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Dicing tape is a backing tape used at some stage in wafer dicing, the cutting apart of pieces of semiconductor material following wafer micro fabrication. The tape holds the pieces of semiconductor, called die, together throughout the cutting process, rising them to a thin metallic frame. Global Dicing Tapes Market was valued US$ ~US$ 889 Mn. in 2019 and is expected to reach US$ ~US$ 1.6 Bn. by 2027, at a CAGR of ~6% during a forecast period.
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