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LBNL CCD Packaging “Yale Mount” Mechanical Analysis. Dan Cheng LBNL. Gold bump (flattened wire bond bump) applied in house. CCD, 200 m m thick. Underfill with Epotek 301-2 glue at 60 o C. 1.4mm thick AlN substrate with 200 m m via’s, not under bumps or CCD. AlN circuits from COORS.

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Presentation Transcript
first guess for snap

Gold bump

(flattened wire bond bump)

applied in house

CCD, 200mm thick

Underfill with Epotek

301-2 glue at 60oC

1.4mm thick AlN substrate

with 200mm via’s, not under bumps or CCD

AlN circuits from

COORS

Gold plated

Invar

Bumps on AlN applied

at 4” wafer size level

then diced

Connector mounted to Invar

with spring loaded pins against AlN

No success yet in wafer scale bump bonds with AlN…

dicing leaves large chips on edges

First Guess for SNAP

Dan Cheng

solid model geometry pro e
Solid Model Geometry (Pro/E)

Rear View

Front View

Dan Cheng

quarter symmetry solid model
Quarter-Symmetry Solid Model

EPO-TEK 301-2

(50 microns thick)

CCD

(200 microns thick)

Substrate

(1.5-mm thick AlN

Or 2-mm thick Si)

EA9361 Epoxy

(250 microns thick)

Molybdenum Base

(~5-mm thick)

Dan Cheng

fea notes
FEA Notes
  • Quarter-symmetry model
    • Approximately 80,000 elements
  • Symmetric boundary constraints
    • X- and Y- symmetry planes fixed, allowed to “slide”
    • Z-symmetry plane about square hole fixed in Z-direction
  • Most material properties are temperature-dependent
    • With the exception of some Young’s Modulus numbers

Dan Cheng

fea assumptions
FEA Assumptions
  • Mounting holes
    • Assumed constraints—see previous slide
  • Did not model Gold/Indium bump bonds

Dan Cheng

fea notes1
FEA Notes
  • Ran four cases
    • Case 1: AlN Substrate, Square hole
    • Case 2: Si Substrate, Square hole
    • Case 3: AlN Substrate, Square hole w/Fillets
    • Case 4: Si Substrate, Square hole w/Fillets

Dan Cheng

fea summary
FEA Summary
  • Some material properties need to be defined at operating temperature (140 K)
  • Current design shows critical Epo-Tek joint at above Yield Stress of 926 psi (may change with model)

Dan Cheng