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The initial production lots involving the semi-additive method for Cu-based photo printing have been completed, revealing numerous shorts. The collaboration between Print Denshi and Taiyo Kogyo aims to optimize etching conditions, particularly through the use of additive photoresist methods. A significant meeting with KEK's electronics group addressed these challenges. Key issues such as insufficient DFR removal and thick plating have been identified. Ongoing tests are planned to refine plating thickness and improve yield. The effort demonstrates systematic approaches to enhance the etching process and minimize defects in the final product.
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FLEX status • SVD2.5 FLEX for APV25 • Print denshi • The first lots were made at the end of Dec. • Many shorts ->the are trying to optimize etching condition • New company and method Taiyo kogyo (Wakayama) • Size of Company > Print denshi • Test has been done • Semi-Additive method • Meeting at KEK on Dec 21,2005 • With KEK electronics group and Rin-ei company.
Additive method Photo resist • Good way to make precise pattern • Few company are available Cu base Photo print plating Soft etching
Results • They tried to optimize many conditions • Photomask print • Plating (building lines) • Washing to removing DFR (dry film resist) • Soft etching • Results • Many shorts…
Resistance measurement • Line resistance • ~6cm => ~10W (t=10~15mm, enough small) Shortest line
Summary • With Taiyo company (Their work is more systematic comparing with Print-denshi) • As First lot • Many shorts occurred • Reason • DFR (dry file resist) remained • Too thick plating • I can’t conclude which method are better as of now • They propose to do more test without additional payment • Much depend on Photo-resist condition • Glass mask? • Optimize plating thickness • End of January? • Print Denshi (etching method) • The first lot for APV • Many shorts • Trying again • I have not receive any sample yet • I am pushing them
Additive method Photo resist Cu base Photo print plating Soft etching