient very significant factor • “Bigger” is not always better

  11. Recommendation • Always perform heat transfer analysis before making decision on intuition • Further analysis with radiation and other materials to find a better fin design

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