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btechcorp

May 2008. Product Concept. High conductivity fibers run through thickness of a film adhesive with precision orientationcontinuous path avoids particle-to-particle contact problem of filled adhesiveswide range of fibers and thermoplastic matricescarbon fibers, metallic coated and pure metal fibers (5 to 25

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btechcorp

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    1. May 2008 btechcorp Highly Electrically and Thermally Conductive Z-axis Film Adhesives www.btechcorp.com Longmont, CO Brentwood, TN

    2. May 2008

    3. May 2008 Combined Electrically and Thermally Conductive ACF Adhesives 8µ diameter pure nickel fibers - Bekaert (Belgium) - 4µ diameter process capability Instant “cure” hot melt thermoplastic 125°C to 200°C bonding temperature options 90°C to 160°C continuous operating capability

    4. May 2008 Combined Electrically and Thermally Conductive ACF Adhesives (cont’d) Medium pitch density.…NTP series - uncoated pure nickel fibers - continuous process, <30% cost of high pitch version High pitch density….TP series heat treat Ni fibers in oxygen/argon to grow ¼ µ thick green nickel oxide coating (NiO) >20 mega-ohm resistance on 30µ comb pattern 11µ pitch capability

    5. May 2008 NTP Series Product Requirements Z-axis electrical resistivity ~0 µ-ohm (1.0 cm2) < 200 micron pitch with high X-Y resistance Thermal conductivity 5 W/m°K (bonded joint) better than highly filled silver epoxies Mechanical properties Very flexible: < 0.06 GPa modulus, 77°K capability easy rework with solvent (IPA) or heat high lap shear and peel strength

    6. May 2008 NTP Series Product Options NTP-1: bond 125°C, operating limit 90°C NTP-2: bond 150°C, operating limit 130°C NTP-3: bond 200°C, operating limit 160°C

    7. May 2008 Huge NTP Series Market Volume Solar panel Z-axis interconnect Large area (> 2 cm2) lead free solder Low cost microwave PCB packaging Low cost silver filled epoxy replacement New long life batteries Low cost PET substrate circuit lamination

    8. May 2008 TP Series40% Nickel Fiber Volume with Oxide Coating (>20 mega-ohm, 30µ pitch)

    9. May 2008 TP Series Product Requirements Z-axis electrical resistivity ~0 µ-ohm (1.0 cm2) X-Y electrical resistivity >20 megaohm, 30 µ pitch Thermal conductivity 5 W/m°K (bonded joint) better than highly filled silver epoxies Mechanical properties Very flexible: 0.06 GPa modulus, 77°K capability easy rework with solvent (IPA) or heat high lap shear and peel strength

    10. May 2008 TP Series Product Options TP-1: bond 125°C, operating limit 90°C TP-2: bond 150°C, operating limit 130°C TP-3: bond 200°C, operating limit 160°C

    11. May 2008 TP Series Applications Fine pitch BGA and flip chip packages Flex circuit Z-axis interconnect Advanced fine pitch displays (11µ pitch) LCD assemblies replace current Z-axis adhesives RFID tags

    12. May 2008 Significant Cost Savings for Flip Chips Eliminates need for wafer bumping and underfill >65% cost savings for comm’l applications Can be laminated to wafer before dicing or applied to component prior to assembly disk drive: pre-applied to flex circuit RFID tag: laminated to wafer Low pressure bonding 50 psi vs. >400 psi for current Z-axis adhesives

    13. May 2008 Numerous Devices Tested MEMS cell phone microphone Flex circuits RF amp large area solder bond replacement LED wire bond replacement (1mm2) 80% cheaper than flip chip High density, hybridized CMOS imaging 14,400 pixels, 100 µ2 each Imperium (MD) ultrasound imaging

    14. May 2008 Prototype LED with Flip Chip Packaging500 mA, 6V

    15. May 2008 Large TP Series Market Potential LCD assembly current ACF adhesive sales $500 mil /yr our ACF >50% cheaper, 50 psi vs. >400 psi bonding, 11µ vs. >75µ pitch Flip chip packaging fastest growing, 7 billion devices/yr = 450k m2 adhesive opportunity 3-4x larger than LCD market

    16. May 2008 Ready for High Volume Applications TP Series: production facilities in place Much cheaper, more conductive than older technology ACF NTP Series: high volume (>1 million ft2) facilities in place Continuous prepreg supplier….Patz Materials & Technology, Benicia, CA <30% of TP Series cost Cost effective for large area solder preforms

    17. May 2008 Patz Continuous Thermoplastic Prepreg Facility

    18. May 2008 HM-2 Thermoplastic Thermally Conductive Adhesive 40% volume vapor grown carbon fibers

    19. May 2008 HM-2 Thermoplastic Thermally Conductive Adhesive 0.07 °C-sq. cm/W Z-axis thermal resistance -50°C to +160°C operating range Special high temperature thermoplastic for automotive electronics 3000 thermal cycles 1000 hours total at +150°C

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