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Tensky International Co.,Ltd .

Tensky International Co.,Ltd. Founded ： March.2007 Factory Area ： 370.76m 2 Address ： No.1,Lane 137,Sec 3,Jhongshan RD,Hukou Township,Hsinchu County 303,Taiwan(R.O.C)Office:No.135, Chenggong 2nd St . ,Jhubei City , Hsinchu County 302,Taiwan (R.O.C.). Substrate Materials Wafer Drawing

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Tensky International Co.,Ltd .

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  1. Tensky International Co.,Ltd. Founded：March.2007 Factory Area：370.76m2 Address：No.1,Lane 137,Sec 3,Jhongshan RD,Hukou Township,Hsinchu County 303,Taiwan(R.O.C)Office:No.135, Chenggong 2nd St . ,Jhubei City , Hsinchu County 302,Taiwan (R.O.C.) Substrate Materials Wafer Drawing Metalized Materials/Design

  2. 2007 founded for ceramic parts and process ceramic by CNC. 2009 Cooperate with PCB and semiconductor factory dedicated to apply the thin film & lithography process on Alumina / Aluminium Nitride substrate to make passive and circuit components. With both circuit design and processing capabilities, Tensky can offer OEM/ODM manufacturing service for products with circuits on ceramic substrate. 2010 Building branch office in Shenzhen China. Company advance    POTENT MACHINERY & INDUSTRY CO.,LIMITED(Xiamen)

  3. Tensky International Co.,Ltd. • Tensky was established by a group of engineers with innovative processing on ceramic capability. • Our vision is to be the most advanced manufacturing service • provider on ceramic parts and substrate to designers, and become • the most reliable partner for all customers. • Tensky will strive to provide superior manufacturing service on thin/thick film processing integration for all application fields.

  4. Design Rule of Ceramic Substrate Substrate Materials Wafer Drawing Metalized Materials/Design Tensky International Co.,Ltd.

  5. Substrate Materials

  6. Wafer Drawing

  7. 101.6mm or 114.3 mm 3~5mm 3~5mm 101.6mm or 114.3 mm Patterning available region： 90%~95% for 101.6*101.6 mm or 114.3*114.3 mm Metalized Materials/Design

  8. Metalized Materials

  9. Benchmark of Various Substrate Materials

  10. Compare with Thick & Thin Film Process

  11. Sketch of Produce flow chart

  12. Thermal Shock Test Content

  13. Application of the Manufacturing Process High power LEDceramic substrate Flip chip /eutectic substrate manufacturing HCPV heat-sink of the solar cell Sensor ceramic substrate ESD/EMI protect design Thin film passive/protect devices

  14. Manufacturing technology for ceramic substrate Thin-film deposition technology Photo-lithography technology Electrode/electroless plating technology Micro-pattern design and manufacturing integrated technology

  15. Manufacturing technology (I) Major manufacturing equipment for substrate

  16. Thin Film(DPC) Manufacturing Products

  17. Thanks for Your Attention Tensky International Co.,Ltd. Founded：March.2007 Factory Area：370.76m2 Address：No.1,Lane 137,Sec 3,Jhongshan RD,Hukou Township,Hsinchu County 303,Taiwan(R.O.C)Office:No.135, Chenggong 2nd St . ,Jhubei City , Hsinchu County 302,Taiwan (R.O.C.)

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