CAM-I Scalable Flexible Manufacturing Initiative

1. CAM-I Scalable Flexible Manufacturing Initiative NGMS Task 6.1

2. Vision • Our vision is E-manufacturing where we have • Seamless, scalable and robust evolution of products from design to manufacturing (and possibly to delivery and service) • Computer tools (such as simulators, rule-bases, visualizing environments) to rapidly plan, validate and deploy manufacturing instructions • Flexible manufacturing systems for simultaneous production of multiple products and minimum system change over

3. Broad Goals • Manufacturing evaluation and deployment of emerging standards (STEP 203 and 210, possibly 220) • Development of environments for manufacturability analysis of designs • Manufacturing process planning and simulation environments • Simulation and control for flexible manufacturing of board assemblies

4. Immediate Goals • Implementation of visualization and translation tools for STEP AP210 (Generate 3-D models of assembly from AP210 descriptions) • Computer implementation of Rockwell’s DFM rule base to function with AP210 description of boards • Simulators for placement processes and machines (HSP and GSM simulators) • Development of capabilities to ‘virtually’ produce a board (AP210 ‘as produced’ view of board assembly) • Generation of (HSP) machine input files from AP210 model

5. Present flow Design Release Physical Constraints and Functions Design and Drafting MFG. Review (DFM Checks) Trial&Error Production

6. Physical Constraints and Functions Engineering Design Computer Integrated Manufacturing Design For Manufacturing Virtual Environment Enterprise Resource Planning Optel - Manufacturing Execution System Design Release Production Proposed Flow

7. Rules Designs Resources Rule Inference Engines Manufacturing Execution Systems Simulator Process Planners Visualizers Process Plans Manufacturing Analysis Virtual Products Machine Programs Virtual Environment

8. Interconnect Assembly Printed Circuit Assemblies Product Enclosure Printed Circuit Substrate Die Packaged Part Package Externally Visible Connectors Die

9. Typical 2-D design of a PCB

10. PCB Manufacturing Process

11. Why STEP? • Emerging standard • Million seats of AP-203 presently deployed • Simulation tool to be used across manufacturing facilities and vendors • e-manufacturing • E-Business applications of STEP are being enabled by the STEP and W3C committees working together.

12. What is STEP? • ISO standard (ISO 10303): • to share and exchange digital technical information • Set of common data structures • Application Protocols - Domain specific usage of data structures • AP 203 (3D solid Models)

13. AP210: Electronic Assembly,Interconnect and Packaging Design Product Structure/ Part Connectivity • Functionality • Analysis Support • Shape 2D, 3D • Package • Material Product • Properties • Functional • Packaged Physical • Component Placement • Bare Board Design • Layout templates • Layers non-planar, • conductive & non-conductive • Material product Configuration Mgmt • Identification • Authority • Effectivity • Control • Requirement Traceability • Analytical Model • Document References Geometry • Geometrically Bounded 2-D • Wireframe with Topology • Surfaces • Advanced BREP Solids • Constructive Solid Geometry Requirements • Design • Allocation • Constraints • Interface • Rules Design Control Technology • Geometric Dimensioning and Tolerancing • Fabrication Design Rules • Product Design Rules

14. AP 210 • Several product models in electromechanical domain. • Supports Multidisciplinary library data. • Scope is “as required” & “as designed” product information. • Sharing across several levels of supply base. • Ability to Integrate with other engineering domains. • Ability to integrate external services coherently.

15. Machine library Flow Diagram Assembly configuration file Placement Sequence (OPTEL) AP 210 file (2D) AP 210 file (3D) Visualizer (STEP OIV) Simulator Design Facts DFM Rule Checker DFM Rule files

16. 2D to 3D converter • ECAD translators generate AP 210 files containing 2D Geometry • Simulate 3D view of the assembly board • Converter • Input : AP 210 file (2D geometry) • Extrudes them into solids (Advanced BREP) • Output: • AP 210 file (2D + 3D geometry) • AP 203 files

17. 2D to 3D converter • Ap203 files • Individual packages • Board • These files then converted into Open Inventor format • Inventor: Graphics package used for rendering

18. Typical 2-D design of a PCB

19. AP-210 Viewer

20. Schema User Interface Rule Execution Software Rule Definition Software DFM • We are adapting a system originally developed by Boeing for use at Rockwell • Developed on PreAMP and TIGER project. • RDF syntax • Inputs • AP-210 Design File • Rule Files • Configuration Management

21. DFM Rule Facility • Subset of Rockwell Collins DFM rules were chosen for implementation. • Relevant facts extracted from the AP-210 file during preprocessing. • Rule Inference engine insulated from intricacies of STEP • Different facilities can easily plug in their DFM modules. • Interface to the simulator • DFM rules which were violated • Components which violated these rules.

22. Assembly Data • Establish an assembly usage view • Components • Organization by package / part family • Part numbers, version • Configuration management data • Location, orientation • Reference Designators • Integrated with OPTEL • Magazine Setup • Optimized placement sequence

23. 210 / 203 translator Electrical Domain Mechanical Domain

24. DFM Rule Check Feeder information Virtual Board Placement Simulator Component information Components violating DFM rules Placement Sequence Geometric Models Simulator

25. Simulator • Configurable • Kinematics – accepts a mechanism graph • Graphics – Geometric Models of machine components • Next steps • Machine Library • Adding functionality • Nozzle compatibility • Placement timing

26. Process Planning Year 1 • STEP Basics • Machine Simulator • DFM Checking Production & Setup Planning Year 2 • Process Planning Modules • Development of SFM Controller • Capacity Planning & Simulation Shop Floor Controller Year 3 • Standardization • Deployment • Process Simulation Project timeline

27. Work done • Accepting an AP210 2D design file • Manufacturability analysis • Extracting component information • Generating 3D models of components and assemblies • Simulation using Universal HSP and GSM • Generating • “as designed” view • “as simulated” view

28. Work done (cont.) • Simulation • Double sided boards • Multi Panel Boards • GSM • Multiple stage simulation • Testing • Update of DFM Rules • Development of ‘Fact Extraction’ software • AP210 Viewer • Full 3-D assembly model of board • Association between Graphical entities and AP210 entities • Ability to display properties

29. Future Work • DFT • Bare Board testing • In-circuit test: fixtures for the test • Manufacturing systems planning • Generating stencils for printed circuit substrates • Explore transition from Line concept to Cell concept • Capacity planning and simulation • Describing production facilities (AP-220) • Deployment