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Explore the requirements, functions, components, and performance of the UCSB PortCard and DOIM designed by Sasha Pronko for the Silicon Workshop II, highlighting radiation hardness, location, and tests. The DOIM converts electrical signals to optical for data transfer.
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PORTCARDs & DOIMs Sasha Pronko Fermilab Sasha Pronko, Silicon Workshop II, UCSB
PortCard & DOIM: what & where? Sasha Pronko, Silicon Workshop II, UCSB
PortCart requirements • Low mass & size • High radiation dose • Reliability • High heat transfer capability • Remote control and data transmission • Low noise regulated voltage • Detector grounding strategy Sasha Pronko, Silicon Workshop II, UCSB
PortCard functions • Powers, initializes, controls and read out chips • Connects to SVX3 chips by High Density Interconnects (HDI) • Power for analog section of chips • Calibration voltages for z & sides • Interface with FIB • Forwards L1A accept to chips • Buffers FECLK & BECLK • Forwards data to FIB Sasha Pronko, Silicon Workshop II, UCSB
Data & OBVD to FIB HDI’s to ladders Power/commands from JC/FIB PortCard basics • PC—beryllia based multi-chip module • One PC per wedge: • SVX: 72 PC’s; ISL: 30 PC’s; L00: 12 PC’s Sasha Pronko, Silicon Workshop II, UCSB
PortCard components • Per PC • 1 Transceiver • Per Ladder • 1 analog DDR; • 1 digital DDR; • 2 ELCO’s; • 2 JFET’s; • NPN • DOIM DDR — Digital to Analog Converter/Decoder/ Regulator chip Sasha Pronko, Silicon Workshop II, UCSB
PortCard: Digital section • 11 Commands & CLKs • 53 MHz clock • Beam X-ing clock • L1A signal • etc. (SVX3D by Ankush) • DVDD power supplies • Data transmission • DOIM • Components • Transceiver • Receives FIB commands & CLKs, transforms them into single-ended signals • digital DDR • Decoder • Buffers CLKs Sasha Pronko, Silicon Workshop II, UCSB
PortCard: Analog section • Voltages • AVDD to FE • Bias to sensors • Components • Analog DDR • FE voltage regulation • DAC-calibration voltage • JFET & NPN transistors Sasha Pronko, Silicon Workshop II, UCSB
PortCard location L00 & ISL PC’s are in the same place Sasha Pronko, Silicon Workshop II, UCSB
PortCard location, continued • PC need to be cooled Sasha Pronko, Silicon Workshop II, UCSB
PortCard: Performance stability & Radiation hardness • Performance • Noise SSDDAQ Noise SSDPCDAQ • Radiation hardness • Rick Tesarek says (Run2 measurement) that ionizing doze for SVX PC is 20 krad/fb-1 (~10% error) • ~80-160 krad in Run2 (4-8 fb-1) • PC designed hardness is ~200 krad • L00 bias issues • Degradation of dielectric possible problems with HV bias (specification is ~200V, L00 may need to be biased up to much higher voltages) Sasha Pronko, Silicon Workshop II, UCSB
PortCard: Radiation Hardness Tests • Radiation hardness tests with 63 MeV protons (UC Davis) and 8 GeV protons (Fermilab) • 2 PC’s irradiated: 200 krad & 400 krad • 400 krad PC was used for long term reliability testing with resistive loads • No failure after 3 months • No change in TX & DDR current draws • No change in DDR DAC calibration voltage slope change • No shift in pedestals; no change in noise • JFET & NPN irradiated by ~500 krad • No problems with analog voltage regulation observed • PC’s should withstand the radiation dose expected for Run 2 Sasha Pronko, Silicon Workshop II, UCSB
DOIM basics • DOIM — Dense Optical Interface Module • Converts electrical signal from SVX chip into optical signal (interface between chip & FIB) • 53 Mbyte/sec/DOIM data transfer rate; • 8 bits & OBVD; bit error rate <10-12 at 63 MHz • 3 major components: transmitter (TX), 22m fiber, receiver (RX) • 1 DOIM per ladder • Radiation tolerance up to 200 krad Sasha Pronko, Silicon Workshop II, UCSB
DOIM: component location • TX on PC (5 TXs per PC in SVX) • 10 RX (2 wedges) on Fiber Transition Module (FTM) Sasha Pronko, Silicon Workshop II, UCSB
DOIM: TX • TX — InGaAsP edge emitting laser diode array • 12 channel (9 used); 250m pitch matches fiber • Power supply: VCC-VLD • VCC=5V & VLD adjustable • current: 20 mA/ch at 3V; slope ~2mA/0.1V • Differential amplifier is sensitive up to 10mV • Light output: 1 mW/ch @20mA • Light cone: uniformity in far field angle affects light coupling (~400 W span) Sasha Pronko, Silicon Workshop II, UCSB
DOIM: RX • RX — InGaAs/InP PIN-diode array • 12 channels (9 used) • Power supply: VCC=5V • Optical input converted to current pulse to receiver chip Sasha Pronko, Silicon Workshop II, UCSB
Digital 1 = Digital 0 = Digital 1 = Digital 0 = We have bit stuck low or bit stuck high errors if these characteristics are out of range DOIM: TX & RX characteristics Sasha Pronko, Silicon Workshop II, UCSB
DOIM: OBVD & 8 bits • OBVD & 8 bits — SVX chip (Ankush’s talk) • Example of TX output Sasha Pronko, Silicon Workshop II, UCSB
DOIM: Temperature sensitivity • TX is sensitive to temperature (not an issue for RX) • RX designed to operate at 40-60% duty cycle Sasha Pronko, Silicon Workshop II, UCSB
DOIM: Radiation Hardness of RX • Beam tests with protons: 200krad & 400krad • Linear dependence to dose • Ratio of light drop independent on light power • Degradation is <10% per 200 krad Sasha Pronko, Silicon Workshop II, UCSB
Summary • PC’s & DOIM’s provide an interface between sensors/chips and PS, DAQ • PC’s performance is stable respect to radiation dose expected for Run2 • DOIM • TX sensitive to temperature • 10% degradation per 200 krad — it should be enough for Run2 • RX sensitive to duty cycle • Sources of info: • cdf5535, cdf3865, cdf6497, cdf7281, ESE-SVX980318, old talks, TDR Sasha Pronko, Silicon Workshop II, UCSB
