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GEM and Micromegas production Rui De Oliveira TE/MPE/EM

GEM and Micromegas production Rui De Oliveira TE/MPE/EM. Summary. GEM Single mask process Micromegas Bulk Classical resistive. GEM process step by step. 2 suppliers : Sheldhal (US) Nippon steel ( Jp ). 5um Copper. 50um Polyimide. CR layer 10nm. 5um Copper. Base material

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GEM and Micromegas production Rui De Oliveira TE/MPE/EM

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  1. GEM and Micromegas productionRui De OliveiraTE/MPE/EM Rui De Oliveira

  2. Summary • GEM Single mask process • Micromegas • Bulk • Classical • resistive Rui De Oliveira

  3. GEM process step by step Rui De Oliveira

  4. 2 suppliers : Sheldhal (US) Nippon steel (Jp) 5um Copper 50um Polyimide CR layer 10nm 5um Copper Base material 50um adhesiveless copper clad Polyimide Rolls of 100m x 600mm Polyimide : APICAL NP or AV Rui De Oliveira

  5. Maximum size 100m x 600mm Dupont manual laminators 15um resist 15um resist Photoresist deposition 15um dry resist (KL 1015 – Korea) Rui De Oliveira

  6. 70um 15um resist 15um resist Photoresist holes patterning Rui De Oliveira

  7. Top copper etching Rui De Oliveira

  8. Resist stripping Rui De Oliveira

  9. Polyimide anisotropic etching Rui De Oliveira

  10. Bottom resist protection deposition Rui De Oliveira

  11. Top copper protected by galvanic connection etchant Bottom copper etch by chemical reaction Rui De Oliveira

  12. Resist stripping Rui De Oliveira

  13. Soft Polyimide etching The hole become double conical Rui De Oliveira

  14. cross section pictures Rui De Oliveira

  15. Comparison with std GEM from external supplier Rui De Oliveira

  16. examples Large GEM already produced: ILC Dhcal: 1m x 33cm (5 pieces) Kloe: 750mm x 40cm (30pieces) CMS: 1m x 45cm (40 pieces) Rui De Oliveira

  17. GEM single mask process summary Chemical Polyimide etching Copper electro etching Stripping Second Polyimide etching Reality Rui De Oliveira

  18. Bulk Micromegas BULK Technology DUPONT PC 1025 coverlay BOPP Meshes SERITEC stretching PCB lamination Meshdeposit lamination development

  19. Pad read-out 1cm², thickness 8mm for ILC Hadronic calorimetry • Tested in the RD51 1 kHz beam. • The BULK is made on a populated PCB • Pad read-out large TPC • Neutrino detector • 10 sqr meter in service T2K experiment Japan (CEA Saclay) Bulk Micromegas ILC DHCAL first m2 LAPP Annecy 19

  20. Resistive Bulk MicroMegas

  21. Screen printing of for the resistive strips -Not compatible with pitches smaller than 0.4mm -Thixotropic paste PCB PCB PCB

  22. Bulking Double sided Board Resistive strip deposit Closing Test before closing

  23. Classical MicroMegas resistive or not 1 x 1m2 not to scale detector opened Stiffening panel Drift electrode Pillars (128 µm) PCB2 PCB1 Rohacell Aluminum support plate

  24. 1 x 1m2 not to scale detector closed Stiffening panel 5.00 Aluminum support plate PCB2 PCB1 Rohacell

  25. flat gluing < 10um error Mesh on drift (10Ncm ) Flat board < 30um error

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